Ultra-Precision SMT Resistor
(Molded, J-Lead Terminal)
TCR, Resistance Range, Tolerance, Rated Power
Type
MP
MQ
MQ
TCR (ppm/°C)
-55°C to +125°C
0±10
0±5
0±10
0±5
Resistance
Range ( )
30 to 100
100 to 30k
30 to 100
100 to 60k
Resistance
Tolerance (%)
±0.1
±0.05
±0.1
±0.05
Rated Power (W)
at 125°C
0.1
0.125
MP
Power Derating Curve
Resistance value, in ohm, is expressed by a series of five characters, four of
which represent significant digits. The fifth R or K is a dual-purpose letter that
designates both the value range (R for ohmic; K for kilo-ohm) and the location
of the decimal point.
Frequency Characteristics
Configuration
Temperature of Resistor Surface
W
H
L
1
W
1
W
2
H
1
t
2.5±0.2
2.0±0.2
0.6±0.2
1.4±0.3
2.3±0.2
1.5±0.3
0.15±0.05
3.2±0.2
0.8±0.2
3.0±0.2
Dimensions in mm
6
)
Wm
( 003
yxopE dedloM
fo ecafruS
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M
yxopE dedloM
fo ecafruS PM
Type
L
MP
3.2±0.2
MQ
4.5±0.2
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)zHM(
051
ycneuqerF
000,1 005
001 05
k03
k01
k5
k1
005
001
05
erutarepmeT tneibmA
001
57
05
521
Wm/C¡
42
.
0
=
R
Q
M
Wm/C¡6
2
.
0
=
R PM
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002
521 001
01 5
PM
52
051
001
)
%
(
05
)
C¡
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05
001
0
04
MQ 10K00 L
epyT
eulaV ecnatsiseR
deriuqeR egakcaP leeR & epaT
08
06
02
Composition of Type Number
001
)%(
egatnecreP rewoP detaR
1
W
2
W
1
L
L
t
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W
H
1
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esiR erutarep
m
eT
Performance
Parameters
Maximum Rated Operating Temperature
Working Temperature Range
Maximum Working Voltage
Maximum Working Current
Thermal Shock
Overload
Low Temperature Storage and Operation
Substrate Bending Test
Dielectric Withstanding Voltage
Insulation Resistance
Resistance to Soldering Heat
Moisture Resistance
Shock
Vibration, High Frequency
Life
Storage Life
High Temperature Exposure
Test Condition
ALPHA Specification
ALPHA Typical Test Data
125°C
-65°C to +175°C
MP=50V, MQ=100V
350 mA
±0.01%
±0.05%
±0.01%
±0.05%
±0.05%
±0.01%
±0.05%
±0.01%
±0.005%
over 10,000 M
±0.01%
±0.03%
±0.01%
±0.01%
±0.03%
±0.0025%
±0.03%
-65°C/30 min. +175°C/30 min., 5 cycles
Rated Voltage x 2.5, 5 sec.
-65°C, No Load, 24 hrs. Rated Voltage, 45 min.
Substrate Bent 3mm, 60 sec.
Atmospheric: AC 200V, 1 min.
DC 100V, 1 min.
260°C, 10 sec.
+65°C to -10°C, 90% RH to 98% RH, Rated Voltage, 10 cycles (240 hrs.)
100G, 6ms, Sawtooth Wave, X, Y, Z, each 10 shocks
20G, 10Hz to 2,000Hz to 10Hz, 20 min., X, Y, Z, each 2.5 hrs.
125°C, Rated Power, 1.5 hr. – ON, 0.5 hr. – OFF, 2,000 hrs.
15°C to 35°C, 15% RH to 75% RH, No Load, 10,000 hrs.
175°C, No Load, 2,000 hrs.
±0.01%
over 10,000 M
±0.05%
±0.05%
±0.02%
±0.02%
±0.05%
±0.005%
±0.05%
Tape and Reel Package
Tape Dimensions
(based on EIA-481-1)
Reel Dimensions
2
W
Type
MP
MQ
A
2.8
±0.2
3.6
±0.2
B
3.9
±0.2
5.2
±0.2
C
12.0
±0.3
12.0
±0.3
D
5.5
±0.05
5.5
±0.05
E
1.75
±0.1
1.75
±0.1
F
4.0
±0.1
8.0
±0.1
G
2.0
±0.05
2.0
±0.05
H
4.0
±0.1
4.0
±0.1
J
1.5
+0.1-0
1.5
+0.1-0
A
178
±2
N
60
min.
B
13
±0.5
C
21
±0.8
D
2
±0.5
Reel Capacity
MP: 1,200 pieces/reel
MQ: 800 pieces/reel
Dimensions in mm
Precaution in Using Face-Bonded Chip Resistors
1. Storage
Storage conditions or environment may adversely affect solderability of the exterior
terminals. Do not store in high temperature and humidity. The recommended storage
environment is lower than 40°C, has less than 70% RH humidity and is free from harmful
gases such as sulphur and chlorine.
2. Caution in Soldering
1
Hand Soldering
Hand soldering is applicable as shown at
right.
Recommended
• Temp. of lron Tip: 300°C max
• Power of lron: 20W or less
• Diameter of Tip: dia. 3mm max.
2
Solder Reflow in Furnace
Recommended
• Peak Temperature: 245°C
• Holding time: 220°C (40sec.max.)
• To cool gradually at room temperature
3
Dipping in Solder (Wave or Still)
Recommended
• Temp. of Solder: 240°C to 250°C
• Length of Dipping: 3 to 4 seconds
• To cool gradually at room temperature
4
Other
Corrosion-free flux, such as rosin, is recommended.
Do not apply pressure to the molded housing immediately after soldering.
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3. Cleaning
Use volatile cleaner such as methylalcohol or propylalcohol.
4. Circuit Board Design
The dimensions of solder land must be determined in conformity with the size of resistors
and with the soldering method. They are also subject to the mounting machine and the
material of the substrate. See example below.
Type
MP
MQ
A
1.6 to 2.0
B
0.5 to 1.5
C
2.2 to 2.6
D
1.8
2.5
Dimensions in mm
When parts are mounted on a board in high density, solder can possibly attach to the
resistors in an excessive amount to affect performance or reliability of the resistors. To
prevent this effect, the use of solder resist is recommended to isolate solder lands.
B
draoB tiucriC
rotsiseR
1
W
lanimreT
C
B
N
W1
12.4
+2.0-0
W2
18.4
max.
r
1.0
±0.5
Dimensions in mm
D
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A
r
D
tsiser redloS
dnal redloS
.xam 53.0
C
.xam 7.2
ytivaC
A
J
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H G F
B
E
D
C
A
7
嵌入式系统
