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SMD Inductors(Coils)
For Power Line(Multilayer, Magnetic Shielded)
MLZ Series MLZ2012
The MLZ Series is a new line of laminated choke coils for decou-
pling with the industry’s best DC superimposition characteristics
and lowest DC resistance
∗
. TDK has developed this coil using its
proprietary ferrite material technique and dense electrodes.
The MLZ Series exerts an excellent effect mainly on the decou-
pling of power circuits. It also exerts an effect on audio lines
because of its low DC resistance.
The DC superimposition characteristics of the MLZ2012-W Series
(IDC UP type) have been improved by up to 250% in comparison
with those of other existing products. New addition of 22 and 47μH
products has satisfied more needs: low through to high frequency
ranges are supported.
∗
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLZ
(1)
2012
(2)
A 1R0 M T
(3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
2012
2.0× 1.25mm
(3) Material code
(4) Inductance value
R10
1R0
100
0.1μH
1.0
μH
10.0
μH
The MLZ Series was regarded as having the industry’ s best DC
superimposition characteristics and lowest DC resistance according to
research conducted in September 2009.
FEATURES
• The IDC UP type is a line of products with the industry’s best DC
superimposition characteristics.
• High-inductance(22 and 47μH products have been introduced).
• Thanks to a broad inductance range (0.1 to 47μH), wide-ranging
needs (from low through to high frequency ranges) can be
satisfied.
APPLICATIONS
Modules such as digital cellular phone and camera module, Net-
books, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C
(5) Management symbol
M
W
STD
IDC-UP
(6) Packaging style
T
Taping [reel]
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Thickness T(mm)
0.85
1.25
Quantity
4000 pieces/reel
2000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
2.0±0.2
0.8
1.25±0.2
1.0
0.8
1.2
0.5±0.3
0.5±0.3
Dimensions in mm
T(Thickness)
0.85±0.2
1.25±0.2
Weight(mg)
10
14
ELECTRICAL CHARACTERISTICS
Classification Part No.
High
frequency
supported
MLZ2012DR10MT
MLZ2012DR22MT
MLZ2012DR47MT
MLZ2012A1R0MT
MLZ2012A2R2MT
MLZ2012E4R7MT
MLZ2012E100MT
MLZ2012A1R0WT
MLZ2012A2R2WT
MLZ2012M4R7WT
MLZ2012M100WT
MLZ2012M220WT
MLZ2012M470WT
Inductance
(µH)
0.10
0.22
0.47
1.0
2.2
4.7
10.0
1.0
2.2
4.7
10.0
22
47
Inductance
tolerance
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
Self-resonant
Thickness Test frequency Test current
frequency
(mm)
L (MHz)
L (mA)
(MHz)typ.
0.85
25
1.0
500
0.85
25
1.0
330
1.25
25
1.0
230
0.85
10
1.0
160
0.85
10
1.0
120
0.85
2
0.1
70
1.25
2
0.1
50
0.85
10
1.0
160
0.85
10
1.0
120
0.85
2
0.1
70
1.25
2
0.1
50
1.25
2
0.1
35
1.25
2
0.1
20
DC resistance Rated current
(Ω)±30%
(mA)
0.07
0.13
0.18
0.12
0.20
0.30
0.40
0.10
0.15
0.30
0.47
2.2
4.3
1000
800
550
220
160
80
60
280
210
180
150
60
50
STD
IDC-UP
• Test equipment
Inductance: Ag4294A-16034G
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
1000
100
Inductance(
μ
H)
T
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
100000
M470W
10000
Impedance(
Ω
)
M470W
10
E100M/M100W
1000
100
10
DR10M
1
E100M/M100W
A2R2M/A2R2W
DR47M
1000
1 A2R2M/A2R2W
DR47M
0.1
DR10M
1
10
100
Frequency (MHz)
1000
0.01
1
10
100
Frequency (MHz)
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
100
M470W
TEMPERATURE CHARACTERISTICS
60
50
Temperature(˚C)
M100W
E100M
10
Inductance(
μ
H)
M100W
E100M
A2R2W
40
A2R2M
30
20
10
M470W
A2R2W
DR47M
1
A2R2M
DR47M
0.1
DR10M
0
0
200
400
600
DC current(mA)
DR10M
800
1000
0.01
1
10
100
DC current(mA)
1000
• All specifications are subject to change without notice.
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PACKAGING STYLES
REEL DIMENSIONS
1.0
2.0±0.5
ø13±0.2
ø21±0.8
ø180±2.0
8.4
+2.0
–0.0
14.4max.
ø60min.
Dimensions in mm
TAPE DIMENSIONS
t=0.85mm
Sprocket hole
1.5
+0.1
–0.0
Cavity
1.75±0.1
2.3±0.2
Cavity
1.75±0.1
300min.
Dimensions in mm
2.3±0.2
3.5±0.05
3.5±0.05
8.0±0.3
0.3max.
1.5±0.2
4.0±0.1
2.0±0.05
160min.
Taping
200min.
4.0±0.1
Drawing direction
8.0±0.3
1.1max.
1.5±0.2
4.0±0.1
2.0±0.05
4.0±0.1
t=1.25mm
1.5max.
Sprocket hole
1.5
+0.1
–0.0
0.5min.
• All specifications are subject to change without notice.
005-02 / 20090921 / e533_mlz2012.fm
