Video DRAM, 256KX16, 70ns, CMOS, PDSO64, 0.525 INCH, 0.80 MM PITCH, PLASTIC, SSOP-64
厂商名称:LAPIS Semiconductor Co Ltd
下载文档型号 | MSM54V16273-70GS-K | MSM54V16273-60TS-K | MSM54V16273-60GS-K | MSM54V16273-70TS-K |
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描述 | Video DRAM, 256KX16, 70ns, CMOS, PDSO64, 0.525 INCH, 0.80 MM PITCH, PLASTIC, SSOP-64 | Video DRAM, 256KX16, 60ns, CMOS, PDSO64, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/64 | Video DRAM, 256KX16, 60ns, CMOS, PDSO64, 0.525 INCH, 0.80 MM PITCH, PLASTIC, SSOP-64 | Video DRAM, 256KX16, 70ns, CMOS, PDSO64, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/64 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SSOP | TSOP2 | SSOP | TSOP2 |
包装说明 | SSOP, SOP64,.54,32 | TSSOP, TSSOP64/70,.46 | SSOP, SOP64,.54,32 | TSSOP, TSSOP64/70,.46 |
针数 | 64 | 70/64 | 64 | 70/64 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 70 ns | 60 ns | 60 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
JESD-30 代码 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 | R-PDSO-G64 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 26 mm | 23.49 mm | 26 mm | 23.49 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM |
内存宽度 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 |
端子数量 | 64 | 64 | 64 | 64 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | TSSOP | SSOP | TSSOP |
封装等效代码 | SOP64,.54,32 | TSSOP64/70,.46 | SOP64,.54,32 | TSSOP64/70,.46 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.5 mm | 1.2 mm | 2.5 mm | 1.2 mm |
自我刷新 | YES | YES | YES | YES |
最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
最大压摆率 | 0.16 mA | 0.15 mA | 0.16 mA | 0.15 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.65 mm | 0.8 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.5 mm | 10.16 mm | 10.5 mm | 10.16 mm |
厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |