型号
- 型号
- 关键词
16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, 12-Bit ADC, 2 USARTs HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | MSP430F449IPZ | TPS77133DGK |
|---|---|---|
| 描述 | 16-Bit Ultra-Low-Power MCU, 60kB Flash, 2048B RAM, 12-Bit ADC, 2 USARTs HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85 | Low Iq, 150-mA Low-Dropout Linear Regulator with Power Good Output 8-VSSOP -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 |
| 零件包装代码 | QFP | MSOP |
| 包装说明 | LFQFP, QFP100,.63SQ,20 | VSSOP-8 |
| 针数 | 100 | 8 |
| Reach Compliance Code | compli | compli |
| ECCN代码 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week |
| JESD-30 代码 | S-PQFP-G100 | S-PDSO-G8 |
| JESD-609代码 | e4 | e4 |
| 长度 | 14 mm | 3 mm |
| 湿度敏感等级 | 3 | 1 |
| 端子数量 | 100 | 8 |
| 最高工作温度 | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | TSSOP |
| 封装等效代码 | QFP100,.63SQ,20 | TSSOP8,.19 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.1 mm |
| 表面贴装 | YES | YES |
| 技术 | CMOS | PMOS |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | 3 mm |
| Base Number Matches | 1 | 1 |
