与MSM548512D-80GS相近的元器件有:MSM548512D-12GS、MSM548512D-10RS、MSM548512L-10GS、MSM548512D-80RS、MSM548512L-80GS。描述及对比如下:
| 型号 |
MSM548512D-80GS |
MSM548512D-12GS |
MSM548512D-10RS |
MSM548512L-10GS |
MSM548512D-80RS |
MSM548512L-80GS |
| 描述 |
Memory IC, 512KX8, CMOS, PDSO32 |
Memory IC, 512KX8, CMOS, PDSO32 |
Memory IC, 512KX8, CMOS, PDIP32 |
Memory IC, 512KX8, CMOS, PDSO32 |
Memory IC, 512KX8, CMOS, PDIP32 |
Memory IC, 512KX8, CMOS, PDSO32 |
| 是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
| 厂商名称 |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
| 包装说明 |
SOP, SOP32,.56 |
SOP, SOP32,.56 |
DIP, DIP32,.6 |
SOP, SOP32,.56 |
DIP, DIP32,.6 |
SOP, SOP32,.56 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| 最长访问时间 |
80 ns |
120 ns |
100 ns |
100 ns |
80 ns |
80 ns |
| I/O 类型 |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 代码 |
R-PDSO-G32 |
R-PDSO-G32 |
R-PDIP-T32 |
R-PDSO-G32 |
R-PDIP-T32 |
R-PDSO-G32 |
| JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| 内存密度 |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
| 内存宽度 |
8 |
8 |
8 |
8 |
8 |
8 |
| 端子数量 |
32 |
32 |
32 |
32 |
32 |
32 |
| 字数 |
524288 words |
524288 words |
524288 words |
524288 words |
524288 words |
524288 words |
| 字数代码 |
512000 |
512000 |
512000 |
512000 |
512000 |
512000 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| 组织 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
| 输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
SOP |
SOP |
DIP |
SOP |
DIP |
SOP |
| 封装等效代码 |
SOP32,.56 |
SOP32,.56 |
DIP32,.6 |
SOP32,.56 |
DIP32,.6 |
SOP32,.56 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
| 电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| 自我刷新 |
NO |
NO |
NO |
YES |
NO |
YES |
| 最大待机电流 |
0.0002 A |
0.0002 A |
0.0002 A |
0.0002 A |
0.0002 A |
0.0002 A |
| 最小待机电流 |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| 最大压摆率 |
0.075 mA |
0.075 mA |
0.075 mA |
0.075 mA |
0.075 mA |
0.075 mA |
| 标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| 表面贴装 |
YES |
YES |
NO |
YES |
NO |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| 端子形式 |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
| 端子节距 |
1.27 mm |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |