2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
厂商名称:OKI
厂商官网:http://www.oki.com
下载文档型号 | MSC23237D | MSC23237D-60BS18 | MSC23237D-70BS18 | MSC23237D-XXBS18 | MSC23237D-60DS18 | MSC23237D-70DS18 | MSC23237D-XXDS18 |
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描述 | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE |
厂商名称 | - | OKI | OKI | - | OKI | OKI | - |
零件包装代码 | - | SIMM | SIMM | - | SIMM | SIMM | - |
针数 | - | 72 | 72 | - | 72 | 72 | - |
Reach Compliance Code | - | unknow | unknown | - | unknow | unknow | - |
ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - |
访问模式 | - | FAST PAGE | FAST PAGE | - | FAST PAGE | FAST PAGE | - |
最长访问时间 | - | 60 ns | 70 ns | - | 60 ns | 70 ns | - |
JESD-30 代码 | - | R-XSMA-N72 | R-XSMA-N72 | - | R-XSMA-N72 | R-XSMA-N72 | - |
内存密度 | - | 75497472 bi | 75497472 bit | - | 75497472 bi | 75497472 bi | - |
内存集成电路类型 | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - |
内存宽度 | - | 36 | 36 | - | 36 | 36 | - |
功能数量 | - | 1 | 1 | - | 1 | 1 | - |
端口数量 | - | 1 | 1 | - | 1 | 1 | - |
端子数量 | - | 72 | 72 | - | 72 | 72 | - |
字数 | - | 2097152 words | 2097152 words | - | 2097152 words | 2097152 words | - |
字数代码 | - | 2000000 | 2000000 | - | 2000000 | 2000000 | - |
工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - |
最高工作温度 | - | 70 °C | 70 °C | - | 70 °C | 70 °C | - |
组织 | - | 2MX36 | 2MX36 | - | 2MX36 | 2MX36 | - |
封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - |
封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - |
标称供电电压 (Vsup) | - | 5 V | 5 V | - | 5 V | 5 V | - |
表面贴装 | - | NO | NO | - | NO | NO | - |
技术 | - | CMOS | CMOS | - | CMOS | CMOS | - |
温度等级 | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - |
端子形式 | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | - |
端子位置 | - | SINGLE | SINGLE | - | SINGLE | SINGLE | - |