| 型号 | MSM511002B-10RS | MSM511002B-60ZS | 380LX561M160H032 | MSM511002B-60RS | MSM511002B-10ZS | MSM511002B-10JS |
|---|---|---|---|---|---|---|
| 描述 | Static Column DRAM, 1MX1, 100ns, CMOS, PDIP18 | Static Column DRAM, 1MX1, 60ns, CMOS, PZIP20 | Latest available ratings, worldwide | Static Column DRAM, 1MX1, 60ns, CMOS, PDIP18 | Static Column DRAM, 1MX1, 100ns, CMOS, PZIP20 | Static Column DRAM, 1MX1, 100ns, CMOS, PDSO20 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | DIP, DIP18,.3 | ZIP, ZIP20,.1 | - | DIP, DIP18,.3 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 |
| Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknow |
| 最长访问时间 | 100 ns | 60 ns | - | 60 ns | 100 ns | 100 ns |
| I/O 类型 | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 | R-PZIP-T20 | - | R-PDIP-T18 | R-PZIP-T20 | R-PDSO-J20 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 内存密度 | 1048576 bit | 1048576 bit | - | 1048576 bit | 1048576 bit | 1048576 bi |
| 内存集成电路类型 | STATIC COLUMN DRAM | STATIC COLUMN DRAM | - | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM |
| 内存宽度 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 18 | 20 | - | 18 | 20 | 20 |
| 字数 | 1048576 words | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | - | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | - | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | ZIP | - | DIP | ZIP | SOJ |
| 封装等效代码 | DIP18,.3 | ZIP20,.1 | - | DIP18,.3 | ZIP20,.1 | SOJ20/26,.34 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | - | 512 | 512 | 512 |
| 最大待机电流 | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.06 mA | 0.09 mA | - | 0.09 mA | 0.06 mA | 0.06 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | - | NO | NO | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | ZIG-ZAG | - | DUAL | ZIG-ZAG | DUAL |