Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width
≤
300
ms,
Duty Cycle
≤
2.0%.
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2
MMBTA63LT1G, MMBTA64LT1G, SMMBTA64LT1G
200
hFE , DC CURRENT GAIN (X1.0 K)
100
70
50
30
20
10
7.0
5.0
3.0
2.0
-0.3
-10 V
25°C
V
CE
= -2.0 V
-5.0 V
T
A
= 125°C
-55°C
-0.5
-0.7
-1.0
-2.0
-3.0
-5.0
-7.0
-10
-20
-30
-50
-70
-100
-200
-300
I
C
, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
-2.0
T
A
= 25°C
-1.6
V, VOLTAGE (VOLTS)
V
BE(sat)
@ I
C
/I
B
= 100
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
-2.0
T
A
= 25°C
-1.8
-1.6
-1.4
-1.2
-1.0
-0.8
-0.6
-0.1-0.2 -0.5 -1 -2
-5 -10 -20 -50 -100-200-500 -1K-2K -5K-10K
I
B
, BASE CURRENT (mA)
I
C
= -10 mA -50 mA -100 mA -175 mA
-300 mA
-1.2
V
BE(on)
@ V
CE
= -5.0 V
-0.8
V
CE(sat)
@ I
C
/I
B
= 1000
I
C
/I
B
= 100
-0.4
0
-0.3 -0.5
-1.0
-2 -3 -5
-10 -20 -30 -50
I
C
, COLLECTOR CURRENT (mA)
-100 -200 -300
Figure 3. “On” Voltage
Figure 2. Collector Saturation Region
10
|h FE |, HIGH FREQUENCY CURRENT GAIN
V
CE
= -5.0 V
f = 100 MHz
T
A
= 25°C
1
I
C
, COLLECTOR CURRENT (A)
1 ms
10 ms
4.0
3.0
2.0
1.0
0.4
0.2
0.1
100 ms
1s
0.01
Single Pulse Test
@ T
A
= 25°C
0.001
0.01
Thermal Limit
0.1
-1.0 -2.0
-5.0
-10
-20
-50
-100 -200
-500
-1K
I
C
, COLLECTOR CURRENT (mA)
1.0
10
0.1
V
CE
, COLLECTOR-EMITTER VOLTAGE (V)
100
Figure 4. High Frequency Current Gain
Figure 5. Safe Operating Area
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3
MMBTA63LT1G, MMBTA64LT1G, SMMBTA64LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
3X
b
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
°
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10
°
e
TOP VIEW
L1
VIEW C
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
3X
0.90
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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