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MRC1/2-100-1200-G-BLK

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 120ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, MELF

器件类别:无源元件    电阻器   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
Objectid
1862753710
包装说明
MELF
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
MELF
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
150 °C
最低工作温度
-55 °C
封装直径
1.6 mm
封装长度
3.25 mm
封装形状
CYLINDRICAL PACKAGE
封装形式
MELF
包装方法
Bulk
额定功率耗散 (P)
0.5 W
额定温度
70 °C
电阻
120 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
1206
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子形状
WRAPAROUND
容差
2%
工作电压
200 V
文档预览
METAL GLAZE™ HIGH POWER DENSITY
SURFACE MOUNT POWER RESISTOR
ISO-9001
Registered
OBSOLETE MRC1
MRC
SERIES
(For other size see current datasheet)
1/2 watt in 1/8 watt package (1206 footprint)
1 watt in 1/2 watt package (2010 footprint)
MRC1/2: 0.1 ohm to 10,000 ohm
MRC1: 0.05 ohm to 1.0 ohm
(contact factory for higher values)
150°C maximum operating temperature
• Superior surge handling capability
Metal Glaze
TM
thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
MRC SPECIFICATIONS:
Size Industry
Code
1
Footprint
C
1206
IRC
Type
MRC1/2
Maximum
Working Maximum
Power Rating Voltage
2
Voltage
1/2W @ 70°C
200
400
Resistance
Range (ohms)
3
0.1 to 0.99
1.0 to 10K
20 to 10K
0.05 to 0.099
0.10 to 1.0
3
E
1
2010
MRC1
1W @ 70°C
350
700
Tolerance
(±%)
3
1, 2, 5
1, 2, 5
0.25, 0.5
2, 5
1, 2, 5
TCR
(ppm/°C)
3
100
50, 100
50, 100
200
100
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Low Range
See page 8 for product dimensions, recommended solder pads, and standard packaging.
2
Not to exceed
√PxR
Consult factory for tighter TCR, tolerance, or resistance values.
MRC APPLICATIONS:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on a 2010
footprint. The MRC is recommended for applications where board real estate is a major concern. Due to the high power
density and superior surge handling capability, it is also recommended as a direct replacement on existing board
designs where standard 1206 or 2010 resistors are marginal or failing.
MRC PERFORMANCE CHARACTERISTICS:
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±(0.5% +0.01 ohm)
±(0.25% +0.01 ohm)
±(1.0% +0.01 ohm)
±(0.5% +0.01 ohm)
±(0.25% 0.01 ohm)
95% minimum coverage
±(0.5% +0.01 ohm)
±(1.0% +0.01 ohm)
±(1% +0.01 ohm)
no mechanical damage
±(1% + 0.01 ohm)
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
√PxR
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
1
OBSOLETE MRC1
MRC POWER DERATING CURVE:
120%
1000
ISO-9001
Registered
MRC REPETITIVE SURGE CURVE:
100%
Percent Relative Power
Peak Power (watts)
MRC 1
100
80%
60%
MRC 1/2
40%
10
20%
0%
30
40
50
60
70
80
90
100
110
120
130
140
150
1
0.0001
0.0010
0.0100
0.1000
1.0000
Ambient Temperature (°C)
Surge or Pulse duration (seconds)
Note: Use for repetitive pulses where the average power dissipation is
not to exceed the component rating at 70°C. Surge handling capacity
for low-repetitive surges may be significantly greater than shown above.
Contact factory for recommendations.
HOW TO ORDER:
Sample Part No.
MRC1/2 - 100 - 1000 - F - 13
IRC Type
(MRC 1/2 & MRC 1)
Temperature Coefficient
(50 or 100)
Resistance Value
(100 ohms and greater - First 3 significant figures plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohm = R250
Tolerance
(C = 0.25%, D = 0.5%, F = 1.0%, G = 2.0%, J = 5.0%)
Packaging Code*
(BLK = Bulk, 7=7" Reel, 13=13" Reel)
*See page 8 for packaging details
2
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
METAL GLAZE™ CYLINDRICAL
SURFACE MOUNT RESISTORS
ISO-9001
Registered
CHP
SERIES
- GENERAL PURPOSE (pgs. 9, 10)
MRC
SERIES
- HIGH POWER DENSITY (pgs. 11, 12)
OBSOLETE MRC1
MCHP
SERIES
- HIGH RELIABILITY (pg. 13)
CHPT
SERIES
- TEMPERATURE SENSITIVE (pgs. 14, 15)
ZCHP
SERIES
- ZEROHM JUMPERS (pg. 16)
• High power - up to 2 watts
• Low resistance - down to 0.1 ohm at 1%
tolerance
• High resistance - up to 2.21 megohm
• Precision - ±1% standard
• Low TCR - ±100ppm/°C standard
• High voltage - up to 1000 volts
• Low inductance
• Superior surge handling capability
• -55°C to +150°C operating temperature
PRODUCT HISTORY:
Military versions
Negative temperature coefficient version
Zerohm jumpers
Low-profile/minimum board real estate requirement
Superb solderability - wave and reflow
Established SPC & continuous improvement programs
Excellent service and quality record/proven reliability
High volume production capability
The CHP Surface Mount Resistor Series is a member of the RG
product family of precision Metal Glaze™ Resistors. The Metal
Glaze™ technology, developed by IRC in 1960 to meet the strin-
gent demands of the Military market, provides an unsurpassed
combination of ruggedness, performance, and low cost. Since
its development, IRC has supplied billions of units to meet the
specific requirements not only of the Military, but also to all major
users of resistive components requiring reliability, service, and
quality at a reasonable price. Proven reliability of the Metal
Glaze™ resistor family is supported by well over a billion unit
hours of life testing with no failures.
The CHP Resistor was developed in 1980 by IRC to support the
automotive move toward surface mount technology. The CHP uses
the same highly reliable Metal Glaze™ technology and materials
as its leaded counterpart. The termination and encapsulation have
been modified to provide compatibility with surface mount technol-
ogy. Since its development, the CHP has proven its reliability and
service record by becoming a "World Class Product" supporting
the surface mount needs of the Automotive, Computer, Instrumen-
tation, Telecommunication, and other industrial electronics mar-
ket.
PRODUCT DESCRIPTION:
The CHP is a precision surface mount power resistor. Its cylin-
drical shape is composed of a Metal Glaze™ resistive element
fired onto a ceramic core with capless solder terminations. The
simplicity of design and construction, provide a cost effective
solution to common applications where reliability is a major con-
cern, and also offer some unique features to surface mount tech-
nology.
The CHP uses a cylindrical high alumina ceramic for the core
of the resistor. This substrate provides excellent thermal con-
ductivity for maximum power dissipation in a minimum of board
real estate. It also provides superb mechanical strength to eas-
ily withstand stresses presented during board assembly, mount-
ing, and operation.
The Metal Glaze™ is composed of glass and metal particles
which are fired onto the ceramic substrate at approximately
1000°C. This technology provides a resistive element that is im-
pervious to environmental conditions without the need for an air-
tight encapsulation. The inherent ruggedness of this glaze can
absorb higher voltage surges and overloads than "thin-film" coun-
terparts.
To terminate the CHP, an electroless nickel barrier is applied
to the termination area. Solder is then applied by hot-solder
dipping. This technique provides reliable electrical continuity
through the termination without the use of end-caps or weld joints.
Unlike the typical "MELF", there is no "dog-bone" shape result-
ing from end-caps to interfere with "pick and place" accuracy.
The solder termination is free of silver to provide superb solder-
ability performance on both reflow and wave soldering processes.
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
3
OBSOLETE MRC1
DIMENSIONS
(Inches and (mm)):
ISO-9001
Registered
CHP FAMILY STANDARD SIZES, SOLDER PADS AND PACKAGING:
L
C
W
Size Code
B
C
D
E
F
H
Industry
Footprint
1206
1206
2010
2010
2512
3610
Actual Size
L
0.128±0.007
(3.25±0.18)
0.128±0.007
(3.25±0.18)
0.200±0.010
(5.08±0.25)
0.200±0.010
(5.08±0.25)
0.251±0.010
(6.38±0.25)
0.367±0.010
(9.32±0.25)
W
0.057±0.006
(1.45±0.15)
0.063±0.010
(1.60±0.25)
0.079±0.006
(2.01±0.15)
0.105±0.006
(2.67±0.15)
0.079±0.006
(2.01±0.15)
0.105±0.006
(2.67±0.15)
C
0.020±0.010
(0.51±0.25)
0.020±0.010
(0.51±0.25)
0.030±0.010
(0.761±0.25)
0.040±0.015
(1.02±0.38)
0.040±0.010
(1.02±0.25)
0.050±0.010
(1.27±0.25)
RECOMMENDED SOLDER PAD DIMENSIONS (REFLOW):
To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a
large repeatable solder fillet to the CHP resistor on reflow processes and will provide maximum heat transfer to the PC
board in high power applications. By placing the CHP on the solder paste while the paste is in the "tacky" state, the CHP
will be held in position until solder reflow begins. The pad design then uses the surface tension of the molten solder to
pull the component to the center of the solder pad. The placement of a via rising above the board level directly beneath
the CHP is not recommended.
Size
Code
B&C
D
E
F
H
Industry
Footprint
1206
2010
2010
2512
3610
Dimensions (Inches and (mm))
A
0.076
(1.93)
0.111
(2.82)
0.170
(4.32)
0.121
(3.07)
0.170
(4.32)
B
0.093
(2.36)
0.126
(3.20)
0.160
(4.06)
0.126
(3.20)
0.160
(4.06)
C
0.058
(1.47)
0.096
(2.44)
0.072
(1.83)
0.127
(3.23)
0.213
(5.41)
D
E
F
0.211
(5.36)
0.318
(8.08)
0.098 0.032
(2.49) (0.81)
0.152 0.040
(3.86) (1.02)
A
B
E
F
C
A
0.132 0.044 0.412
(3.35) (1.12) (10.46)
0.183 0.040
(4.65) (1.02)
0.369
(9.37)
D
0.273 0.044 0.553
(6.93) (1.12) (14.05)
STANDARD REEL PACKAGING PER EIA-481:
Size Code
B&C
D
E
F
H
Industry Footprint
1206
2010
2010
2512
3610
Reel Diameter*
7"
13"
7"
13"
7"
13"
13"
7"
Quantity Per Reel
2,500 max.
10,000 max.
1,500 max.
5,000 max.
1,500 max.
5,000 max.
5,000 max.
1,500 max.
12mm
24mm
4mm
4mm
12mm
12mm
4mm
4mm
8mm
4mm
Carrier Tape Component
Pitch
Width
* The 13" reel is considered standard and will be supplied unless otherwise specified.
4
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
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