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MPC8321ECZQAFDCA

32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
零件包装代码
BGA
包装说明
BGA,
针数
516
Reach Compliance Code
unknown
ECCN代码
3A001.A.3
地址总线宽度
位大小
32
边界扫描
YES
最大时钟频率
66.67 MHz
外部数据总线宽度
格式
FLOATING POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B516
长度
27 mm
低功率模式
YES
端子数量
516
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装形状
SQUARE
封装形式
GRID ARRAY
认证状态
Not Qualified
座面最大高度
2.55 mm
速度
333 MHz
最大供电电压
1.05 V
最小供电电压
0.95 V
标称供电电压
1 V
表面贴装
YES
技术
CMOS
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
27 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
文档预览
Freescale Semiconductor
Technical Data
Document Number: MPC8323EEC
Rev. 3, 02/2010
MPC8323E
PowerQUICC™ II Pro Integrated
Communications Processor
Family Hardware Specifications
This document provides an overview of the MPC8323E
PowerQUICC™ II Pro processor features. The MPC8323E
is a cost-effective, highly integrated communications
processor that addresses the requirements of several
networking applications, including ADSL SOHO and
residential gateways, modem/routers, industrial control, and
test and measurement applications. The MPC8323E extends
current PowerQUICC offerings, adding higher CPU
performance, additional functionality, and faster interfaces,
while addressing the requirements related to time-to-market,
price, power consumption, and board real estate. This
document describes the MPC8323E, and unless otherwise
noted, the information also applies to the MPC8323,
MPC8321E, and MPC8321.
To locate published errata or updates for this document, refer
to the MPC8323E product summary page on our website
listed on the back cover of this document or contact your
local Freescale sales office.
1.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 9
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 11
DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . 13
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ethernet and MII Management . . . . . . . . . . . . . . . . . 19
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
UTOPIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
HDLC, BISYNC, Transparent, and Synchronous
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
System Design Information . . . . . . . . . . . . . . . . . . . 76
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 79
Document Revision History . . . . . . . . . . . . . . . . . . . 80
© 2010 Freescale Semiconductor, Inc. All rights reserved.
Overview
1
Overview
The MPC8323E incorporates the e300c2 (MPC603e-based) core built on Power Architecture™
technology, which includes 16 Kbytes of L1 instruction and data caches, dual integer units, and on-chip
memory management units (MMUs). The e300c2 core does not contain a floating point unit (FPU). The
MPC8323E also includes a 32-bit PCI controller, four DMA channels, a security engine, and a 32-bit
DDR1/DDR2 memory controller.
A new communications complex based on QUICC Engine™ technology forms the heart of the networking
capability of the MPC8323E. The QUICC Engine block contains several peripheral controllers and a
32-bit RISC controller. Protocol support is provided by the main workhorses of the device—the unified
communication controllers (UCCs). Note that the MPC8321 and MPC8321E do not support UTOPIA. A
block diagram of the MPC8323E is shown in
Figure 1.
MPC8323E
e300c2 Core
16 KB
I-Cache
Integer Unit
(IU1)
16 KB
D-Cache
Integer Unit
(IU2)
Security Engine (SEC 2.2)
System Interface Unit
(SIU)
Memory Controllers
GPCM/UPM
32-Bit DDR1/DDR2
Interface Unit
PCI Controller
Local Bus
Bus Arbitration
Multi-User
RAM
Serial DMA
and
2 Virtual
DMAs
DUART
I
2
C
4 Channel DMA
UCC2
UCC3
UCC4
UCC5
Interrupt Controller
USB
SPI
SPI
Protection and Configuration
System Reset
Clock Synthesizer
DDR
PCI
Local
Classic G2 MMUs
Timers, Power Management,
and JTAG/COP
QUICC Engine Block
Baud Rate
Generators
Parallel I/O
UCC1
Accelerators
Single 32-Bit RISC CP
Time Slot Assigner
Serial Interface
4 TDM Ports
3 MII/RMII
1 UL2/8-Bit
Figure 1. MPC8323E Block Diagram
Each of the five UCCs can support a variety of communication protocols: 10/100 Mbps Ethernet, serial
ATM, HDLC, UART, and BISYNC—and, in the MPC8323E and MPC8323, multi-PHY ATM and ATM
support for up to OC-3 speeds.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
2
Freescale Semiconductor
Overview
NOTE
The QUICC Engine block can also support a UTOPIA level 2 capable of
supporting 31 multi-PHY (MPC8323E- and MPC8323-specific).
The MPC8323E security engine (SEC 2.2) allows CPU-intensive cryptographic operations to be offloaded
from the main CPU core. The security-processing accelerator provides hardware acceleration for the DES,
3DES, AES, SHA-1, and MD-5 algorithms.
In summary, the MPC8323E family provides users with a highly integrated, fully programmable
communications processor. This helps ensure that a low-cost system solution can be quickly developed
and offers flexibility to accommodate new standards and evolving system requirements.
1.1
MPC8323E Features
Major features of the MPC8323E are as follows:
• High-performance, low-power, and cost-effective single-chip data-plane/control-plane solution for
ATM or IP/Ethernet packet processing (or both).
• MPC8323E QUICC Engine block offers a future-proof solution for next generation designs by
supporting programmable protocol termination and network interface termination to meet evolving
protocol standards.
• Single platform architecture supports the convergence of IP packet networks and ATM networks.
• DDR1/DDR2 memory controller—one 32-bit interface at up to 266 MHz supporting both DDR1
and DDR2.
• An e300c2 core built on Power Architecture technology with 16-Kbyte instruction and data caches,
and dual integer units.
• Peripheral interfaces such as 32-bit PCI (2.2) interface up to 66-MHz operation, 16-bit local bus
interface up to 66-MHz operation, and USB 2.0 (full-/low-speed).
• Security engine provides acceleration for control and data plane security protocols.
• High degree of software compatibility with previous-generation PowerQUICC processor-based
designs for backward compatibility and easier software migration.
1.1.1
Protocols
The protocols are as follows:
• ATM SAR up to 155 Mbps (OC-3) full duplex, with ATM traffic shaping (ATF TM4.1)
• Support for ATM AAL1 structured and unstructured circuit emulation service (CES 2.0)
• Support for IMA and ATM transmission convergence sub-layer
• ATM OAM handling features compatible with ITU-T I.610
• IP termination support for IPv4 and IPv6 packets including TOS, TTL, and header checksum
processing
• Extensive support for ATM statistics and Ethernet RMON/MIB statistics
• Support for 64 channels of HDLC/transparent
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
3
Overview
1.1.2
Serial Interfaces
The MPC8323E serial interfaces are as follows:
• Support for one UL2 interface with 31 multi-PHY addresses (MPC8323E and MPC8323 only)
• Support for up to three 10/100 Mbps Ethernet interfaces using MII or RMII
• Support for up to four T1/E1/J1/E3 or DS-3 serial interfaces (TDM)
• Support for dual UART and SPI interfaces and a single I
2
C interface
1.2
QUICC Engine Block
The QUICC Engine block is a versatile communications complex that integrates several communications
peripheral controllers. It provides on-chip system design for a variety of applications, particularly in
communications and networking systems. The QUICC Engine block has the following features:
• One 32-bit RISC controller for flexible support of the communications peripherals
• Serial DMA channel for receive and transmit on all serial channels
• Five universal communication controllers (UCCs) supporting the following protocols and
interfaces (not all of them simultaneously):
— 10/100 Mbps Ethernet/IEEE 802.3® standard
— IP support for IPv4 and IPv6 packets including TOS, TTL, and header checksum processing
— ATM protocol through UTOPIA interface (note that the MPC8321 and MPC8321E do not
support the UTOPIA interface)
— HDLC /transparent up to 70-Mbps full-duplex
— HDLC bus up to 10 Mbps
— Asynchronous HDLC
— UART
— BISYNC up to 2 Mbps
— QUICC multi-channel controller (QMC) for 64 TDM channels
• One UTOPIA interface (UPC1) supporting 31 multi-PHYs (MPC8323E- and MPC8323-specific)
• Two serial peripheral interfaces (SPI). SPI2 is dedicated to Ethernet PHY management.
• Four TDM interfaces
• Thirteen independent baud rate generators and 19 input clock pins for supplying clocks to UCC
serial channels
• Four independent 16-bit timers that can be interconnected as two 32-bit timers
The UCCs are similar to the PowerQUICC II peripherals: SCC (BISYNC, UART, and HDLC bus) and
FCC (fast Ethernet, HDLC, transparent, and ATM).
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
4
Freescale Semiconductor
Overview
1.3
Security Engine
The security engine is optimized to handle all the algorithms associated with IPSec, IEEE 802.11i®
standard, and iSCSI. The security engine contains one crypto-channel, a controller, and a set of crypto
execution units (EUs). The execution units are:
• Data encryption standard execution unit (DEU), supporting DES and 3DES
• Advanced encryption standard unit (AESU), supporting AES
• Message digest execution unit (MDEU), supporting MD5, SHA1, SHA-256, and HMAC with any
algorithm
• One crypto-channel supporting multi-command descriptor chains
1.4
DDR Memory Controller
The MPC8323E DDR1/DDR2 memory controller includes the following features:
• Single 32-bit interface supporting both DDR1 and DDR2 SDRAM
• Support for up to 266-MHz data rate
• Support for two ×16 devices
• Support for up to 16 simultaneous open pages
• Supports auto refresh
• On-the-fly power management using CKE
• 1.8-/2.5-V SSTL2 compatible I/O
• Support for 1 chip select only
• FCRAM, ECC, hardware/software calibration, bit deskew, QIN stage, or atomic logic are not
supported.
1.5
PCI Controller
The MPC8323E PCI controller includes the following features:
PCI Specification Revision 2.3
compatible
• Single 32-bit data PCI interface operates up to 66 MHz
• PCI 3.3-V compatible (not 5-V compatible)
• Support for host and agent modes
• On-chip arbitration, supporting three external masters on PCI
• Selectable hardware-enforced coherency
1.6
Programmable Interrupt Controller (PIC)
The programmable interrupt controller (PIC) implements the necessary functions to provide a flexible
solution for general-purpose interrupt control. The PIC programming model is compatible with the
MPC8260 interrupt controller, and it supports 8 external and 35 internal discrete interrupt sources.
Interrupts can also be redirected to an external interrupt controller.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
5
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参数对比
与MPC8321ECZQAFDCA相近的元器件有:MPC8321ZQADDCA、MPC8321CZQADDCA、MPC8321CZQAFDCA、MPC8321ZQAFDCA、MPC8321EZQAFDCA、MPC8321EZQADDCA、MPC8321ECZQADDCA。描述及对比如下:
型号 MPC8321ECZQAFDCA MPC8321ZQADDCA MPC8321CZQADDCA MPC8321CZQAFDCA MPC8321ZQAFDCA MPC8321EZQAFDCA MPC8321EZQADDCA MPC8321ECZQADDCA
描述 32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 266MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 266MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 266MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516 32-BIT, 266MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, PBGA-516
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA,
针数 516 516 516 516 516 516 516 516
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
位大小 32 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES YES
最大时钟频率 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz 66.67 MHz
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
集成缓存 YES YES YES YES YES YES YES YES
JESD-30 代码 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516
长度 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm
低功率模式 YES YES YES YES YES YES YES YES
端子数量 516 516 516 516 516 516 516 516
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.55 mm 2.55 mm 2.55 mm 2.55 mm 2.55 mm 2.55 mm 2.55 mm 2.55 mm
速度 333 MHz 266 MHz 266 MHz 333 MHz 333 MHz 333 MHz 266 MHz 266 MHz
最大供电电压 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V
最小供电电压 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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