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MT4067EJ-8

Page Mode DRAM, 64KX4, 80ns, MOS, PQCC18

器件类别:存储    存储   

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Micron Technology
Reach Compliance Code
not_compliant
最长访问时间
80 ns
I/O 类型
COMMON
JESD-30 代码
R-PQCC-J18
JESD-609代码
e0
内存密度
262144 bit
内存集成电路类型
PAGE MODE DRAM
内存宽度
4
端子数量
18
字数
65536 words
字数代码
64000
最高工作温度
70 °C
最低工作温度
组织
64KX4
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
QCCJ
封装等效代码
LDCC18,.33X.53
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
电源
5 V
认证状态
Not Qualified
刷新周期
256
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
MOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
QUAD
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参数对比
与MT4067EJ-8相近的元器件有:MT4067EC-15XT、MT4067EC-12XT、MT4067EC-12/883C、MT4067EC-10XT、MT4067EC-15/883C、MT4067EC-10/883C、MT4067C-20/883C、MT4067C-20。描述及对比如下:
型号 MT4067EJ-8 MT4067EC-15XT MT4067EC-12XT MT4067EC-12/883C MT4067EC-10XT MT4067EC-15/883C MT4067EC-10/883C MT4067C-20/883C MT4067C-20
描述 Page Mode DRAM, 64KX4, 80ns, MOS, PQCC18 Page Mode DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 150ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 100ns, CMOS, CQCC18, CERAMIC, LCC-18 Page Mode DRAM, 64KX4, 200ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18 Page Mode DRAM, 64KX4, 200ns, CMOS, CDIP18, 0.300 INCH, CERAMIC, DIP-18
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli not_compliant
最长访问时间 80 ns 150 ns 120 ns 120 ns 100 ns 150 ns 100 ns 200 ns 200 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PQCC-J18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 X-CQCC-N18 R-CDIP-T18 R-CDIP-T18
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
内存密度 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi 262144 bit
内存集成电路类型 PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM
内存宽度 4 4 4 4 4 4 4 4 4
端子数量 18 18 18 18 18 18 18 18 18
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000 64000 64000 64000 64000 64000
最高工作温度 70 °C 125 °C 125 °C 110 °C 125 °C 110 °C 110 °C 110 °C 70 °C
最低工作温度 - -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -
组织 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4 64KX4
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QCCJ QCCN QCCN QCCN QCCN QCCN QCCN DIP DIP
封装等效代码 LDCC18,.33X.53 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 LCC18,.3X.5 DIP18,.3 DIP18,.3
封装形状 RECTANGULAR UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 256 256 256 256 256 256 256 256 256
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES NO NO
技术 MOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL MILITARY MILITARY OTHER MILITARY OTHER OTHER OTHER COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD DUAL DUAL
厂商名称 Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology -
包装说明 - CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 CERAMIC, LCC-18 0.300 INCH, CERAMIC, DIP-18 0.300 INCH, CERAMIC, DIP-18
ECCN代码 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 - PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE
其他特性 - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
功能数量 - 1 1 1 1 1 1 1 1
端口数量 - 1 1 1 1 1 1 1 1
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
筛选级别 - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
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