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MR27V802D-XXMA

描述:
MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
分类:
存储    存储   
文件大小:
71KB,共9页
制造商:
概述
MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
SOIC
包装说明
SOP, SOP44,.63
针数
44
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
100 ns
备用内存宽度
8
JESD-30 代码
R-PDSO-G44
JESD-609代码
e0
长度
28.15 mm
内存密度
8388608 bit
内存集成电路类型
MASK ROM
内存宽度
16
功能数量
1
端子数量
44
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
512KX16
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP44,.63
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3/3.3 V
认证状态
Not Qualified
座面最大高度
3.1 mm
最大待机电流
0.00005 A
最大压摆率
0.04 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
13 mm
文档预览
Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
¡
Semiconductor
MR27V802D
524,288-Word x 16-Bit or 1,048,576-Word x 8-Bit
Production Programmed Read Only Memory (P2ROM)
DESCRIPTION
1A
The MR27V802D is a 8Mbit Production Programmed Read-Only Memory (P2ROM) whose
configuration can be electrically switched between 524,288 word x 16bit and 1,048,576 word x 8bit.
The MR27V802D operates on a single +3V-3.3V power supply and is TTL compatible. Since the
MR27V802D operates asynchronously , external clocks are not required , making this device easy-
to-use. The MR27V802D is suitable as large-capacity fixed memory for microcomputers and data
terminals. It is manufactured using a CMOS double silicon gate technology and is offered in 42-pin
DIP, 44-pin SOP or 44-pin TSOP packages.
FEATURES
• 524,288 word x 16bit / 1,048,576 word x 8bit electrically switchable configuration
• Single +3V-3.3V power supply
• Access time
100ns access time (Vcc=+3V)
80ns access time (Vcc=+3.3V)
• Input / Output TTL compatible
• Three-state output
• Packages
42-pin plastic DIP (DIP42-P-600-2.54)
(Product name : MR27V802D-xxRA)
44-pin plastic SOP (SOP44-P-600-1.27-K)
(Product name : MR27V802D-xxMA)
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product name : MR27V802D-xxTP)
November 1999
1/8
MR27V802D
PIN CONFIGURATION (TOP VIEW)
A18 1
A17 2
A7 3
A6 4
A5 5
A4 6
A3 7
A2 8
A1 9
A0 10
CE 11
V
SS
12
OE 13
D0 14
D8 15
D1 16
D9 17
D2 18
D10 19
D3 20
D11 21
42 NC
41 A8
40 A9
39 A10
38 A11
37 A12
36 A13
35 A14
34 A15
33 A16
32 BYTE
31 V
SS
30 D15/A-1
29 D7
28 D14
27 D6
26 D13
25 D5
24 D12
23 D4
22 V
CC
NC 1
A18 2
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
CE 12
V
SS
13
OE 14
D0 15
D8 16
D1 17
D9 18
D2 19
D10 20
D3 21
D11 22
44 NC
43 NC
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE
32 V
SS
31 D15/A-1
30 D7
29 D14
28 D6
27 D13
26 D5
25 D12
24 D4
23 V
CC
44-pin SOP
NC 1
A18 2
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
CE 12
V
SS
13
OE 14
D0 15
D8 16
D1 17
D9 18
D2 19
D10 20
D3 21
D11 22
44 NC
43 NC
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE
32 V
SS
31 D15/A-1
30 D7
29 D14
28 D6
27 D13
26 D5
25 D12
24 D4
23 V
CC
42-pin DIP
44-pin TSOP (II)
PIN NAMES
D15/A-1
A0-A18
D0-D14
CE
OE
V
CC
V
SS
BYTE
NC
Address input
Data output
Chip enable
Output enable
FUNCTIONS
Data output / Address input
Power supply voltage
GND
Mode switch
Non connection
2/8
MR27V802D
BLOCK DIAGRAM
A-1
X8/X16 Switch
CE
OE
BYTE
CE
OE
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
Row Decoder
Memory Matrix
Address Buffer
524,288X16-Bit or 1,048,576X8-Bit
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D10
D9
D12
D14
D15
D11
D13
In 8-bit output mode, these pins are
three-stated and pin D15 functions
as the A-1 address pin.
FUNCTION TABLE
MODE
READ (16-Bit)
READ (8-Bit)
OUTPUT DISABLE
STAND-BY
*: Don't Care
CE
L
L
L
H
OE
L
L
H
*
BYTE
H
L
H
L
H
L
3.0V
to
3.3V
D
OUT
V
CC
D0 - D7
D8 - D14
D
OUT
Hi-Z
Hi-Z
*
Hi-Z
*
L/H
D15/A-1
3/8
MR27V802D
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Symbol
T
opr
T
stg
V
I
V
O
V
CC
P
D
-
relative to V
SS
Condition
-
Value
0 to 70
-55 to 125
-0.5 to V
CC
+ 0.5
-0.5 to V
CC
+0.5
-0.5 to 5
1.0
Unit
°C
°C
V
V
V
W
RECOMMENDED OPERATING CONDITIONS
(Ta=0 to 70
°C)
Parameter
V
CC
power supply voltage
Input "H" level
Input "L" level
Voltage is relative to Vss
* : Vcc+1.5V (Max.) when pulse width of overshoot is less than 10nS.
** : -1.5V (Min.) when pulse width of undershoot is less than 10nS.
Symbol
V
CC
V
IH
V
IL
V
CC
=2.7V-3.6V
Condition
Min.
2.7
2.2
-0.5**
Typ.
-
-
-
Max.
3.6
V
CC
+0.5*
0.6
Unit
V
V
V
4/8
参数对比
与MR27V802D-XXMA相近的元器件有:MR27V802D-XXTP、MR27V802D-XXRA。描述及对比如下:
型号 MR27V802D-XXMA MR27V802D-XXTP MR27V802D-XXRA
描述 MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42
是否Rohs认证 不符合 不符合 不符合
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 SOIC TSOP2 DIP
包装说明 SOP, SOP44,.63 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44 DIP, DIP42,.6
针数 44 44 42
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 100 ns 100 ns 100 ns
备用内存宽度 8 8 8
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 R-PDIP-T42
JESD-609代码 e0 e0 e0
长度 28.15 mm 18.41 mm 52 mm
内存密度 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 MASK ROM MASK ROM MASK ROM
内存宽度 16 16 16
功能数量 1 1 1
端子数量 44 44 42
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 512KX16 512KX16 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSOP2 DIP
封装等效代码 SOP44,.63 TSOP44,.46,32 DIP42,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3/3.3 V 3/3.3 V 3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 3.1 mm 1.2 mm 5.15 mm
最大待机电流 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.04 mA 0.04 mA 0.04 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V
表面贴装 YES YES NO
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING THROUGH-HOLE
端子节距 1.27 mm 0.8 mm 2.54 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 13 mm 10.16 mm 15.24 mm
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