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MR27V402DTP

描述:
OTP ROM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44
分类:
存储    存储   
文件大小:
114KB,共12页
制造商:
概述
OTP ROM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
TSOP2
包装说明
TSOP2,
针数
44
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
100 ns
备用内存宽度
8
JESD-30 代码
R-PDSO-G44
长度
18.41 mm
内存密度
4194304 bit
内存集成电路类型
OTP ROM
内存宽度
16
功能数量
1
端子数量
44
字数
262144 words
字数代码
256000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
256KX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
宽度
10.16 mm
文档预览
Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
¡
Semiconductor
MR27V402D
262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM
DESCRIPTION
1A
The MR27V402D is a 4Mbit electrically Programmable Read-Only Memory whose configuration can
be electrically switched between 262,144 word x 16bit and 524,288 word x 8bit. The MR27V402D
operates on a single +3V-3.3V power supply and is TTL compatible. Since the MR27V402D
operates asynchronously , external clocks are not required , making this device easy-to-use. The
MR27V402D is suitable as large-capacity fixed memory for microcomputers and data terminals. It is
manufactured using a CMOS double silicon gate technology and is offered in 40-pin DIP, 40-pin
SOP or 44-pin TSOP packages.
FEATURES
• 262,144 word x 16bit / 524,288 word x 8bit electrically switchable configuration
• Single +3V-3.3V power supply
• Access time
100ns access time (Vcc=+3V)
80ns access time (Vcc=+3.3V)
• Input / Output TTL compatible
• Three-state output
• Packages
40-pin plastic DIP (DIP40-P-600-2.54)
(Product name : MR27V402DRP)
40-pin plastic SOP (SOP40-P-525-1.27-K)
(Product name : MR27V402DMP)
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product name : MR27V402DTP)
November 1999
1/11
MR27V402D
PIN CONFIGURATION (TOP VIEW)
NC 1
NC 2
A17 1
A7 2
A6 3
A5 4
A4 5
A3 6
A2 7
A1 8
A0 9
CE 10
V
SS
11
OE 12
D0 13
D8 14
D1 15
D9 16
D2 17
D10 18
D3 19
D11 20
40 A8
39 A9
38 A10
37 A11
36 A12
35 A13
34 A14
33 A15
32 A16
31 BYTE/Vpp
30 V
SS
29 D15/A-1
28 D7
27 D14
26 D6
25 D13
24 D5
23 D12
22 D4
21 V
CC
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
CE 12
V
SS
13
OE 14
D0 15
D8 16
D1 17
D9 18
D2 19
D10 20
D3 21
D11 22
44 NC
43 NC
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE/Vpp
32 V
SS
31 D15/A-1
30 D7
29 D14
28 D6
27 D13
26 D5
25 D12
24 D4
23 V
CC
40-pin DIP , SOP
44-pin TSOP (II)
PIN NAMES
D15/A-1
A0-A17
D0-D14
CE
OE
V
CC
V
SS
BYTE/V
PP
NC
Address input
Data output
Chip enable
Output enable
FUNCTIONS
Data output / Address input
Power supply voltage
GND
Mode switch / Program power supply voltage
Non connection
2/11
MR27V402D
BLOCK DIAGRAM
A-1
X8/X16 Switch
CE
OE
BYTE/V
PP
PGM
CE
OE
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
Row Decoder
Memory Matrix
Address Buffer
262,144X16-Bit or 524,288X8-Bit
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D10
D9
D12
D14
D15
D11
D13
In 8-bit output mode, these pins are
three-stated and pin D15 functions
as the A-1 address pin.
FUNCTION TABLE
MODE
READ (16-Bit)
READ (8-Bit)
OUTPUT DISABLE
STAND-BY
PROGRAM
PROGRAM INHIBIT
PROGRAM VERIFY
*: Don't Care
CE
L
L
L
H
L
H
H
OE BYTE/V
PP
L
L
H
*
H
H
L
9.75V
4.0V
H
L
H
L
H
L
3.0V
to
3.3V
D
OUT
V
CC
D0 - D7
D8 - D14
D
OUT
Hi-Z
Hi-Z
*
Hi-Z
*
D
IN
Hi-Z
D
OUT
D15/A-1
L/H
3/11
MR27V402D
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Program power supply voltage
Power dissipation per package
Symbol
Topr
T
stg
V
I
V
O
V
CC
V
PP
P
D
-
relative to V
SS
Condition
-
Value
0 to 70
-55 to 125
-0.5 to V
CC
+ 0.5
-0.5 to V
CC
+0.5
-0.5 to 5
-0.5 to 11.5
1.0
Unit
°C
°C
V
V
V
V
W
RECOMMENDED OPERATING CONDITIONS
(Ta=0 to 70
°C)
Parameter
V
CC
power supply voltage
V
PP
power supply voltage
Input "H" level
Input "L" level
Voltage is relative to Vss
* : Vcc+1.5V (Max.) when pulse width of overshoot is less than 10nS.
** : -1.5V (Min.) when pulse width of undershoot is less than 10nS.
Symbol
V
CC
V
PP
V
IH
V
IL
V
CC
=2.7V-3.6V
Condition
Min.
2.7
-0.5
2.2
-0.5**
Typ.
-
-
-
-
Max.
3.6
V
CC
+0.5
V
CC
+0.5*
0.6
Unit
V
V
V
V
4/11
参数对比
与MR27V402DTP相近的元器件有:MR27V402DMP、MR27V402DRP。描述及对比如下:
型号 MR27V402DTP MR27V402DMP MR27V402DRP
描述 OTP ROM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44 OTP ROM, 256KX16, 100ns, CMOS, PDSO40, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-40 OTP ROM, 256KX16, 100ns, CMOS, PDIP40, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-40
零件包装代码 TSOP2 SOIC DIP
包装说明 TSOP2, SOP, DIP,
针数 44 40 40
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 100 ns 100 ns 100 ns
备用内存宽度 8 8 8
JESD-30 代码 R-PDSO-G44 R-PDSO-G40 R-PDIP-T40
长度 18.41 mm 26 mm 51.98 mm
内存密度 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 OTP ROM OTP ROM OTP ROM
内存宽度 16 16 16
功能数量 1 1 1
端子数量 44 40 40
字数 262144 words 262144 words 262144 words
字数代码 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 256KX16 256KX16 256KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 SOP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 2.5 mm 5.08 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V
表面贴装 YES YES NO
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING THROUGH-HOLE
端子节距 0.8 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL
宽度 10.16 mm 10.7 mm 15.24 mm
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd -
Base Number Matches - 1 1
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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