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MSA3G-01DB-BU

Fixed Attenuator, 0MHz Min, 10000MHz Max

器件类别:无线/射频/通信    射频和微波   

厂商名称:Mini-Systems Inc (MSI)

厂商官网:http://www.mini-systemsinc.com

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器件参数
参数名称
属性值
厂商名称
Mini-Systems Inc (MSI)
Reach Compliance Code
compliant
标称衰减
1 dB
特性阻抗
50 Ω
构造
COMPONENT
最大输入功率 (CW)
26.99 dBm
JESD-609代码
e4
最大工作频率
10000 MHz
最小工作频率
射频/微波设备类型
FIXED ATTENUATOR
端子面层
GOLD
最大电压驻波比
1.5
文档预览
Thick Film Chip Attenuators
MSA1, MSA3
MSA4, MSA5
MSA6
INPUT
OUTPUT
INPUT
OUTPUT
INPUT
OUTPUT
GROUND
GROUND
GROUND
Wire and ribbon bondable and Flipchip thick film
chip attenuators, printed and fired on 96% alumina.
Provides attenuation accuracy for frequencies
through 10 Ghz. Double layer terminations provide
additional bonding surface. Abrasive trimming
ensures optimum resistor stability. Diamond sawed
for dimensional uniformity and accuracy. Advanced
processing techniques, and Hi-Rel construction assure
optimum performance.
PART NUMBER DESIGNATION
EXAMPLE:
MSA3G-01dB-BU
MSA-3 Series, Gold Termination, -1dB, Back Metal, Untinned
____________________________________________
Style:
MSA
Mini-Systems Attenuator
____________________________________________
Type:
3
1, 3, 4, 5, 6
____________________________________________
Termination:
G
G = Gold
Material:
PG = Platinum Gold
Base Metal
:
PS = Palladium Silver
____________________________________________
dB Value:
01dB
____________________________________________
Metal Options:
B
B = Back Metal
Blank = No Metal Options
____________________________________________
Option:
U
U = Untinned
No Solder
S = Soldered
Packaged in chip trays if not specified
____________________________________________
18
E-mail: msithick@mini-systemsinc.com
Web site: http://www.Mini-SystemsInc.com
MADE IN AMERICA
8023 Rev B 0604
Thick Film Chip Attenuators
____________________________________________
MSA
1
, MSA
3
____________________________________________
Size
____________________________________________
MSA1 = 0.320" x 0.240" x 0.030" (±0.005")
MSA3 = 0.155" x 0.125" x 0.030" (±0.005")
Substrate
96% Alumina
Bond Pads
Wire Bondable, Ribbon Bondable, or Solderable
Attenuation
-1dB Through -20dB.
Consult Sales For 0.5dB Steps
Ranges
Attenuation
±0.5dB
Accuracy
Frequency
DC Through 10 GHz
Range
Impedance
50
Ω
Vswr
1.5:1 Max.
Power
MSA1 = 1W
Rating
MSA3 = 500mW
MSA
6
____________________________________________
Size
Substrate
Bond Pads
Attenuation
Ranges
Attenuation
Accuracy
Frequency
Range
Impedance
Vswr
Power
Rating
MSA6 = 0.090" x 0.050" x 0.011" (±0.002")
96% Alumina
Wire Bondable, Ribbon Bondable, or Solderable
-1dB Through -20dB.
Consult Sales For 0.5dB Steps
±0.5dB
DC Through 10 GHz
50
Ω
1.5:1 Max.
MSA6 = 125mW
____________________________________________
____________________________________________
____________________________________________
Other configurations and impedances are available
Higher power ratings available
MSA
4
, MSA
5
____________________________________________
Size
MSA4 = 0.155" x 0.125" x 0.030" (±0.005")
MSA5 = 0.320" x 0.240" x 0.030" (±0.005")
Substrate
96% Alumina
Bond Pads
Wire Bondable, Ribbon Bondable, or Solderable
Attenuation
-1dB Through -20dB.
Consult Sales For 0.5dB Steps
Ranges
Attenuation
±0.5dB
Accuracy
Frequency
DC Through 10 GHz
Range
Impedance
50
Ω
Vswr
1.5:1 Max.
Power
MSA4 = 500mW
Rating
MSA5 = 1W
____________________________________________
MADE IN AMERICA
8023 Rev B 0604
19
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