MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX4250/D
MPX4250
Integrated Silicon Pressure Sensor
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Motorola MPX4250 series Manifold Absolute Pressure (MAP) sensor for turbo
boost engine control is designed to sense absolute air pressure within the intake
manifold. This measurement can be used to compute the amount of fuel required for
each cylinder.
The MPX4250 series sensor integrates on–chip, bipolar op amp circuitry and thin film
resistor networks to provide a high level analog output signal and temperature
compensation. The small form factor and reliability of on–chip integration make the
Motorola MAP sensor a logical and economical choice for automotive system designers.
Features
•
1.5% Maximum Error Over 0° to 85°C
•
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine
Control Systems
•
Ideally Suited for Direct Microprocessor Interfacing
•
Patented Silicon Shear Stress Strain Gauge
•
Temperature Compensated Over – 40° to +125°C
•
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
•
Durable Epoxy Unibody Element
•
Ideal for Non–Automotive Applications
Application Examples
•
Manifold Sensing for Automotive Systems
PORT OPTION
CASE 867B–04, STYLE 1
SERIES
INTEGRATED
PRESSURE SENSOR
20 to 250 kPa (2.9 to 36.3 psi)
0.2 to 4.9 V OUTPUT
BASIC CHIP
CARRIER ELEMENT
CASE 867–08, STYLE 1
VS
3
PIN NUMBER
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
2
GND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
PINS 4, 5 AND 6 ARE NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 2
Motorola Sensor Device Data
©
Motorola, Inc. 1997
1
MPX4250 SERIES
MAXIMUM RATINGS(1)
Parametrics
Overpressure(2) (P1 > P2)
Burst Pressure(2) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Pmax
Pburst
Tstg
TA
Value
400
1000
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range(1)
Supply Voltage(2)
Supply Current
Minimum Pressure Offset(3)
@ VS = 5.1 Volts
Full Scale Output(4)
@ VS = 5.1 Volts
Full Scale Span(5)
@ VS = 5.1 Volts
Accuracy(6)
Sensitivity
Response Time(7)
Output Source Current at Full Scale Output
Warm–Up Time(8)
Offset Stability(9)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Symbol
POP
VS
Io
VFSS
VFSS
VFSS
—
∆V/∆P
tR
lo+
—
—
Min
20
4.85
—
4.622
4.622
4.622
—
—
—
—
—
—
Typ
—
5.1
7.0
4.692
4.692
4.692
—
20
1.0
0.1
20
±
0.5
Max
250
5.35
10
4.762
4.762
4.762
±1.5
—
—
—
—
—
Unit
kPa
Vdc
mAdc
Vdc
Vdc
Vdc
%VFSS
mV/kPa
ms
mAdc
ms
%VFSS
Decoupling circuit shown in Figure 3 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
Characteristics
Weight, Basic Element (Case 867)
Common Mode Line Pressure(10)
Symbol
—
—
Min
—
—
Typ
4.0
—
Max
—
690
Unit
Grams
kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
•
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
•
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
•
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.
2
Motorola Sensor Device Data
MPX4250 SERIES
SILICONE
DIE COAT
WIRE BOND
STAINLESS STEEL
METAL COVER
P1
EPOXY
CASE
DIE
MPX4250A
OUPUT
(PIN 1)
50 pF
51 k
A/D
LEAD FRAME
SEALED VACUUM REFERENCE
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor dia-
phragm. The MPX4250A series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor per-
formance and long–term reliability. Contact the factory for in-
OUTPUT (Volts)
Motorola Sensor Device Data
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
P2
µ
PROCESSOR
RTV DIE
BOND
Figure 2. Cross–Sectional Diagram
(Not to Scale)
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
formation regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the integrated MAP sensor to the A/D input of a microproces-
sor. Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over temperature range of 0° to
85°C. (The output will saturate outside of the specified pres-
sure range.)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
MIN
TRANSFER FUNCTION:
Vout = VS* (0.004 x P–0.04)
±
Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
MAX
TYP
PRESSURE (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
3
MPX4250 SERIES
Transfer Function
Nominal Transfer Value:
Vout = VS (P x 0.004 – 0.04)
Nominal Transfer Value:
+/– (Pressure Error x Temp. Factor x 0.004 x VS)
Nominal Transfer Value:
VS = 5.1 V
±
0.25 Vdc
Temperature Error Band
MPX4250A Series
4.0
3.0
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temp
– 40
0 to 85
+125
Multiplier
3
1
3
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
9.0
6.0
Pressure Error (kPa)
3.0
25
–3.0
– 6.0
– 9.0
Pressure
20 to 250 kPa
Error (Max)
±
3.45 (kPa)
50
75 100 125 150 175 200 225 250
Pressure in kPa
ORDERING INFORMATION
The MPX4250A series Turbo MAP silicon pressure sensors are available in the basic element package or with pressure port
fittings that provide mounting ease and barbed hose connections.
Device Type
Basic Element
Options
Absolute, Element
Absolute, Ported
Ported Elements
Absolute, Stove Pipe Port
Absolute, Axial Port
Case No.
Case 867–08
Case 867B–04
Case 867E–03
Case 867F–03
MPX Series Order No.
MPX4250A
MPX4250AP
MPX4250AS
MPX4250ASX
Marking
MPX4250A
MPX4250AP
MPX4250A
MPX4250A
4
Motorola Sensor Device Data
MPX4250 SERIES
PACKAGE DIMENSIONS
C
R
M
B
–A–
N
PIN 1
SEATING
PLANE
1
2
3
4
5
6
POSITIVE PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30
_
NOM
0.475
0.495
0.430
0.450
0.090
0.105
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30
_
NOM
12.07
12.57
10.92
11.43
2.29
2.66
L
–T–
G
F
D
6 PL
0.136 (0.005)
M
J
S
T A
M
DIM
A
B
C
D
F
G
J
L
M
N
R
S
CASE 867–08
ISSUE N
BASIC ELEMENT (D)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
–T–
R
SEATING
PLANE
A
U
L
V
PORT #1
POSITIVE
PRESSURE (P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
S
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93
N
–Q–
B
K
1
2
3
4
5
6
PIN 1
S
G
D
6 PL
0.13 (0.005)
C
J
–P–
0.25 (0.010)
M
T Q
M
F
M
T P
Q
S
CASE 867B–04
ISSUE E
PRESSURE SIDE PORTED (AP)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
Motorola Sensor Device Data
5
