Freescale Semiconductor
Product Specification
MPXY8300
Rev 4, 05/2009
Tire Pressure Monitor Sensor
Product Specification
The MPXY8300 Series is a 20-pin sensor for use in applications that monitor tire
pressure and temperature. It contains the pressure, temperature and 2-axis
accelerometer sensors, a microcontroller, and an RF output all within a single
package.
The MPXY8300 Series is comprised of the following functions all within the
same package.
Features
•
•
•
•
•
•
Pressure sensor with signal interface to ADC10
Temperature sensor with signal interface to ADC10
Z- and X-axis accelerometers with signal interface to ADC10
Voltage reference measured by ADC10
4-channel, 10-bit analog-to-digital converter
8-bit MCU
– S08 Core with SIM, interrupt and debug/monitor
– 512 RAM
– 8K FLASH (in addition to 8K providing factory firmware and trim
data)
– 32-byte, low power, parameter registers
Internal 315/434 MHz RF transmitter
– External crystal oscillator
– PLL-based output with fractional-n divider
– ASK and FSK modulation capability
– Programmable data rate generator
– Manchester or bi-phase data encoding
– 128-bit RF data buffer with RTS/CTS handshake
– Direct access to RF transmitter from MCU for unique formats
– Supply voltage charge pump to compensate for cold batteries
with selectable charge times (30, 60, 120 and 240 msec)
Differential input LF detector/decoder
4 GPIO pins with optional pull-ups/pull-downs and wake-up interrupt
Real Time Interrupt driven by LFO with interrupt intervals of
8, 16, 32, 64, 128, 256, 512 or 1024 msec
Low power wake-up timer and periodic reset driven by LFO
Watchdog time-out with selectable times and clock sources
2-channel general purpose timer/PWM module (TPM1)
Internal oscillators
– MCU bus clock of 0.5, 1, 2 and 4 MHz (1, 2, 4 and 8 MHz HFO)
– Charge pump clock of 10 MHz
– Low frequency, low power time clock (LFO) with 1 msec period
– Medium frequency, LFR decoder and sensor clock (MFO) of
8
μsec
period
Low voltage detection
Normal temperature restart in hardware (over temperature detected
by software)
MPXY8300
Series
TIRE PRESSURE,
TEMPERATURE AND
ACCELERATION SENSOR
•
20-LEAD
SOIC
CASE 1793-03
Top View
PTA5
PTA6
XI
XO
RV
SS
RF
V
RF
V
CAP
AV
SS
AV
DD
1
2
g-Cell
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
N/C
N/C
BKGD
V
SS
V
DD
PTA0
PTA1
PTA2
PTA3
RESET
•
•
•
•
•
•
•
Pressure Port Up
Figure 1. Pin Connections
•
•
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2007 - 2009. All rights reserved.
ORDERING INFORMATION
MPXY8300 Series
Order Numbers
MPXY8300A6T1
MPXY8300A6U
MPXY8300B6T1
MPXY8300B6U
MPXY8300C6T1
MPXY8300C6U
Temperature Range
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
Case No.
1793-03
1793-03
1793-03
1793-03
1793-03
1793-03
Package
SOIC-20, Tape and Reel
SOIC-20, Rail
SOIC-20, Tape and Reel
SOIC-20, Rail
SOIC-20, Tape and Reel
SOIC-20, Rail
SECTION 1 GENERAL DESCRIPTION
1.1
Overall Block Diagram
The block diagram of the device is shown in
Figure 1-1.
This diagram covers all the main blocks mentioned above and their main
signal interactions. Power management controls and bus control signals are not shown in this block diagram for clarity.
1.2
Multi-Chip Interface
The device contains four devices using the best process technology for each.
•
Microcontroller (MCU)
•
RF transmitter device (RFX)
•
Pressure sensing device (P-CHIP)
•
Z- and X-axis acceleration transducer (g-Cell)
As shown in
Figure 1-1
the MCU interfaces to the RFX using a standard serial peripheral interface (SPI) which creates a separate
data and address bus structure within the RFX. The P-Chip and g-Cell both interface to the MCU.
1.3
System Clock Distribution
The various clock sources and their distribution are shown in
Figure 1-2.
Note that most clock sources and distribution are limited
to one device, while the SFO, D
X
and SPI clocks are connected between devices. All clock sources except the low frequency
oscillator, LFO, can be turned off by software control in order to conserve power. The LFO is used for:
•
Slow periodic wake-up of the MCU (see
Section 11)
•
Slow periodic wake-up of LF receiver (LFR) (see
Section 12)
MPXY8300 Series
2
Sensors
Freescale Semiconductor
P-CHIP
AV
DD
PTB6
GP I/O
PCI
RTI
TIMER
MCU
PRESS
SENSOR
SIGNAL
CONDITION
V
OUT
SFO
P-CHIP
INTERFACE
LFO
1 mSec
WAKE-UP
TIMER
PRESS
TRIM
REGISTER
MODE
LVD
BKGD
HFO
1, 2, 4 or 8
MHz
TEMP
RESTART
TEMP
TEMP
SENSOR
V
PR
V
TP
V
BG
V
ACC
X
XZ
ACCEL
ACCEL
INTERFACE
MFO
OSC
ADC10
10-BIT
4-CHAN
MFO
4 & 8
μSec
MCU CORE
S08
V
DD
V
DD
32 Byte
PARAMETER
REGISTER
RAM
MEMORY
512
8K USER
FLASH
MEMORY
8K
FIRMWARE
MEMORY
TPM1
TIMER/PWM
2-CHAN
VOLT
REG
V
SS
Z
BANDGAP
REF
RESET
AV
DD
AV
DD
AV
SS
g-Cell
D
X
XI
XO
XTAL
OSC
BIT
RATE
GEN
128-BIT
DATA
BUFFER
VCO/PLL
FRACTL
DIVIDER
LFR
DETECT
PTA0
PTA1
DATA
ENCODE
RFX
LFR
DECODE
MFO1
LFI
KBI
KEY
BOARD
WAKEUP
PTA2
PTA3
GP
I/O
PTA5
PTA6
RF
RV
SS
RF
AMP
CPO
V
CAP
CHARGE
PUMP
SPI
SLAVE
MOSI
MISO
SCK
SS
SMODE
SPI
MASTER
V
RF
TEST
INTERFACE
TEST
INTERFACE
Figure 1-1 MPXY8300 Series Overall Block Diagram
MPXY8300 Series
Sensors
Freescale Semiconductor
3
LFO
OSC
1 mS
PERIOD
BUSCLKS0:1
RTICLKS
SYSTEM
CONTROL
LOGIC
ADC10
CLOCK
PAR
REG
MCU
RTI
ADCCLK
ADC10
RAM
FLASH
ADC10
HFO
PLL OSC
1, 2,4, 8 MHz
f
OSC
÷
2
COPCLKS
f
BUS
CLSA, CLKSB
4 kbps
WATCH
DOG
LF
CPU
SPI
TPM1
f
LFO
(1 kHz)
SCK (1 MHz)
f
MFO1
PWU
D
X
(500 kHz)
MFO
OSC
4 & 8
μSec
TCLKDIV
LFR
BDC
÷
8
f
MFO
ACCEL
INTERFACE
CPT0:1
CKREF
CPO
OSC
10 MHz
CHARGE
PUMP
P-CHIP
INTERFACE
SPI
f
SFO
(8
μSec)
g-Cell
RANDOM
(0 - 5 kHz)
XTL
OSC
16 - 22 MHz
XI
XO
BIT
RATE
GEN
f
XCO
PLL
DATA
BUFFER
VCO
TRIM
REG
RF
OUT
CLOCK
GEN
SIGNAL
CONDITIONING
PRESSURE
SENSOR
RFX
P-CHIP
Figure 1-2 MPXY8300 Series Clock Distribution
1.4
Reference Documents
The MPXY8300 Series utilizes a custom microcontroller. The user can obtain further detail on the full capabilities of the MCU
modules by referring to the HCS08 Family Reference Manual (HCS08RMV1).
MPXY8300 Series
4
Sensors
Freescale Semiconductor
SECTION 2 PINS AND CONNECTIONS
This section describes the pin layout and general function of each pin.
2.1
Package Pinout
The pinout for the 20-pin MPXY8300 Series package is shown in
Figure 2-1
for the pressure port up orientation as shown in the
cross sections in
Figure 2-2.
Both orientations use the standard method for the order of pin numbers, but the order of the pin
functions changes.
PTA5
PTA6
XI
XO
RV
SS
RF
V
RF
V
CAP
AV
SS
AV
DD
1
2
g-Cell
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
N/C
N/C
BKGD
V
SS
V
DD
PTA0
PTA1
PTA2
PTA3
RESET
POSITIVE ACCELERATION MOVES MASS
IN +X DIRECTION (V
ACC
VALUE INCREASES)
AXIS
ORIENTATION
-X
+X
Pressure Port Up
N/C = No internal connection
Figure 2-1 MPXY8300 Series 20-Pin SOIC Package Pinout
+Z
P-CHIP
RFX
MCU
g-Cell
P-CHIP
MCU
Z-AXIS
ORIENTATION
End View
Side View
POSITIVE ACCELERATION MOVES MASS
IN +Z DIRECTION (V
ACC
VALUE INCREASES)
-Z
Figure 2-2 Port Up Lead Forming
MPXY8300 Series
Sensors
Freescale Semiconductor
5
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