MSP
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
•
Approved according CECC 40402-801
(wirewound)
•
Wide range of ohmic values (0.04
Ω
to 1 MΩ)
•
Low temperature coefficient
(± 25 ppm/°C available)
•
Good electrical insulation
•
All welded construction and molded encapsulant
•
High power ratings (up to 2.5 W)
•
Stability class 0.5
•
Pure matte tin termination
•
Compliant to RoHS directive 2002/95/EC
Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package
ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface
mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS
in millimeters
Recommended Soldering Areas
E
A
C
Z
B
W
F
F
D
X
X
SERIES AND
STYLES
MSP 1
MSP 2
MSP 3
A
6.9
11.4
14.8
B
3.8
5
6.6
C
3.8
7
7
D
2.5
5
5
E
6.5
11
14.4
F
1.4
2.4
2.4
W
2.7
5.2
5.2
X
2.9
4.1
4.1
Z
6
9.4
12.7
AVERAGE MASS
(g)
0.2
0.8
1.5
Note
• General tolerance: ± 0.2 mm
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Vishay Sfernice Series
CECC 40402-801
Metric Size
Rated Dissipation at + 25 °C,
P
25
± 5 % E24 Series
Ohmic Range in
Relation to
Tolerance
(with Prefered
Ohmic
Value Series)
± 2 % E48 Series
± 1 % E96 Series
± 0.5 % E96 Series
± 0.1 % E192 Series
Approved Range
1 % or
CECC 40402-801
Class 0.5
Limiting Element Voltage,
U
max.
AC/DC
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14
MSP 1 B
RW1
0704M
1W
0.04 to
2.2K
0.04 to
2.2K
0.04 to
2.2K
0.4 to
2.2K
-
0.5
1K
50 V
WIREWOUND
MSP 2 B
RW2
1107M
2W
0.04 to
4.7K
0.04 to
4.7K
0.04 to
4.7K
0.4 to
4.7K
-
0.5
2.2K
120 V
MSP 3 B
RW3
1607M
2.5 W
0.04 to
13K
0.05 to
13K
0.05 to
13K
0.3 to
13K
-
0.1
4.12K
200 V
MSP 1 C
-
0704M
0.5 W
-
-
10 to
332K
10 to
332K
10
332K
-
300 V
METAL FILM
MSP 2 C
-
1107M
1W
-
-
10 to
1M
10 to
1M
10
332K
-
350 V
Document Number: 50003
Revision: 02-Oct-09
For technical questions, contact:
sfer@vishay.com
MSP
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
TECHNICAL SPECIFICATIONS
(continued)
RESISTIVE TECHNOLOGY
Series
Critical Resistance
MSP 1 B
-
Wirewound
MSP 2 B
-
MSP 3 B
-
Metal Film
MSP 1 C
MSP 2 C
180K
122.5K
- 55 °C/+ 155 °C
10 kΩ to 332 kΩ
K3: ± 50 ppm/°C
K4: ± 25 ppm/°C
> 332 kΩ
-
K3: ± 50 ppm/°C
-
-
Vishay Sfernice
Temperature Coefficient
CECC 40402-801
- 55 °C/+ 200 °C
<1
Ω
± 100 ppm/°C
1
Ω
to < 10
Ω
± 50 ppm/°C
≥
10
Ω
± 25 ppm/°C
E6
10
-6
/h
E6
10
-6
/h
E0 or A
10
-4
/h
Failure Rate with CECC Approval
MECHANICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Encapsulant
Resistive Element
Ceramic Substrate
Termination
CuNi or NiCr
Alumina or Steatite
Electrolytic pure matte tin
Wirewound
Thermoset
NiCr or NiP
Alumina
Metal Film
ENVIRONMENTAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Temperature Range
Climatic Category (LCT/UCT/days)
Wirewound
- 55 °C to 275 °C
55/200/56
Metal Film
- 55 °C to 155 °C
55/125/10
PERFORMANCE
CONDITIONS
TESTS
Short Time Overload
Wirewound
Metal Film
REQUIREMENTS
Wirewound
Metal Film
CECC 40402-801
± (0.25 % + 0.05
Ω)
± 0.25 %
Load Life
Dielectric w/s Voltage
Rapid Change of
Temperature
IEC 60115-1
5
P
r
or
U
= 2
U
max.
/5 s
IEC 60115-1
90’/30’ cycles
1000 h
P
r
+ 25 °C
8000 h
P
r
IEC 60115-1
U
RMS
= 500 V/60 s
IEC 60115-1
IEC 60068-2-14 Test Na
5 cycles (30’ at LCT/30’ at UCT)
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
IEC 60115-1
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
IEC 60115-1
IEC 60068-2-3 Test Ca
95 % HR/40 °C
56 days
10 days
IEC 60115-1
IEC 60068-2-21 Test
U
e3
2 mm/10 times
IEC 60115-1
IEC 60068-2-27 Test Ea
50
g’s/half
sine/3 times by direction (i.e. 18 shocks)
IEC 60115-1
IEC 60068-2-6 Test Fc
10 Hz/2000 Hz
10 Hz/500 Hz
IEC 60115-1
IEC 60068-2-58 Solder bath
260 °C/10 s
± (0.5 % + 0.05
Ω)
±1%
± (3 % + 0.05
Ω)
-
No flashover or breakdown
Leakage current < 10 µA
± (0.25 % + 0.05
Ω)
± 0.25 %
Climatic Sequence
± (0.5 % + 0.05
Ω)
± 0.5 %
Humidity
(Steady State)
± (0.5 % + 0.05
Ω)
±1%
Substrate Bending Test
± (0.25 % + 0.05
Ω)
± (0.25 % + 0.05
Ω)
± 0.25 %
Shock
N/A
Vibration
Resistance to
Soldering Heat
Document Number: 50003
Revision: 02-Oct-09
± (0.25 % + 0.05
Ω)
± 0.25 %
± (0.5 % + 0.05
Ω)
N/A
For technical questions, contact:
sfer@vishay.com
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15
MSP
Vishay Sfernice
POWER RATING
125
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
TEMPERATURE RISE
250
HOT SPOT TEMPERATURE IN °C
RATED POWER IN
%
100
MSP B
200
M
SP
3
B
75
150
1B
MS
P
M
SP
2
B
50
MSP C
100
25
50
0
- 100
- 55
0
25 50
100
155
200
250 275
0
0
0.5
M
SP
1
C
M
SP
2
C
1
1.5
2
2.5
3
AMBIENT TEMPERATURE IN °C
RATED POWER IN W
SURFACE MOUNTING OF MSP B
Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an iron 40 W: 3 s at 350 °C.
Soldering is possible by wave, reflow and vapor phase.
NON INDUCTIVE WINDING FOR MSP B
Non inductive (Ayrton Perry) winding available.
Please consult Vishay Sfernice.
PACKAGING
In bulk (plastic bag of 100 units or multiples)
In tube:
MSP1 70 units per tube
MSP2 50 units per tube
MSP3 40 units per tube
In reel of 500 units for MSP1 and MSP2
DIMENSIONS
in millimeters - Informative Data
P
0
T
1
W
T
4
T
2
T
T
3
Cross section of tube
P
A
0
B
0
K
0
Tube
TUBE PACKAGING
T
1
MSP 1
MSP 2
MSP 3
6.6
9.2
T
2
6.8
8.7
T
3
4.6
8
T
4
4.8
7.5
Length
530
615
Reel
REEL PACKAGING
A
0
3.9
7.43
B
0
7.35
11.91
K
0
4.25
5.36
P
0
4
4
N/A
W
12
24
T
0.254
0.368
P
8
12
MARKING
Vishay Sfernice trademark, ohmic value (in
Ω),
tolerance (in %), series and style, technology, manufacturing date.
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16
For technical questions, contact:
sfer@vishay.com
Document Number: 50003
Revision: 02-Oct-09
MSP
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
ORDERING INFORMATION
MSP
SERIES
1
STYLE
B
48U7
±1%
TC
Applicable
only in “C”
technology
BA100
e3
Vishay Sfernice
TECHNOLOGY NON INDUCTIVE OHMIC VALUE TOLERANCE
WINDING
Optional
B: Wirewound
C: Metal Film
PACKAGING LEAD (Pb)-FREE
SAP PART NUMBERING GUIDELINES
M
S
P
1
B
4
8
R
7
0
F
T
2
0
E
3
GLOBAL
MODEL
MSP
OPTION
Blank
or
N
(Non
inductive
winding)
SIZE
1B
2B
3B
1C
2C
B=
Wirewound
C=
Metal film
OHMIC VALUE
The first four digits are
significant figures and the
last digit specifies the
number of zeros to follow.
R designates decimal point.
48R70
= 48.7
Ω
48701
= 48 700
Ω
10002
= 100 000
Ω
R0100
= 0.01
Ω
R4700
= 0.47
Ω
...
TOL.
B
= 0.1 %
F
=1%
G
=2%
J
=5%
K
= 10 %
TEMP.
COEF.
Blank
or
Applicable only
on metal film
technologies
1C and 2C:
E
≥
K3
or
H
≥
K4
PACKAGING
S14
= Bag
(100 pieces)
R10
= Reel
(500 pieces)
T25
= Tube
(70 pieces)
T17
= Tube
(40 pieces)
T20
= Tube
(50 pieces)
SPECIAL
As
applicable
RoHS
E3
=
Pure tin
Document Number: 50003
Revision: 02-Oct-09
For technical questions, contact:
sfer@vishay.com
www.vishay.com
17
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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