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MPC8260ACZUPJD

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,480PIN,PLASTIC

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
包装说明
BGA, BGA480,29X29,50
Reach Compliance Code
unknown
位大小
32
JESD-30 代码
S-PBGA-B480
端子数量
480
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA480,29X29,50
封装形状
SQUARE
封装形式
GRID ARRAY
电源
2,3.3 V
认证状态
Not Qualified
速度
300 MHz
表面贴装
YES
技术
CMOS
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
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Technical Data
MPC8260AEC/D
Rev. 0.9 8/2003
MPC826xA (HiP4) Family
Hardware Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for .25
µ
m (HiP4) devices in the
PowerQUICC II™ MPC8260 communications processor family. These devices include the
MPC8260, the MPC8255, the MPC8264, the MPC8265, and the MPC8266. Throughout this
document, these devices are collectively referred to as the MPC826xA.
The following topics are addressed:
Topic
Section 1.1, “Features”
Section 1.2, “Electrical and Thermal Characteristics”
Section 1.2.1, “DC Electrical Characteristics”
Section 1.2.2, “Thermal Characteristics”
Section 1.2.3, “Power Considerations”
Section 1.2.4, “AC Electrical Characteristics”
Section 1.3, “Clock Configuration Modes”
Section 1.3.1, “Local Bus Mode”
Section 1.3.2, “PCI Mode”
Section 1.4, “Pinout”
Section 1.5, “Package Description”
Section 1.6, “Ordering Information”
Page
2
6
7
11
11
12
20
20
23
29
43
45
NOTE: Document Revision History
Changes to this document are summarized in Table 22 on
page 45.
Features
Figure 1 shows the block diagram for the MPC826, the HiP4 superset device. Shaded portions indicate
functionality that is not available on all devices; refer to the notes.
16 Kbytes
I-Cache
I-MMU
G2 Core
System Interface Unit
(SIU)
16 Kbytes
D-Cache
D-MMU
Bus Interface Unit
60x-to-PCI
Bridge
2,3
60x-to-Local
Bridge
Memory Controller
Timers
Parallel I/O
Baud Rate
Generators
32-bit RISC Microcontroller
and Program ROM
IMA
Microcode
1,3
60x Bus
PCI Bus
2,3
32 bits, up to 66 MHz
or
Local Bus
32 bits, up to 83 MHz
Communication Processor Module (CPM)
Interrupt
Controller
32 Kbytes
Dual-Port RAM
Serial
DMAs
4 Virtual
IDMAs
Clock Counter
System Functions
4
4
MCC1
MCC2
FCC1
FCC2
FCC3
SCC1
SCC2
SCC3
SCC4
SMC1
SMC2
SPI
I
2
C
TC Layer Hardware
1,3
Time Slot Assigner
Serial Interface
8 TDM Ports
5
3 MII
Ports
6
2 UTOPIA
Ports
Non-Multiplexed
I/O
Notes:
1
MPC8264
2
MPC8265
3
MPC8266
4
5
Not on MPC8255
4 TDM ports on the MPC8255
6
2 MII ports on the MPC8255
Figure 1. MPC8266 Block Diagram
1.1
Features
Dual-issue integer core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 150–300 MHz
— Separate 16-Kbyte data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
— PowerPC architecture-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
The major features of the MPC826xA family are as follows:
2
MPC826xA (HiP4) Family Hardware Specifications
MOTOROLA
Features
— High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without
inlining and 1.90 Dhrystones MIPS/MHz with
— Supports bus snooping for data cache coherency
— Floating-point unit (FPU)
Separate power supply for internal logic and for I/O
Separate PLLs for G2 core and for the CPM
— G2 core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
— Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
64-bit data and 32-bit address 60x bus
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge (MPC8265 and MPC8266 only)
— Programmable host bridge and agent
— 32-bit data bus, 66 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
System interface unit (SIU)
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE 1149.1 JTAG test access port
Twelve-bank memory controller
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user-
definable peripherals
— Byte write enables and selectable parity generation
— 32-bit address decodes with programmable bank size
— Three user programmable machines, general-purpose chip-select machine, and page-mode
pipeline SDRAM machine
— Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local)
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
3
Features
— Dedicated interface logic for SDRAM
CPU core can be disabled and the device can be used in slave mode to an external core
Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible
support for communications protocols
— Interfaces to G2 core through on-chip 32-Kbyte dual-port RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols (only FCC1 and
FCC2 on the MPC8255):
– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent
interface (MII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5,
AAL1, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 16 K external
connections
– Transparent
– HDLC—Up to T3 rates (clear channel)
— Two multichannel controllers (MCCs) (only MCC2 on the MPC8255)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels.Each MCC can be split
into four subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM
interfaces up to four TDM interfaces per MCC
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting
the digital portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provide management for BRI devices as general circuit interface (GCI) controllers in time-
division-multiplexed (TDM) channels
– Transparent
– UART (low-speed operation)
— One serial peripheral interface identical to the MPC860 SPI
— One inter-integrated circuit (I
2
C) controller (identical to the MPC860 I
2
C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
— Up to eight TDM interfaces (four on the MPC8255)
4
MPC826xA (HiP4) Family Hardware Specifications
MOTOROLA
Features
Supports two groups of four TDM channels for a total of eight TDMs
2,048 bytes of SI RAM
Bit or byte resolution
Independent transmit and receive routing, frame synchronization
Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
Additional features of the MPC826xA family are as follows:
CPM
— 32-Kbyte dual-port RAM
— Additional MCC host commands
— Eight transfer transmission convergence (TC) layers between the TDMs and FCC2 to support
inverse multiplexing for ATM capabilities (IMA) (MPC8264 and MPC8266 only)
CPM multiplexing
— FCC2 can also be connected to the TC layer.
TC layer (MPC8264 and MPC8266 only)
— Each of the 8 TDM channels is routed in hardware to a TC layer block
– Protocol-specific overhead bits may be discarded or routed to other controllers by the SI
– Performing ATM TC layer functions (according to ITU-T I.432)
– Transmit (Tx) updates
– Cell HEC generation
– Payload scrambling using self synchronizing scrambler (programmable by the user)
– Coset generation (programmable by the user)
– Cell rate by inserting idle/unassigned cells
– Receive (Rx) updates
– Cell delineation using bit by bit HEC checking and programmable ALPHA and DELTA
parameters for the delineation state machine
– Payload descrambling using self synchronizing scrambler (programmable by the user)
– Coset removing (programmable by the user)
– Filtering idle/unassigned cells (programmable by the user)
– Performing HEC error detection and single bit error correction (programmable by user)
– Generating loss of cell delineation status/interrupt (LOC/LCD)
— Operates with FCC2 (UTOPIA 8)
— Provides serial loop back mode
— Cell echo mode is provided
— Supports both FCC transmit modes
– External rate mode—Idle cells are generated by the FCC (microcode) to control data rate.
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
5
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