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MMBZ5250B-7-F

Zener Diodes 350MW 20V

器件类别:分立半导体    二极管   

厂商名称:Diodes Incorporated

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Diodes Incorporated
包装说明
R-PDSO-G3
针数
3
Reach Compliance Code
compliant
ECCN代码
EAR99
Factory Lead Time
19 weeks
Is Samacsys
N
其他特性
HIGH RELIABILITY
配置
SINGLE
二极管元件材料
SILICON
二极管类型
ZENER DIODE
最大动态阻抗
25 Ω
JESD-30 代码
R-PDSO-G3
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
3
最高工作温度
150 °C
最低工作温度
-65 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
极性
UNIDIRECTIONAL
最大功率耗散
0.35 W
认证状态
Not Qualified
标称参考电压
20 V
表面贴装
YES
技术
ZENER
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
40
最大电压容差
5%
工作测试电流
6.2 mA
Base Number Matches
1
文档预览
MMBZ5221B - MMBZ5259B
350mW SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
350mW Power Dissipation on FR-4 PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
e3
Weight: 0.008 grams (Approximate)
SOT23
Top View
Device Schematic
Ordering Information
(Notes 5 & 6)
Device
(Type Number)-7-F*
(Type Number)Q-7-F* (Note 7)
(Type Number)-13-F*
(Type Number)Q-13-F* (Note 7)
Notes:
Qualification
Commercial
Automotive
Commercial
Automotive
Packaging
SOT23
SOT23
SOT23
SOT23
Shipping
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
* Add “-7-F” to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234B-7-F.
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. For Packaging Details, go to our website at http://www.diodes.com.
6. Selected voltages are available on 13" reels (10,000 devices per reel). Add “-13-F” to the appropriate type number in Electrical Characteristics Table from
Page 2. Example: 6.2V Zener = MMBZ5234B-13-F. Please contact your Diodes Inc. sales representative for availability.
7. Automotive products are AEC-Q10x qualified and are PPAP capable. Automotive, AEC-Q10x and standard products are and thermally the same, except
where specified. For more information, please refer to https://www.diodes.com/quality/product-compliance-definitions/.
Marking Information
Kxx
K = SAT (Shanghai Assembly / Test site)
xx = Product Type Marking Code
See Electrical Characteristics Table
YM = Date Code Marking
Y = Year (ex: F = 2018)
M = Month (ex: 9 = September)
Cxx
C = CAT (Chengdu Assembly / Test site)
xx = Product Type Marking Code
See Electrical Characteristics Table
YM = Date Code Marking
Y = Year (ex: F = 2018)
M = Month (ex: 9 = September)
YM
Date Code Key
Year
Code
Month
Code
Jan
1
YM
2012
Z
Feb
2
2013
A
Mar
3
2014
B
Apr
4
2015
C
May
5
2016
D
Jun
6
2017
E
Jul
7
2018
F
Aug
8
Sep
9
2021
I
Oct
O
2022
J
Nov
N
2023
K
Dec
D
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 24 - 2
1 of 5
www.diodes.com
February 2018
© Diodes Incorporated
MMBZ5221B - MMBZ5259B
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Forward Voltage
Characteristic
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 8)
Thermal Resistance, Junction to Ambient Air (Note 8)
Operating and Storage Temperature Range
Note:
Symbol
P
D
R
θJA
T
J,
T
STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
8. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com.
Electrical Characteristics
Type
Number
Type
Code
(@T
A
= +25°C, unless otherwise specified.)
Zener Voltage Range (Note 9)
V
Z
@ I
ZT
I
ZT
Max (V)
2.52
2.63
2.84
3.15
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.30
6.51
7.14
7.88
8.61
9.14
9.56
10.50
11.55
12.60
13.65
14.70
15.75
16.80
18.90
21.00
23.10
25.20
28.35
29.40
31.50
34.65
37.80
40.95
mA
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
9.0
8.5
7.8
7.0
6.2
5.6
5.2
5.0
4.5
4.2
3.8
3.4
3.2
Maximum Zener
Impedance
f = 1kHz
Z
ZK
@ I
ZK
Z
ZT
@ I
ZT
= 0.25mA
30
1,200
30
1,200
30
1,300
30
1,600
28
1,600
24
1,700
23
1,900
22
2,000
19
1,900
17
1,600
11
1,600
7
1,600
7
1,000
5
750
6
500
8
500
8
600
10
600
17
600
22
600
30
600
13
600
15
600
16
600
17
600
21
600
25
600
29
600
33
600
41
600
44
600
49
600
58
700
70
700
80
800
Maximum Reverse
Leakage Current (Note 9)
I
R
µA
100
100
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
@ V
R
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
3.5
4.0
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
10
11
12
14
15
17
18
21
21
23
25
27
30
MMBZ5221B
MMBZ5222B
MMBZ5223B
MMBZ5225B
MMBZ5226B
MMBZ5227B
MMBZ5228B
MMBZ5229B
MMBZ5230B
MMBZ5231B
MMBZ5232B
MMBZ5233B
MMBZ5234B
MMBZ5235B
MMBZ5236B
MMBZ5237B
MMBZ5238B
MMBZ5239B
MMBZ5240B
MMBZ5241B
MMBZ5242B
MMBZ5243B
MMBZ5244B
MMBZ5245B
MMBZ5246B
MMBZ5248B
MMBZ5250B
MMBZ5251B
MMBZ5252B
MMBZ5254B
MMBZ5255B
MMBZ5256B
MMBZ5257B
MMBZ5258B
MMBZ5259B
Note:
C1
C2
C3
C5
G1
G2
G3
G4
G5
E1
E2
E3
E4
E5
F1
F2
F3
F4
F5
H1
H2
H3
H4
H5
J1
J3
J5
K1
K2
K4
K5
M1
M2
M3
M4
Nom (V)
2.4
2.5
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.0
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
14
15
16
18
20
22
24
27
28
30
33
36
39
Min (V)
2.28
2.38
2.57
2.85
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.70
5.89
6.46
7.13
7.79
8.27
8.65
9.50
10.45
11.40
12.35
13.30
14.25
15.20
17.10
19.00
20.90
22.80
25.65
26.60
28.50
31.35
34.20
37.05
9. Short duration pulse test used to minimize self-heating effect.
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 24 - 2
2 of 5
www.diodes.com
February 2018
© Diodes Incorporated
MMBZ5221B - MMBZ5259B
0.4
50
P
D
, POWER DISSIPATION (W)
Note 7
Note 8
I
Z
, ZENER CURRENT (mA)
150
0.3
40
30
0.2
20
0.1
10
0
0
75
25
50
100
125
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
T
j
= 25°C
0
0
3
4
5
6
8
9 10
7
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
T
J
= 25 °C
f = 1MHz
1
2
30
10
12
1,000
I
Z
, ZENER CURRENT (mA)
20
Test current I
Z
15
Nominal Zener Voltage
C
T
, TOTAL CAPACITANCE (pF)
18
100
V
R
= 1V
10
22
27
33
36
39
V
R
= 2V
0
10
0
10
20
30
40
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
10
100
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage
1
1,000
Z
Z
, ZENER IMPEDANCE (
)
100
10
1
1
10
100
V
Z
, ZENER VOLTAGE (V)
Fig. 5 Typical Zener Impedance Characteristics
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 24 - 2
3 of 5
www.diodes.com
February 2018
© Diodes Incorporated
MMBZ5221B - MMBZ5259B
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
All 7°
GAUGE PLANE
0.25
H
J
K1
K
a
A
M
L
L1
C
B
D
F
G
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
--
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
Y
Y1
C
Dimensions
C
X
X1
Y
Y1
Value (in mm)
2.0
0.8
1.35
0.9
2.9
X
X1
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 24 - 2
4 of 5
www.diodes.com
February 2018
© Diodes Incorporated
MMBZ5221B - MMBZ5259B
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
www.diodes.com
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 24 - 2
5 of 5
www.diodes.com
February 2018
© Diodes Incorporated
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