型号
- 型号
- 关键词
| 型号 | MSC23833-60DS16 | MSC23833-80BS16 | MSC23833-70DS16 |
|---|---|---|---|
| 描述 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, PSMA72, | Fast Page DRAM Module, 8MX32, 80ns, CMOS, PSMA72, | Fast Page DRAM Module, 8MX32, 70ns, CMOS, PSMA72, |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
| Reach Compliance Code | unknown | unknown | unknown |
| 最长访问时间 | 60 ns | 80 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| 内存密度 | 268435456 bit | 268435456 bit | 268435456 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 32 | 32 | 32 |
| 端子数量 | 72 | 72 | 72 |
| 字数 | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 8MX32 | 8MX32 | 8MX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIMM | SIMM | SIMM |
| 封装等效代码 | SSIM72 | SSIM72 | SSIM72 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 |
| 座面最大高度 | 33.02 mm | 33.02 mm | 33.02 mm |
| 自我刷新 | NO | NO | NO |
| 最大待机电流 | 0.016 A | 0.016 A | 0.016 A |
| 最大压摆率 | 0.84 mA | 0.68 mA | 0.76 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE |
| ECCN代码 | EAR99 | - | EAR99 |
无线连接
嵌入式系统
Microchip MCU
DigiKey得捷技术专区
stm32/stm8
嵌入式系统
