型号
- 型号
- 关键词
| 型号 | MSC2330B-60KS4 | MSC2330B-10YS4 | MSC2330B-70YS4 | MSC2330A-80YS16 |
|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 512KX8, 60ns, CMOS, | Fast Page DRAM Module, 512KX8, 100ns, CMOS, PSMA30, | Fast Page DRAM Module, 512KX8, 70ns, CMOS, PSMA30, | Fast Page DRAM Module, 512KX8, 80ns, CMOS, PSMA72, |
| 包装说明 | , SIP30,.2 | SIMM, SIM30 | SIMM, SIM30 | SIMM, SSIM72 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| 最长访问时间 | 60 ns | 100 ns | 70 ns | 80 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| 内存密度 | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 端子数量 | 30 | 30 | 30 | 72 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装等效代码 | SIP30,.2 | SIM30 | SIM30 | SSIM72 |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 |
| 最大待机电流 | 0.004 A | 0.004 A | 0.004 A | 0.016 A |
| 最大压摆率 | 0.19 mA | 0.13 mA | 0.17 mA | 0.616 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| JESD-30 代码 | - | R-PSMA-N30 | R-PSMA-N30 | R-PSMA-N72 |
| 封装代码 | - | SIMM | SIMM | SIMM |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD |
