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MR27V452D-XXMP

MASK ROM, 256KX16, 80ns, CMOS, PDSO40, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-40

器件类别:存储    存储   

厂商名称:LAPIS Semiconductor Co Ltd

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
SOIC
包装说明
SOP, SOP40,.56
针数
40
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
80 ns
备用内存宽度
8
JESD-30 代码
R-PDSO-G40
JESD-609代码
e0
长度
26 mm
内存密度
4194304 bit
内存集成电路类型
MASK ROM
内存宽度
16
功能数量
1
端子数量
40
字数
262144 words
字数代码
256000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
256KX16
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP40,.56
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
电源
3.3 V
认证状态
Not Qualified
座面最大高度
2.5 mm
最大待机电流
0.00005 A
最大压摆率
0.07 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
宽度
10.7 mm
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Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
¡
Semiconductor
MR27V452D
262,144-Word x 16-Bit or 524,288-Word x 8-Bit
8-Word x 16-Bit or 16-Word x 8-Bit Page Mode
Production Programmed Read Only Memory (P2ROM)
DESCRIPTION
1A
The MR27V452D is a 4Mbit Production Programmed Read-Only Memory (P2ROM) with page
mode. Its configuration can be electrically switched between 262,144 word x 16bit and 524,288 word
x 8bit. The MR27V452D operates on a single +3.3V power supply and is TTL compatible. The MR27
V452D provides Page mode which can greatly reduce the read access time. Since the MR27V452D
operates asynchronously , external clocks are not required , making this device easy-to-use. The
MR27V452D is suitable as large-capacity fixed memory for microcomputers and data terminals. It is
manufactured using a CMOS double silicon gate technology and is offered in 40-pin DIP , 40-pin
SOP or 44-pin TSOP packages.
FEATURES
• 262,144 word x 16bit / 524,288 word x 8bit electrically switchable configuration
• Single +3.3V power supply
• Access time 80ns
Page mode access time 30ns
• Input / Output TTL compatible
• Three-state output
• Packages
40-pin plastic DIP (DIP40-P-600-2.54)
(Product name : MR27V452D-xxRP)
40-pin plastic SOP (SOP40-P-525-1.27-K)
(Product name : MR27V452D-xxMP)
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product name : MR27V452D-xxTP)
November 1999
1/7
MR27V452D
PIN CONFIGURATION (TOP VIEW)
NC 1
NC 2
A17 1
A7 2
A6 3
A5 4
A4 5
A3 6
A2 7
A1 8
A0 9
CE 10
V
SS
11
OE 12
D0 13
D8 14
D1 15
D9 16
D2 17
D10 18
D3 19
D11 20
40 A8
39 A9
38 A10
37 A11
36 A12
35 A13
34 A14
33 A15
32 A16
31 BYTE
30 V
SS
29 D15/A-1
28 D7
27 D14
26 D6
25 D13
24 D5
23 D12
22 D4
21 V
CC
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
CE 12
V
SS
13
OE 14
D0 15
D8 16
D1 17
D9 18
D2 19
D10 20
D3 21
D11 22
44 NC
43 NC
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE
32 V
SS
31 D15/A-1
30 D7
29 D14
28 D6
27 D13
26 D5
25 D12
24 D4
23 V
CC
40-pin DIP , SOP
44-pin TSOP (II)
PIN NAMES
D15/A-1
A0 - A17
D0 - D14
CE
OE
V
CC
V
SS
BYTE
NC
Address input
Data output
Chip enable
Output enable
FUNCTIONS
Data output / Address input
Power supply voltage
GND
Mode switch
Non connection
2/7
MR27V452D
BLOCK DIAGRAM
A-1
X8/X16 Switch
CE
OE
BYTE
CE
OE
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
Row Decoder
Memory Matrix
Address Buffer
262,144X16-Bit or 524,288X8-Bit
Multiplexer & Page Data Latch
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D10
D9
D12
D14
D15
D11
D13
In 8-bit output mode, these pins are
three-stated and pin D15 functions
as the A-1 address pin.
FUNCTION TABLE
MODE
READ (16-Bit)
READ (8-Bit)
OUTPUT DISABLE
STAND-BY
* : Don't Care
CE
L
L
L
H
OE
L
L
H
*
BYTE
H
L
H
L
H
L
3.3V
D
OUT
V
CC
D0 - D7
D8 - D14
D
OUT
Hi-Z
Hi-Z
*
Hi-Z
*
D15/A-1
L/H
3/7
MR27V452D
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Symbol
T
opr
T
stg
V
I
V
O
V
CC
P
D
-
relative to V
SS
Condition
-
Value
0 to 70
-55 to 125
-0.5 to V
CC
+ 0.5
-0.5 to V
CC
+ 0.5
-0.5 to 5
1.0
Unit
°C
°C
V
V
V
W
RECOMMENDED OPERATING CONDITIONS FOR READ
(Ta=0 to 70
°C)
Parameter
V
CC
power supply voltage
Input "H" level
Input "L" level
Symbol
V
CC
V
IH
V
IL
V
CC
=3.0V-3.6V
Condition
Min.
3.0
2.2
-0.5**
Typ.
-
-
-
Max.
3.6
V
CC
+0.5*
0.6
Unit
V
V
V
Voltage is relative to Vss
* : Vcc+1.5V (Max.) when pulse width of overshoot is less than 10nS.
** : -1.5V (Min.) when pulse width of undershoot is less than 10nS.
4/7
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参数对比
与MR27V452D-XXMP相近的元器件有:MR27V452D-XXTP、MR27V452D-XXRP。描述及对比如下:
型号 MR27V452D-XXMP MR27V452D-XXTP MR27V452D-XXRP
描述 MASK ROM, 256KX16, 80ns, CMOS, PDSO40, 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-40 MASK ROM, 256KX16, 80ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44 MASK ROM, 256KX16, 80ns, CMOS, PDIP40, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-40
是否Rohs认证 不符合 不符合 不符合
零件包装代码 SOIC TSOP2 DIP
包装说明 SOP, SOP40,.56 TSOP2, TSOP44,.46,32 DIP, DIP40,.6
针数 40 44 40
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 80 ns 80 ns 80 ns
备用内存宽度 8 8 8
JESD-30 代码 R-PDSO-G40 R-PDSO-G44 R-PDIP-T40
JESD-609代码 e0 e0 e0
长度 26 mm 18.41 mm 51.98 mm
内存密度 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 MASK ROM MASK ROM MASK ROM
内存宽度 16 16 16
功能数量 1 1 1
端子数量 40 44 40
字数 262144 words 262144 words 262144 words
字数代码 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 256KX16 256KX16 256KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSOP2 DIP
封装等效代码 SOP40,.56 TSOP44,.46,32 DIP40,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL
电源 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 2.5 mm 1.2 mm 5.08 mm
最大待机电流 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.07 mA 0.07 mA 0.07 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES NO
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING THROUGH-HOLE
端子节距 1.27 mm 0.8 mm 2.54 mm
端子位置 DUAL DUAL DUAL
宽度 10.7 mm 10.16 mm 15.24 mm
厂商名称 LAPIS Semiconductor Co Ltd - LAPIS Semiconductor Co Ltd
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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