与MSM5248-01相近的元器件有:MSM5248-01MS、MSM5248-01RS。描述及对比如下:
| 型号 |
MSM5248-01 |
MSM5248-01MS |
MSM5248-01RS |
| 描述 |
Speech Synthesizer, 3s, CMOS |
Speech Synthesizer, 3s, CMOS, PDSO24 |
Speech Synthesizer, 3s, CMOS, PDIP18 |
| 厂商名称 |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
| 包装说明 |
, DIE OR CHIP |
SOP, SOP24,.4 |
DIP, DIP18,.3 |
| Reach Compliance Code |
unknow |
unknow |
unknow |
| 商用集成电路类型 |
SPEECH SYNTHESIZER |
SPEECH SYNTHESIZER |
SPEECH SYNTHESIZER |
| 最高工作温度 |
60 °C |
60 °C |
60 °C |
| 最低工作温度 |
-10 °C |
-10 °C |
-10 °C |
| 封装等效代码 |
DIE OR CHIP |
SOP24,.4 |
DIP18,.3 |
| 电源 |
3.1 V |
3.1 V |
3.1 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| 最长读取时间 |
3 s |
3 s |
3 s |
| 最大压摆率 |
1 mA |
1 mA |
1 mA |
| 技术 |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 是否Rohs认证 |
- |
不符合 |
不符合 |
| JESD-30 代码 |
- |
R-PDSO-G24 |
R-PDIP-T18 |
| JESD-609代码 |
- |
e0 |
e0 |
| 端子数量 |
- |
24 |
18 |
| 封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
- |
SOP |
DIP |
| 封装形状 |
- |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
- |
SMALL OUTLINE |
IN-LINE |
| 表面贴装 |
- |
YES |
NO |
| 端子面层 |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| 端子形式 |
- |
GULL WING |
THROUGH-HOLE |
| 端子节距 |
- |
1.27 mm |
2.54 mm |
| 端子位置 |
- |
DUAL |
DUAL |