Microprocessors - MPU POWER QUICC I HIP6W
器件类别:半导体 嵌入式处理器和控制器
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
下载文档型号 | MPC853TVR100A | MPC853TVR66A | MPC852TZT66A | MPC853TZT66A | MPC852TCZT80A | MPC852TVR66A | KMPC852TCVR100A | MPC852TCVR50A | KMPC852TZT100A | MPC852TCZT66A |
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描述 | Microprocessors - MPU POWER QUICC I HIP6W | Microprocessors - MPU POWER QUICC I HIP6W | Microprocessors - MPU POWER QUICC II HIP6W | Microprocessors - MPU POWER QUICC I HIP6W | Microprocessors - MPU POWER QUICC II HIP6W | Microprocessors - MPU Ethernet 66 MHz | Microprocessors - MPU POWER QUICC II HIP6W | EEPROM 2.5 V to 5.5V 512K | Microprocessors - MPU POWER QUICC II HIP6W | Microprocessors - MPU POWER QUICC II HIP6W |
是否无铅 | - | 不含铅 | 含铅 | 含铅 | - | 不含铅 | - | 不含铅 | - | 含铅 |
是否Rohs认证 | - | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
零件包装代码 | - | BGA | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | - | 23 X 23 MM, 2.54 MM HEIGHT, 1.27 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, BGA-256 | BGA, BGA256,16X16,50 | PLASTIC, BGA-256 | BGA, BGA256,16X16,50 | BGA, BGA256,16X16,50 | BGA, | BGA, BGA256,16X16,50 | BGA, | BGA, BGA256,16X16,50 |
针数 | - | 256 | 256 | - | 256 | 256 | 256 | 256 | 256 | 256 |
Reach Compliance Code | - | compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | unknown | not_compliant | not_compliant |
ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 5A991 | 3A991.A.2 | 5A991 | 3A991.A.2 | 5A991 | 3A991.A.2 |
其他特性 | - | ALSO REQUIRES 3.3V I/O SUPPLY | ALSO REQUIRES 3.3V SUPPLY | - | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | - | 66 MHz | 66 MHz | - | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
外部数据总线宽度 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | - | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
JESD-609代码 | - | e1 | e0 | e0 | e0 | e1 | e1 | e1 | e0 | e0 |
长度 | - | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
低功率模式 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
湿度敏感等级 | - | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | - | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | BGA | BGA | HBGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY | GRID ARRAY | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | - | 245 | 220 | 220 | 220 | 245 | 245 | 245 | 220 | 220 |
座面最大高度 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
速度 | - | 66 MHz | 66 MHz | 66.67 MHz | 80 MHz | 66 MHz | 100 MHz | 50 MHz | 100 MHz | 66 MHz |
最大供电电压 | - | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | Tin/Lead (Sn/Pb) |
端子形式 | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | - | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
厂商名称 | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |