PRELIMINARY
‡
256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
FLASH AND CellularRAM
™
COMBO MEMORY
Features
Stacked die Combo package
• Includes two 128Mb Flash devices
• Choice of either one 32Mb or one 64Mb
CellularRAM device
Basic configuration
Flash
• Flexible multibank architecture
• 8 Meg x 16 Async/Page/Burst interface
• Support for true concurrent operations with no
latency
CellularRAM
• Low-power, high-density design
• 2 Meg x 16 or 4 Meg x 16 configurations
• Async/Page
F_V
CC
, V
CC
Q, F_V
PP
, C_V
CC
voltages
• 1.70V (MIN)/1.95V (MAX) F_V
CC
, C_V
CC
• 1.70V (MIN)/2.24V (MAX) V
CC
Q
• 1.80V (TYP) F_V
PP
(in-system PROGRAM/ERASE)
• 12V ±5% (HV)
F_
V
PP
tolerant (factory
programming compatibility)
Fast programming Algorithm (FPA)
Enhanced suspend options
• ERASE-SUSPEND-to-READ within same bank
• PROGRAM-SUSPEND-to-READ within same
bank
• ERASE-SUSPEND-to-PROGRAM within same
bank
Each Flash contains two 64-bit chip protection
registers for security purposes
100,000 ERASE cycles per block
Cross-compatible command set support
• Extended command set
• Common Flash interface (CFI) compliant
MT28C256532W18D
MT28C256564W18D
Low Voltage, Wireless Temperature
Figure 1: 88-Ball FBGA
1
A
B
C
D
E
F
G
H
J
K
L
M
NC
2
NC
3
4
5
6
7
NC
8
NC
A4
A18
A19
C_V
SS
F_V
CC
F_V
CC
A21
A11
A5
C_LB#
RFU
C_V
SS
NC
F_CLK
A22
A12
A3
A17
RFU
F_V
PP
C_WE#
C_CE#
A9
A13
A2
A7
RFU
F_WP#
F_ADV#
A20
A10
A15
A1
A6
C_UB#
F_RST#
F_WE#
A8
A14
A16
A0
DQ8
DQ2
DQ10
DQ5
DQ13
F_WAIT#
F_CE2#
C_OE#
DQ0
DQ1
DQ3
DQ12
DQ14
DQ7
F_OE2#
NC
F_OE1#
DQ9
DQ11
DQ4
DQ6
DQ15
V
CC
Q
F_CE1#
NC
NC
NC
C_V
CC
F_V
CC
V
CC
Q
C_ZZ#
C_V
SS
V
SS
Q
V
CC
Q
F_VCC
C_V
SS
V
SS
Q
F_V
SS
C_V
SS
NC
NC
NC
NC?
Top View
(Ball Down)
NOTE:
Balls C6, E5, and G7 are only used for Flash burst operation.
Options
Flash Timing
• 60ns
1
• 70ns
Flash Burst Frequency
• 66 MHz
1
• 54 MHz
Flash Boot Block Configuration
• Top/Top
• Top/Bottom
• Bottom/Top
• Bottom/Bottom
CellularRAM Timing
• 70ns
• 85ns
I/O Voltage Range
• V
CC
Q 1.70V–2.24V
Operating Temperature Range
• Wireless Temperature (-25°C to +85°C)
Package
• 88-ball FBGA (Standard) 8 x 10 grid with eight
support balls
• 88-ball FBGA (Lead-free) 8 x 10 grid with eight
support balls
2
NOTE:
1. Contact factory for availability.
2. Contact factory for details.
09005aef80f1c46d
MT28C256564W18D.fm - Rev. C Pub 2/04 EN
1
©2004 Micron Technology, Inc. All rights reserved.
‡
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
PRELIMINARY
256Mb MULTIBANK BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Device General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Flash General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Flash Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
CellularRAM General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Boot Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
MultiChip Packaging Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Unique IDs, State Machines, and Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Flash Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Data Sheet Designation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
09005aef80f1c46d
MT28C256564W18D.fm - Rev. C Pub 2/04 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology. Inc. All rights reserved.
PRELIMINARY
256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
88-Ball FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Flash Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Part Number Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
88-Ball FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
09005aef80f1c46d
MT28C256564W18D.fm - Rev. C Pub 2/04 EN
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology. Inc. All rights reserved.
PRELIMINARY
256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Ball Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Possible Boot Configurations for Flash Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Truth Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
CFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
09005aef80f1c46d
MT28C256564W18D.fm - Rev. C Pub 2/04 EN
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology. Inc. All rights reserved.
PRELIMINARY
256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
Device General Description
The MT28C256532W18D/MT28C256564W18D com-
bination Flash and CellularRAM is a high-performance,
high-density, memory solution that can significantly
improve system performance. This memory solution is
comprised of two 128Mb Flash devices and one 32Mb
or one 64Mb CellularRAM device.
It is important to note that the specifications con-
tained in this document supersede the specifications
listed in the referenced individual Flash and Cellular-
RAM data sheets.
For all asynchronous/page Flash devices, the Burst
mode specifications in the referenced Flash discrete
data sheet should be ignored, as they do not pertain to
asynchronous/page mode operation.
Each Flash memory features eight 8K-word sectors
(8 x 65,536 bits), designated as parameter blocks, and
the remaining part is organized in main blocks of 64K
words each (524,288 bits). The parameter blocks are
addressed either by the low order addresses (bottom
boot) or by the higher order addresses (top boot).
The two Flash devices can be supplied with any
combination of top or bottom boot (e.g., top/top, bot-
tom/bottom, top/bottom, or bottom/top). Please see
Figures 2 and 3 for more information.
CellularRAM General Description
The CellularRAM architecture features high-speed
CMOS, dynamic random-access memories developed for
low-power portable applications The CellularRAM device
is available in either 32Mb or 64Mb densities.
To operate seamlessly on a burst Flash bus, Cellular-
RAM products have incorporated a transparent self-
refresh mechanism. The hidden refresh requires no
additional support from the system memory controller
and has no significant impact on device read/write per-
formance.
The configuration register (CR) is used to control how
refresh is performed on the CellularRAM array. These
registers are automatically loaded with default settings
during power-up and can be updated any time during
normal operation. Special attention has been focused
on standby current consumption during self-refresh.
CellularRAM products include three system-acces-
sible mechanisms used to minimize standby current.
Partial array refresh (PAR) limits refresh to the portion
of the memory array being used. Temperature com-
pensated refresh (TCR) is used to adjust the refresh
rate according to the ambient temperature. The
refresh rate can be decreased at lower temperatures to
minimize current consumption during standby. Deep
sleep mode halts the refresh operation altogether and
is used when no vital information is stored in the
device. These three refresh mechanisms are adjusted
through the configuration register (CR).
For device specifications and additional documenta-
tion concerning CellularRAM memory, please refer to
the MT45W2MW16PFA and MT45W4MW16PFA Cellu-
larRAM data sheets at
www.micron.com/cellularram.
Flash General Description
The Flash architecture features a multipartition
configuration that supports READ-while-PROGRAM/
ERASE operations with no latency. An 8Mb partition
size enables optimal design flexibility.
Two Flash devices are stacked to achieve the 256Mb
density. Each Flash die has a dedicated CE# and OE#
control, enabling each Flash to be independently select-
able.
The stacked Flash device enables soft protection for
blocks, as read only, by configuring soft protection reg-
isters with dedicated command sequences. For secu-
rity purposes, two user-programmable 64-bit chip
protection registers are provided for each Flash device.
The embedded WORD PROGRAM and BLOCK
ERASE functions are fully automated by an on-chip
write state machine (WSM). An on-chip device status
register can be used to monitor the WSM status and
determine the progress of the PROGRAM/ERASE tasks.
Each Flash device has a read configuration register
(RCR) that defines how the Flash interacts with the
memory bus. For device specifications and additional
documentation concerning Flash, please refer to the
MT28F1284W18 data sheet at
www.micron.com/flash.
Flash Configurations
Each Flash memory implements a multibank archi-
tecture (16 banks of 8Mb each) to allow concurrent
operations. Any address within a block address range
selects that block for the required READ, PROGRAM, or
ERASE operation.
09005aef80f1c46d
MT28C256564W18D.fm - Rev. C Pub 2/04 EN
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology. Inc. All rights reserved.
