与MSM65P516JS相近的元器件有:MSM65516SS、MSM65516JS。描述及对比如下:
| 型号 |
MSM65P516JS |
MSM65516SS |
MSM65516JS |
| 描述 |
Microcontroller, 8-Bit, UVPROM, OLMS-65K CPU, 10MHz, CMOS, PQCC68 |
Microcontroller, 8-Bit, MROM, OLMS-65K CPU, 10MHz, CMOS, PDIP64 |
Microcontroller, 8-Bit, MROM, OLMS-65K CPU, 10MHz, CMOS, PQCC68 |
| 是否Rohs认证 |
不符合 |
不符合 |
不符合 |
| 厂商名称 |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |
| Reach Compliance Code |
unknown |
unknown |
unknow |
| 具有ADC |
NO |
NO |
NO |
| 地址总线宽度 |
16 |
16 |
16 |
| 位大小 |
8 |
8 |
8 |
| CPU系列 |
OLMS-65K |
OLMS-65K |
OLMS-65K |
| DAC 通道 |
NO |
NO |
NO |
| DMA 通道 |
NO |
NO |
NO |
| 外部数据总线宽度 |
8 |
8 |
8 |
| JESD-30 代码 |
S-PQCC-J68 |
R-PDIP-T64 |
S-PQCC-J68 |
| JESD-609代码 |
e0 |
e0 |
e0 |
| 长度 |
24.23 mm |
57.6 mm |
24.23 mm |
| I/O 线路数量 |
56 |
57 |
56 |
| 端子数量 |
68 |
64 |
68 |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
| PWM 通道 |
NO |
NO |
NO |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
QCCJ |
SDIP |
QCCJ |
| 封装等效代码 |
LDCC68,1.0SQ |
SDIP64,.75 |
LDCC68,1.0SQ |
| 封装形状 |
SQUARE |
RECTANGULAR |
SQUARE |
| 封装形式 |
CHIP CARRIER |
IN-LINE, SHRINK PITCH |
CHIP CARRIER |
| 电源 |
5 V |
5 V |
5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM(字节) |
640 |
640 |
640 |
| ROM(单词) |
32768 |
32768 |
32768 |
| ROM可编程性 |
UVPROM |
MROM |
MROM |
| 速度 |
12 MHz |
12 MHz |
12 MHz |
| 最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
| 最小供电电压 |
2.7 V |
2.7 V |
2.7 V |
| 标称供电电压 |
5 V |
5 V |
5 V |
| 表面贴装 |
YES |
NO |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| 端子形式 |
J BEND |
THROUGH-HOLE |
J BEND |
| 端子节距 |
1.27 mm |
1.778 mm |
1.27 mm |
| 端子位置 |
QUAD |
DUAL |
QUAD |
| 宽度 |
24.23 mm |
19.05 mm |
24.23 mm |