16GB (x72, ECC, QR x8) 240-Pin DDR3L LRDIMM
Features
1.35V DDR3L SDRAM LRDIMM
MT36KSZF2G72LDZ –16GB
Features
• 240-pin, load-reduced dual in-line memory module
(LRDIMM)
• Memory buffer (MB)
• Fast data transfer rate: PC3-12800
• 16GB (2 Gig x 72)
• V
DD
= 1.35V (1.283–1.45V)
• Backward compatible to V
DD
= 1.5V ±0.075V
• V
DDSPD
= 3.0–3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data and strobe signals
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Two on-board temperature sensors
• Gold edge contacts
• Full module heat spreader
• Halogen-free
• Single load on DQ and DQS
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
–
–
–
–
1333
1333
–
–
–
CL = 9
1333
1333
–
–
–
CL = 8
1066
1066
1066
1066
–
CL = 7
1066
1066
1066
–
–
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 240-Pin LRDIMM (RC/B) MO-269
Module Height: 30.35mm (1.195 in.)
Options
• Operating temperature
– Commercial (0°C
≤
T
C
≤
+95°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
Marking
None
Z
-1G6
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef846600e0
kszf36c2gx72ldz.pdf - Rev. F 9/15 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, QR x8) 240-Pin DDR3L LRDIMM
Features
Table 2: Addressing
Parameter
Refresh count
Row address
Device bank address
Device configuration
Column address
Module rank address
16GB
8K
64K A[15:0]
8 BA[2:0]
4Gb (512 Meg x 8)
1K A[9:0]
4 S#[3:0]
Table 3: Part Numbers and Timing Parameters – 16GB Modules
Base device: MT41K512M8
1
, 4Gb DDR3L SDRAM
Part
Number
2
Module Density Configuration
16GB
2 Gig x 72
Module Band-
width
12.8 GB/s
Memory Clock/
Data Rate
1.25ns/1600 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
11-11-11
MT36KSZF2G72LDZ-1G6__
Notes:
1. The data sheet for the base device can be found on Micron’s web site.
2. All LRDIMM part numbers end with a two-place code (not shown) that designates component and PCB revi-
sions, and a two-place code (also not shown) that indicates buffer vendor and revision.
Consult factory for current revision codes. Example: MT36KSZF2G72LDZ-1G6P1B3.
PDF: 09005aef846600e0
kszf36c2gx72ldz.pdf - Rev. F 9/15 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, QR x8) 240-Pin DDR3L LRDIMM
Pin Assignments
Pin Assignments
Table 4: Pin Assignments
240-Pin DDR3 LRDIMM Front
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
REFDQ
V
SS
DQ0
DQ1
V
SS
DQS0#
DQS0
V
SS
DQ2
DQ3
V
SS
DQ8
DQ9
V
SS
DQS1#
DQS1
V
SS
DQ10
DQ11
V
SS
DQ16
DQ17
V
SS
DQS2#
DQS2
V
SS
DQ18
DQ19
V
SS
DQ24
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
DQ25
V
SS
DQS3#
DQS3
V
SS
DQ26
DQ27
V
SS
CB0
CB1
V
SS
DQS8#
DQS8
V
SS
CB2
CB3
V
SS
V
TT
V
TT
CKE0
V
DD
BA2
Err_Out#
V
DD
A11
A7
V
DD
A5
A4
V
DD
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
A2
V
DD
NF
NF
V
DD
V
DD
V
REFCA
Par_In
V
DD
BA0
V
DD
WE#
CAS#
V
DD
S1#
ODT1
V
DD
S2#
V
SS
DQ32
DQ33
V
SS
DQS4#
DQS4
V
SS
DQ34
DQ35
V
SS
DQ40
91
92
93
94
95
96
97
98
99
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
DQ41
V
SS
DQS5#
DQS5
V
SS
DQ42
DQ43
V
SS
DQ48
DQ49
V
SS
DQS6#
DQS6
V
SS
DQ50
DQ51
V
SS
DQ56
DQ57
V
SS
DQS7#
DQS7
V
SS
DQ58
DQ59
V
SS
SA0
SCL
SA2
V
TT
121
122
123
124
125
126
127
128
129
130
131
132
133
134
136
137
138
139
140
141
142
143
145
146
147
148
149
150
V
SS
DQ4
DQ5
V
SS
DQS9
DQS9#
V
SS
DQ6
DQ7
V
SS
DQ12
DQ13
V
SS
DQS10
V
SS
DQ14
DQ15
V
SS
DQ20
DQ21
V
SS
DQS11
V
SS
DQ22
DQ23
V
SS
DQ28
DQ29
240-Pin DDR3 LRDIMM Back
151
152
154
155
156
157
158
159
160
161
163
164
166
167
168
169
170
171
172
173
175
176
177
178
179
180
V
SS
DQS12
V
SS
DQ30
DQ31
V
SS
CB4
CB5
V
SS
DQS17
V
SS
CB6
CB7
V
SS
NF
RESET#
CKE1
V
DD
A15
A14
V
DD
A12
A9
V
DD
A8
A6
V
DD
A3
181
182
184
185
186
187
188
189
190
191
193
194
195
196
197
198
199
200
201
202
203
205
206
207
208
209
210
A1
V
DD
V
DD
CK0
CK0#
V
DD
EVENT#
A0
V
DD
BA1
V
DD
RAS#
S0#
V
DD
ODT0
A13
V
DD
S3#
V
SS
DQ36
DQ37
V
SS
DQS13
V
SS
DQ38
DQ39
V
SS
DQ44
DQ45
211
212
214
215
216
217
218
219
220
221
223
224
225
226
227
228
229
230
232
233
235
236
237
238
239
240
V
SS
DQS14
V
SS
DQ46
DQ47
V
SS
DQ52
DQ53
V
SS
DQS15
V
SS
DQ54
DQ55
V
SS
DQ60
DQ61
V
SS
DQS16
V
SS
DQ62
DQ63
V
SS
V
DDSPD
SA1
SDA
V
SS
V
TT
Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol
153 DQS12# 183
213 DQS14#
A10/AP 100
162 DQS17# 192
222 DQS15#
135 DQS10# 165
231 DQS16#
144 DQS11# 174
204 DQS13# 234
PDF: 09005aef846600e0
kszf36c2gx72ldz.pdf - Rev. F 9/15 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, QR x8) 240-Pin DDR3L LRDIMM
Pin Descriptions
Pin Descriptions
The pin description table below is a comprehensive list of all possible pins for all DDR3
modules. All pins listed may not be supported on this module. See Pin Assignments for
information specific to this module.
Table 5: Pin Descriptions
Symbol
Ax
Type
Input
Description
Address inputs:
Provide the row address for ACTIVE commands, and the column ad-
dress and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments Table for density-specific
addressing information.
Bank address inputs:
Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.
Clock:
Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.
Clock enable:
Enables (registered HIGH) and disables (registered LOW) internal circui-
try and clocks on the DRAM.
Data mask (x8 devices only):
DM is an input mask signal for write data. Input data
is masked when DM is sampled HIGH, along with that input data, during a write ac-
cess. Although DM pins are input-only, DM loading is designed to match that of the
DQ and DQS pins.
On-die termination:
Enables (registered HIGH) and disables (registered LOW) termi-
nation resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input
will be ignored if disabled via the LOAD MODE command.
Parity input:
Parity bit for Ax, RAS#, CAS#, and WE#.
Command inputs:
RAS#, CAS#, and WE# (along with S#) define the command being
entered.
Reset:
RESET# is an active LOW asychronous input that is connected to each DRAM
and the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitial-
ized as though a normal power-up was executed.
Chip select:
Enables (registered LOW) and disables (registered HIGH) the command
decoder.
Serial address inputs:
Used to configure the temperature sensor/SPD EEPROM ad-
dress range on the I
2
C bus.
Serial clock for temperature sensor/SPD EEPROM:
Used to synchronize communi-
cation to and from the temperature sensor/SPD EEPROM on the I
2
C bus.
Check bits:
Used for system error detection and correction.
Data input/output:
Bidirectional data bus.
Data strobe:
Differential data strobes. Output with read data; edge-aligned with
read data; input with write data; center-aligned with write data.
BAx
Input
CKx,
CKx#
CKEx
DMx
Input
Input
Input
ODTx
Input
Par_In
RAS#, CAS#, WE#
RESET#
Input
Input
Input
(LVCMOS)
Input
Input
Input
I/O
I/O
I/O
Sx#
SAx
SCL
CBx
DQx
DQSx,
DQSx#
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kszf36c2gx72ldz.pdf - Rev. F 9/15 EN
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, QR x8) 240-Pin DDR3L LRDIMM
Pin Descriptions
Table 5: Pin Descriptions (Continued)
Symbol
SDA
TDQSx,
TDQSx#
Type
I/O
Output
Description
Serial data:
Used to transfer addresses and data into and out of the temperature sen-
sor/SPD EEPROM on the I
2
C bus.
Redundant data strobe (x8 devices only):
TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are
no function.
Err_Out#
EVENT#
V
DD
V
DDSPD
V
REFCA
V
REFDQ
V
SS
V
TT
NC
NF
Output
Parity error output:
Parity error found on the command and address bus.
(open drain)
Output
Temperature event:
The EVENT# pin is asserted by the temperature sensor when crit-
(open drain) ical temperature thresholds have been exceeded.
Supply
Supply
Supply
Supply
Supply
Supply
–
–
Power supply:
1.5V ±0.075V. The component V
DD
and V
DDQ
are connected to the
module V
DD
.
Temperature sensor/SPD EEPROM power supply:
3.0–3.6V.
Reference voltage:
Control, command, and address V
DD
/2.
Reference voltage:
DQ, DM V
DD
/2.
Ground.
Termination voltage:
Used for control, command, and address V
DD
/2.
No connect:
These pins are not connected on the module.
No function:
These pins are connected within the module, but provide no functional-
ity.
PDF: 09005aef846600e0
kszf36c2gx72ldz.pdf - Rev. F 9/15 EN
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
模拟与混合信号
