MSP
www.vishay.com
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
• According to CECC 40402-801 (wirewound)
• Wide range of ohmic values (0.04
to 1 M)
• Low temperature coefficient
(± 25 ppm/°C available)
• Good electrical insulation
• All welded construction and molded encapsulant
• High power ratings (up to 2.5 W)
• Stability class 0.5
• Pure matte tin termination
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package
ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface
mounting equipment and can withstand wave and reflow soldering techniques.
DIMENSIONS
in millimeters
E
A
C
Recommended Soldering Areas
Z
B
W
F
F
D
X
X
SERIES
MSP 1
MSP 2
MSP 3
A
6.9
11.4
14.8
B
3.8
5
6.6
C
3.8
7
7
D
2.5
5
5
E
6.5
11
14.4
F
1.4
2.4
2.4
W
2.7
5.2
5.2
X
2.9
4.1
4.1
Z
6
9.4
12.7
WEIGHT in g
0.2
0.8
1.5
Note
• General tolerance: ± 0.2 mm
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
MSP 1 B
MSP 2 B
MSP 3 B
MSP 1 C
MSP 2 C
RESISTANCE
RANGE
0.04 to 2.2K
0.04 to 4.7K
0.04 to 13K
10 to 332K
10 to 1M
RATED POWER
P
25 °C
W
1
2
2.5
0.5
1
LIMITING ELEMENT
VOLTAGE
V
50
120
200
300
350
TOLERANCE
±%
0.5, 1, 2, 5
0.5, 1, 2, 5
0.5, 1, 2, 5
0.5, 1
0.5, 1
TEMPERATURE
COEFFICIENT
± ppm/°C
25, 50, 100
25, 50, 100
25, 50, 100
25, 50
25, 50
Revision: 24-Feb-14
Document Number: 50003
1
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Vishay Sfernice Series
Metric Size
Rated Dissipation at + 25 °C,
P
25
± 5 % E24 Series
Ohmic Range in
Relation to Tolerance
(with Prefered Ohmic
Value Series)
± 2 % E48 Series
± 1 % E96 Series
± 0.5 % E96 Series
Limiting Element Voltage,
U
max.
AC/DC
Series
Critical Resistance
MSP 1 B
0704M
1W
0.04 to
2.2K
0.04 to
2.2K
0.04 to
2.2K
0.4 to
2.2K
50 V
MSP 1 B
-
WIREWOUND
MSP 2 B
1107M
2W
0.04 to
4.7K
0.04 to
4.7K
0.04 to
4.7K
0.4 to
4.7K
120 V
MSP 2 B
-
CECC 40402-801
- 55 °C/+ 200 °C
< 1
± 100 ppm/°C
1
to < 10
± 50 ppm/°C
10
± 25 ppm/°C
E6
10
-6
/h
E6
10
-6
/h
E0 or A
10
-4
/h
-
MSP 3 B
1607M
2.5 W
0.04 to
13K
0.05 to
13K
0.05 to
13K
0.3 to
13K
200 V
MSP 3 B
-
METAL FILM
MSP 1 C
0704M
0.5 W
-
-
10 to
332K
10 to
332K
300 V
MSP 1 C
180K
MSP 2 C
1107M
1W
-
-
10 to
1M
10 to
1M
350 V
MSP 2 C
122.5K
- 55 °C/+ 155 °C
10
to 332 k
K3: ± 50 ppm/°C
K4: ± 25 ppm/°C
> 332 k
-
Temperature Coefficient
Failure Rate
MECHANICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Encapsulant
Resistive Element
Ceramic Substrate
Termination
CuNi or NiCr
Alumina or Steatite
Electrolytic pure matte tin
Wirewound
Thermoset
NiCr or NiP
Alumina
Metal Film
ENVIRONMENTAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Temperature Range
Climatic Category (LCT/UCT/days)
Wirewound
- 55 °C to 275 °C
55/200/56
Metal Film
- 55 °C to 155 °C
55/125/10
Revision: 24-Feb-14
Document Number: 50003
2
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
CONDITIONS
REQUIREMENTS
Metal Film
Wirewound
CECC 40402-801
± (0.25 % + 0.05
)
Metal Film
± 0.25 %
PERFORMANCE
TESTS
Wirewound
Short Time Overload
IEC 60115-1
5
P
r
or
U
= 2
U
max.
/5 s
IEC 60115-1
90’/30’ cycles
1000 h
P
r
+ 25 °C
8000 h
P
r
IEC 60115-1
U
RMS
= 500 V/60 s
IEC 60115-1
IEC 60068-2-14 Test Na
5 cycles (30’ at LCT/30’ at UCT)
- 55 °C/+ 200 °C
- 55 °C/+ 125 °C
- 55 °C/+ 125 °C
IEC 60115-1
- 55 °C/+ 200 °C
IEC 60115-1
IEC 60068-2-3 Test Ca
95 % HR/40 °C
56 days
10 days
IEC 60115-1
IEC 60068-2-21 Test
U
e3
2 mm/10 times
IEC 60115-1
IEC 60068-2-27 Test Ea
50
g’s/half
sine/3 times by direction (i.e. 18 shocks)
IEC 60115-1
IEC 60068-2-6 Test Fc
10 Hz/2000 Hz
10 Hz/500 Hz
IEC 60115-1
IEC 60068-2-58 Solder bath
260 °C/10 s
Load Life
± (0.5 % + 0.05
)
± (3 % + 0.05
)
±1%
-
Dielectric w/s Voltage
No flashover or breakdown
Leakage current < 10 μA
± (0.25 % + 0.05
)
Rapid Change of
Temperature
± 0.25 %
Climatic Sequence
± (0.5 % + 0.05
)
± 0.5 %
Humidity
(Steady State)
± (0.5 % + 0.05
)
±1%
Substrate Bending Test
± (0.25 % + 0.05
)
± 0.25 %
Shock
± (0.25 % + 0.05
)
n/a
Vibration
Resistance to
Soldering Heat
± (0.25 % + 0.05
)
± 0.25 %
± (0.5 % + 0.05
)
n/a
POWER RATING
125
TEMPERATURE RISE
250
HOT SPOT TEMPERATURE IN °C
RATED POWER IN %
100
MSP B
200
M
SP
3
B
75
150
1B
MS
P
M
SP
2
B
50
MSP C
100
25
50
0
- 100
- 55
0
25 50
100
155
200
250 275
0
0
0.5
M
SP
1
C
M
SP
2
C
1
1.5
2
2.5
3
AMBIENT TEMPERATURE IN °C
RATED POWER IN W
SURFACE MOUNTING OF MSP B
Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an
iron 40 W: 3 s at 350 °C.
Soldering is possible by wave, reflow and vapor phase.
NON INDUCTIVE WINDING FOR MSP B
Non-inductive (Ayrton Perry) winding available.
Please consult Vishay Sfernice.
Revision: 24-Feb-14
Document Number: 50003
3
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MSP
www.vishay.com
Vishay Sfernice
PACKAGING
In bulk (plastic bag of 100 units or multiples)
In tube:
MSP1 70 units per tube
MSP2 50 units per tube
MSP3 40 units per tube
In reel of 500 units for MSP1 and MSP2
DIMENSIONS
in millimeters - Informative Data
P
0
T
1
W
T
4
T
2
T
T
3
Cross section of tube
P
A
0
B
0
K
0
Tube
TUBE PACKAGING
T1
MSP 1
MSP 2
MSP 3
6.6
9.2
T2
6.8
8.7
T3
4.6
8
T4
4.8
7.5
LENGTH
530
615
Reel
REEL PACKAGING
A0
3.9
7.43
B0
7.35
11.91
K0
4.25
5.36
P0
4
4
N/A
W
12
24
T
0.254
0.368
P
8
12
MARKING
Vishay Sfernice trademark, ohmic value (in
),
tolerance (in %), series and style, technology, manufacturing date.
ORDERING INFORMATION
MSP
SERIES
1
STYLE
B
TECHNOLOGY
B: Wirewound
C: Metal Film
48U7
±1%
TC
Applicable
only in “C”
technology
BA100
PACKAGING
e3
LEAD (Pb)-FREE
NON INDUCTIVE OHMIC VALUE TOLERANCE
WINDING
Optional
SAP PART NUMBERING GUIDELINES
M
S
P
1
B
4
8
R
7
0
F
T
2
0
E
3
GLOBAL
MODEL
MSP
OPTION
Blank
or
N
(Non
inductive
winding)
SIZE
1B
2B
3B
1C
2C
OHMIC VALUE
TOL.
B
= 0.1 %
F
=1%
G
=2%
J
=5%
K
= 10 %
TEMP.
COEF.
Blank
or
Applicable only
on metal film
technologies
1C and 2C:
H
K3
or
E
K4
PACKAGING
S14
= Bag
(100 pieces)
R10
= Reel
(500 pieces)
T25
= Tube
(70 pieces)
T17
= Tube
(40 pieces)
T20
= Tube
(50 pieces)
SPECIAL
As
applicable
RoHS
E3
=
Pure tin
The first four digits are
significant figures and the
last digit specifies the
number of zeros to follow.
R designates decimal point.
48R70
= 48.7
B
=
48701
= 48 700
Wirewound
10002
= 100 000
C
=
R0100
= 0.01
Metal film
R4700
= 0.47
...
Revision: 24-Feb-14
Document Number: 50003
4
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
DSP 与 ARM 处理器
