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MR0A16AYS35R

Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44

器件类别:存储    存储   

厂商名称:Everspin Technologies

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Everspin Technologies
零件包装代码
TSOP2
包装说明
TSOP2, TSOP44,.46,32
针数
44
Reach Compliance Code
compliant
ECCN代码
EAR99
Is Samacsys
N
最长访问时间
35 ns
JESD-30 代码
R-PDSO-G44
JESD-609代码
e3
长度
18.41 mm
内存密度
1048576 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
混合内存类型
N/A
湿度敏感等级
3
功能数量
1
端子数量
44
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
64KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装等效代码
TSOP44,.46,32
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)
260
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大待机电流
0.028 A
最大压摆率
0.155 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin (Sn)
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
10.16 mm
Base Number Matches
1
文档预览
MR0A16A
FEATURES
• 
• 
• 
• 
• 
• 
• 
• 
• 
3.3 Volt power supply
Fast 35ns read/write cycle
SRAM compatible timing
Unlimited read & write endurance
Commercial, Industrial, and Extended Temperatures
Data non-volatile for >20 years at temperature
RoHS-compliant TSOP2 and BGA packages available
All products meet MSL-3 moisture sensitivity level
Automotive AEC-Q100 Grade 1 option available
64K x 16 MRAM Memory
44-pin TSOP2
BENEFITS
•  One memory replaces FLASH, SRAM, EEPROM and BBSRAM 
in system for simpler, more efficient designs
•  Improves reliability by replacing battery-backed SRAM
•  Automatic data protection on power loss
48-ball BGA
RoHS
INTRODUCTION
The MR0A16A is a 1,048,576-bit magnetoresistive random access memory (MRAM) device organized as 
65,536 words of 16 bits. The MR0A16A offers SRAM compatible 35 ns read/write timing with unlimited en-
durance. Data is always non-volatile for greater than 20 years.  Data is automatically protected on power loss 
by low-voltage inhibit circuitry to prevent writes with voltage out of specification.
MR0A16A is the ideal memory solution for applications that must permanently store and retrieve critical 
data and programs quickly.
The MR0A16B  is available in a small footprint 48-pin ball grid array (BGA) package and a 44-pin thin small 
outline package (TSOP Type 2). These packages are compatible with similar low-power SRAM products and 
other nonvolatile RAM products.
The MR0A16A provides highly reliable data storage over a wide range of temperatures.  The product is avail-
able with commercial temperature (0 to +70 °C), industrial temperature (-40 to +85 °C), extended tempera-
ture (-40 to +105 °C), and Automotive AEC-Q100 Grade 1 (-40 to +125°) temperature range options.
Copyright © 2013 Everspin Technologies
1
MR0A16A Rev. 7, 10/2013
MR0A16A
TABLE OF CONTENTS
FEATURES .............................................................................................................................................1
BENEFITS...............................................................................................................................................1
INTRODUCTION ...................................................................................................................................1
BLOCK DIAGRAM AND PIN ASSIGNMENTS .......................................................................................4
Figure 1 – Block Diagram ........................................................................................................................................... 4
Table 1 – Pin Functions ............................................................................................................................................... 4
Figure 2 – MR0A16A Package Pinouts .................................................................................................................. 5
OPERATING MODES .............................................................................................................................5
Table 2 – Operating Modes ....................................................................................................................................... 5
ABSOLUTE MAXIMUM RATINGS .........................................................................................................6
Table 3 – Absolute Maximum Ratings ................................................................................................................... 6
OPERATING CONDITIONS ...................................................................................................................7
Table 4 – Operating Conditions ............................................................................................................................... 7
Power Up and Power Down Sequencing .......................................................................................8
Figure 3 –  Power Up and Power Down Timing ................................................................................................. 8
DC CHARACTERISTICS .........................................................................................................................9
Table 5 – DC Characteristics ......................................................................................................................................
9
Table 6 – Power Supply Characteristics ................................................................................................................
9
TIMING SPECIFICATIONS ................................................................................................................. 10
Table 7 – Capacitance ...............................................................................................................................................10
Table 8 – AC Measurement Conditions ..............................................................................................................10
Figure 4 – Output Load Test Low and High .......................................................................................................10
Figure 5 – Output Load Test All Others ...............................................................................................................10
Table 9 – Read Cycle Timing ...................................................................................................................................11
Figure 6 – Read Cycle 1 .............................................................................................................................................12
Copyright © 2013 Everspin Technologies
2
MR0A16A Rev. 7, 10/2013
MR0A16A
TABLE OF CONTENTS - continued
Figure 7 – Read Cycle 2 .............................................................................................................................................12
Table 10 – Write Cycle Timing 1 (W Controlled)  .............................................................................................13
.
Figure 8 – Write Cycle Timing 1 (W Controlled) ...............................................................................................14
Table 11 –  Write Cycle Timing 2 (E Controlled)................................................................................................15
Figure 9 –  Write Cycle Timing 2 (E Controlled) ................................................................................................15
Table 12 –   Write Cycle Timing 3 (LB/UB Controlled) ....................................................................................16
.
Figure 10 –   Write Cycle Timing 3 (UB/LB Controlled) ...................................................................................16
ORDERING INFORMATION ............................................................................................................... 17
Table 13 – Part Numbering System ......................................................................................................................17
Table 14 – MR0A16A Ordering Part Numbers ..................................................................................................18
PACKAGE OUTLINE DRAWINGS ....................................................................................................... 19
Figure 11 – 44-pin TSOP2 .........................................................................................................................................19
Figure 12 – 48-ball FBGA ..........................................................................................................................................20
REVISION HISTORY ........................................................................................................................... 21
HOW TO CONTACT US ....................................................................................................................... 22
Copyright © 2013 Everspin Technologies
3
MR0A16A Rev. 7, 10/2013
MR0A16A
BLOCK DIAGRAM AND PIN ASSIGNMENTS
Figure 1 – Block Diagram
G
OUTPUT
ENABLE
BUFFER
8
8
ROW
DECODER
COLUMN
DECODER
SENSE
AMPS
8
UPPER BYTE OUTPUT ENABLE
LOWER BYTE OUTPUT ENABLE
UPPER
BYTE
OUTPUT
BUFFER
A[15:0]
16
ADDRESS
BUFFER
8
E
CHIP
ENABLE
BUFFER
16
64K x 16
BIT
MEMORY
ARRAY
16
8
LOWER
BYTE
OUTPUT
BUFFER
UPPER
BYTE
WRITE
DRIVER
8
W
WRITE
ENABLE
BUFFER
8
FINAL
WRITE
DRIVERS
8
8
DQU[15:8]
UB
LB
UB
BYTE
ENABLE
BUFFER
UPPER BYTE WRITE ENABLE
LOWER BYTE WRITE ENABLE
LOWER
BYTE
WRITE
DRIVER
8
DQL[7:0]
LB
Table 1 – Pin Functions
Signal Name
A 
E
W
G
UB
LB
DQ 
V
DD
V
SS 
DC 
NC 
Function
Address Input 
Chip Enable 
Write Enable 
Output Enable 
Upper Byte Enable
Lower Byte Enable
Data I/O 
Power Supply 
Ground 
Do Not Connect 
No Connection  
Copyright © 2013 Everspin Technologies
4
MR0A16A Rev. 7, 10/2013
MR0A16A
Figure 2 – MR0A16A Package Pinouts
A
A
A
A
A
E
DQL0
DQL1
DQL2
DQL3
V
DD
V
SS
DQL4
DQL5
DQL6
DQL7
W
A
A
A
A
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
A
A
G
UB
LB
DQU15
DQU14
DQU13
DQU12
V
SS
V
DD
DQU11
DQU10
DQU9
DQU8
DC
V
DD
V
SS
A
A
A
1
LB
DQU8
2
G
UB
DQU10
3
A0
A3
A5
A15
NC
A12
A10
A8
4
A1
A4
A6
V
SS
A14
A13
A11
A9
5
A2
E
DQL1
6
NC
DQL0
A
B
C
D
E
F
G
H
DQU9
DQL2
V
SS
V
DD
DQU14
DQU11
DQL3
V
DD
V
SS
DQL6
DQU12
DQL4
DQU13
DQL5
DQU15
NC
A7
W
V
DD
DQL7
NC
DC
44-Pin TSOP Type 2
48-Pin BGA
OPERATING MODES
Table 2 – Operating Modes
E 
1
H
L
L
L
L
L
L
L
L
G 
1
X
H
X
L
L
L
X
X
X
W 
1
X
H
X
H
H
H
L
L
L
LB 
1
X
X
H
L
H
L
L
H
L
UB 
1
X
X
H
H
L
L
H
L
L
Mode
Not selected
Output disabled
Output disabled
Lower Byte Read
Upper Byte Read
Word Read
Lower Byte Write
Upper Byte Write
Word Write
 V
DD
 Current
I
SB1
, I
SB2
I
DDR
I
DDR
I
DDR
I
DDR
I
DDR
I
DDW
I
DDW
I
DDW
DQL[7:0] 
2
Hi-Z
Hi-Z
Hi-Z
D
Out
Hi-Z
D
Out
D
in
Hi-Z
D
in
DQU[15:8] 
2
Hi-Z
Hi-Z
Hi-Z
Hi-Z
D
Out
D
Out
Hi-Z
D
in
D
in
Notes:
1.  H = high, L = low, X = don’t care
2.  Hi-Z = high impedance
Copyright © 2013 Everspin Technologies
5
MR0A16A Rev. 7, 10/2013
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参数对比
与MR0A16AYS35R相近的元器件有:MR0A16AVYS35R、MR0A16AVYS35。描述及对比如下:
型号 MR0A16AYS35R MR0A16AVYS35R MR0A16AVYS35
描述 Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44
是否Rohs认证 符合 符合 符合
零件包装代码 TSOP2 TSOP2 TSOP2
包装说明 TSOP2, TSOP44,.46,32 TSOP2, TSOP44,.46,32 TSOP2, TSOP44,.46,32
针数 44 44 44
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 35 ns 35 ns 35 ns
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
长度 18.41 mm 18.41 mm 18.41 mm
内存密度 1048576 bit 1048576 bit 1048576 bit
内存集成电路类型 MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
内存宽度 16 16 16
混合内存类型 N/A N/A N/A
功能数量 1 1 1
端子数量 44 44 44
字数 65536 words 65536 words 65536 words
字数代码 64000 64000 64000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 105 °C 105 °C
最低工作温度 - -40 °C -40 °C
组织 64KX16 64KX16 64KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2 TSOP2
封装等效代码 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度) 260 NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm
最大待机电流 0.028 A 0.012 A 0.028 A
最大压摆率 0.155 mA 0.165 mA 0.165 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 NOT SPECIFIED NOT SPECIFIED
宽度 10.16 mm 10.16 mm 10.16 mm
厂商名称 Everspin Technologies - Everspin Technologies
Base Number Matches 1 1 -
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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