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MT46H32M32LGMA-6IT:B

DDR DRAM, 32MX32, 5ns, CMOS, PBGA168, 12 X 12 MM, GREEN, PLASTIC, WFBGA-168

器件类别:存储    存储   

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

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器件参数
参数名称
属性值
厂商名称
Micron Technology
零件包装代码
BGA
包装说明
VFBGA,
针数
168
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
5 ns
其他特性
AUTO/SELF REFRESH
JESD-30 代码
S-PBGA-B168
JESD-609代码
e1
长度
14 mm
内存密度
1073741824 bit
内存集成电路类型
DDR DRAM
内存宽度
32
功能数量
1
端口数量
1
端子数量
168
字数
33554432 words
字数代码
32000000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
32MX32
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
SQUARE
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
座面最大高度
0.8 mm
自我刷新
YES
最大供电电压 (Vsup)
1.95 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
宽度
14 mm
文档预览
1Gb: x16, x32 Automotive LPDDR SDRAM
Features
Automotive Low-Power DDR SDRAM
MT46H64M16LF – 16 Meg x 16 x 4 banks
MT46H32M32LF – 8 Meg x 32 x 4 banks
MT46H32M32LG – 8 Meg x 32 x 4 banks
Features
• V
DD
/V
DDQ
= 1.70–1.95V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data; one mask
per byte
• Programmable burst lengths (BL): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• Temperature-compensated self refresh (TCSR)
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Status read register (SRR)
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh, 32ms for automotive temperature
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-5
-54
-6
-75
Clock Rate
200 MHz
185 MHz
166 MHz
133 MHz
Access Time
5.0ns
5.0ns
5.0ns
6.0ns
Options
• V
DD
/V
DDQ
– 1.8V/1.8V
• Configuration
– 64 Meg x 16 (16 Meg x 16 x 4
banks)
– 32 Meg x 32 (8 Meg x 32 x 4 banks)
• Addressing
– JEDEC-standard
– JEDEC reduced page size
• Plastic "green" package
– 60-ball VFBGA (8mm x 9mm)
1
– 90-ball VFBGA (8mm x 13mm)
2
• PoP (plastic "green" package)
– 168-ball WFBGA (12mm x 12mm)
2
• Timing – cycle time
– 5ns @ CL = 3 (200 MHz)
– 5.4ns @ CL = 3 (185 MHz)
– 6ns @ CL = 3 (166 MHz)
– 7.5ns @ CL = 3 (133 MHz)
• Power
– Standard I
DD2
/I
DD6
• Product grade
– Automotive (package-level
burn-in)
• Operating temperature range
– Commercial (0˚ to +70˚C)
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
3
• Design revision
Notes:
Marking
H
64M16
32M32
LF
LG
BF
B5
MA
-5
-54
-6
-75
None
A
None
IT
AT
:B
1. Only available for x16 configuration.
2. Only available for x32 configuration.
3. Contact factory for availability.
PDF: 09005aef84812cd1
t68m_auto_lpddr.pdf - Rev. D 10/13 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
1Gb: x16, x32 Automotive LPDDR SDRAM
Features
Table 2: Configuration Addressing
Architecture
Configuration
Refresh count
Row addressing
Column addressing
64 Meg x 16
16 Meg x 16 x 4 banks
8K
16K A[13:0]
1K A[9:0]
32 Meg x 32
8 Meg x 32 x 4 banks
8K
8K A[12:0]
1K A[9:0]
Reduced Page Size
32 Meg x 32
8 Meg x 32 x 4 banks
8K
16K A[13:0]
512 A[8:0]
Figure 1: 1Gb Mobile LPDDR Part Numbering
MT 46
Micron Technology
Product Family
46 = Mobile LPDDR
H
64M16 LF BF
-6
A
IT
:B
Design Revision
:B = Second generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
AT = Automotive (–40°C to +105°C)
Operating Voltage
H = 1.8/1.8V
Configuration
64 Meg x 16
32 Meg x 32
Product Grade
A = Automotive (package-level burn-in)
Power
Addressing
LF = JEDEC-standard
LG = JEDEC reduced page size
Blank = Standard I
DD2
/I
DD6
Cycle Time (CL = 3)
-5 = 5ns
t
CK
-54 = 5.4ns
t
CK
-6 = 6ns
t
CK
-75 = 7.5ns
t
CK
Package Codes
BF = 60-ball (8mm x 9mm) VFBGA, “green”
B5 = 90-ball (8mm x 13mm) VFBGA, “green”
MA = 168-ball (12mm x 12mm) WFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
PDF: 09005aef84812cd1
t68m_auto_lpddr.pdf - Rev. D 10/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Automotive LPDDR SDRAM
Features
Contents
General Description ......................................................................................................................................... 7
Functional Block Diagrams ............................................................................................................................... 8
Ball Assignments and Descriptions ................................................................................................................. 10
Package Dimensions ....................................................................................................................................... 15
Electrical Specifications .................................................................................................................................. 18
Electrical Specifications – I
DD
Parameters ........................................................................................................ 22
Electrical Specifications – AC Operating Conditions ......................................................................................... 28
Output Drive Characteristics ........................................................................................................................... 33
Functional Description ................................................................................................................................... 36
Commands .................................................................................................................................................... 37
DESELECT ................................................................................................................................................. 38
NO OPERATION ......................................................................................................................................... 38
LOAD MODE REGISTER ............................................................................................................................. 38
ACTIVE ...................................................................................................................................................... 38
READ ......................................................................................................................................................... 39
WRITE ....................................................................................................................................................... 40
PRECHARGE .............................................................................................................................................. 41
BURST TERMINATE ................................................................................................................................... 42
AUTO REFRESH ......................................................................................................................................... 42
SELF REFRESH ........................................................................................................................................... 43
DEEP POWER-DOWN ................................................................................................................................. 43
Truth Tables ................................................................................................................................................... 44
State Diagram ................................................................................................................................................ 49
Initialization .................................................................................................................................................. 50
Standard Mode Register .................................................................................................................................. 53
Burst Length .............................................................................................................................................. 54
Burst Type .................................................................................................................................................. 54
CAS Latency ............................................................................................................................................... 55
Operating Mode ......................................................................................................................................... 56
Extended Mode Register ................................................................................................................................. 57
Temperature-Compensated Self Refresh ...................................................................................................... 57
Partial-Array Self Refresh ............................................................................................................................ 58
Output Drive Strength ................................................................................................................................ 58
Status Read Register ....................................................................................................................................... 59
Bank/Row Activation ...................................................................................................................................... 61
READ Operation ............................................................................................................................................. 62
WRITE Operation ........................................................................................................................................... 73
PRECHARGE Operation .................................................................................................................................. 85
Auto Precharge ............................................................................................................................................... 85
Concurrent Auto Precharge ......................................................................................................................... 86
AUTO REFRESH Operation ............................................................................................................................. 91
SELF REFRESH Operation ............................................................................................................................... 92
Power-Down .................................................................................................................................................. 93
Deep Power-Down ..................................................................................................................................... 95
Clock Change Frequency ................................................................................................................................ 97
Revision History ............................................................................................................................................. 98
Rev. D – 10/13 ............................................................................................................................................. 98
Rev. C – 06/13 ............................................................................................................................................. 98
Rev. B – 03/12 ............................................................................................................................................. 98
Rev. A – 08/11 ............................................................................................................................................. 98
PDF: 09005aef84812cd1
t68m_auto_lpddr.pdf - Rev. D 10/13 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Automotive LPDDR SDRAM
Features
List of Figures
Figure 1: 1Gb Mobile LPDDR Part Numbering .................................................................................................. 2
Figure 2: Functional Block Diagram (x16) ......................................................................................................... 8
Figure 3: Functional Block Diagram (x32) ......................................................................................................... 9
Figure 4: 60-Ball VFBGA – Top View, x16 only .................................................................................................. 10
Figure 5: 90-Ball VFBGA – Top View, x32 only .................................................................................................. 11
Figure 6: 168-Ball FBGA – 12mm x 12mm (Top View), x32 only ........................................................................ 12
Figure 7: 60-Ball VFBGA (8mm x 9mm), Package Code: BF .............................................................................. 15
Figure 8: 90-Ball VFBGA (8mm x 13mm), Package Code: B5 ............................................................................. 16
Figure 9: 168-Ball WFBGA (12mm x 12mm), Package Code: MA ....................................................................... 17
Figure 10: Typical Self Refresh Current vs. Temperature .................................................................................. 27
Figure 11: ACTIVE Command ........................................................................................................................ 39
Figure 12: READ Command ........................................................................................................................... 40
Figure 13: WRITE Command ......................................................................................................................... 41
Figure 14: PRECHARGE Command ................................................................................................................ 42
Figure 15: DEEP POWER-DOWN Command ................................................................................................... 43
Figure 16: Simplified State Diagram ............................................................................................................... 49
Figure 17: Initialize and Load Mode Registers ................................................................................................. 51
Figure 18: Alternate Initialization with CKE LOW ............................................................................................ 52
Figure 19: Standard Mode Register Definition ................................................................................................. 53
Figure 20: CAS Latency .................................................................................................................................. 56
Figure 21: Extended Mode Register ................................................................................................................ 57
Figure 22: Status Read Register Timing ........................................................................................................... 59
Figure 23: Status Register Definition .............................................................................................................. 60
Figure 24: READ Burst ................................................................................................................................... 63
Figure 25: Consecutive READ Bursts .............................................................................................................. 64
Figure 26: Nonconsecutive READ Bursts ........................................................................................................ 65
Figure 27: Random Read Accesses .................................................................................................................. 66
Figure 28: Terminating a READ Burst ............................................................................................................. 67
Figure 29: READ-to-WRITE ............................................................................................................................ 68
Figure 30: READ-to-PRECHARGE .................................................................................................................. 69
Figure 31: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x16) .................................................... 70
Figure 32: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x32) .................................................... 71
Figure 33: Data Output Timing –
t
AC and
t
DQSCK .......................................................................................... 72
Figure 34: Data Input Timing ......................................................................................................................... 74
Figure 35: Write – DM Operation .................................................................................................................... 75
Figure 36: WRITE Burst ................................................................................................................................. 76
Figure 37: Consecutive WRITE-to-WRITE ....................................................................................................... 77
Figure 38: Nonconsecutive WRITE-to-WRITE ................................................................................................. 77
Figure 39: Random WRITE Cycles .................................................................................................................. 78
Figure 40: WRITE-to-READ – Uninterrupting ................................................................................................. 79
Figure 41: WRITE-to-READ – Interrupting ...................................................................................................... 80
Figure 42: WRITE-to-READ – Odd Number of Data, Interrupting ..................................................................... 81
Figure 43: WRITE-to-PRECHARGE – Uninterrupting ....................................................................................... 82
Figure 44: WRITE-to-PRECHARGE – Interrupting ........................................................................................... 83
Figure 45: WRITE-to-PRECHARGE – Odd Number of Data, Interrupting .......................................................... 84
Figure 46: Bank Read – With Auto Precharge ................................................................................................... 87
Figure 47: Bank Read – Without Auto Precharge .............................................................................................. 88
Figure 48: Bank Write – With Auto Precharge .................................................................................................. 89
Figure 49: Bank Write – Without Auto Precharge ............................................................................................. 90
Figure 50: Auto Refresh Mode ........................................................................................................................ 91
PDF: 09005aef84812cd1
t68m_auto_lpddr.pdf - Rev. D 10/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Automotive LPDDR SDRAM
Features
Figure 51:
Figure 52:
Figure 53:
Figure 54:
Figure 55:
Self Refresh Mode ..........................................................................................................................
Power-Down Entry (in Active or Precharge Mode) ...........................................................................
Power-Down Mode (Active or Precharge) ........................................................................................
Deep Power-Down Mode ...............................................................................................................
Clock Stop Mode ...........................................................................................................................
93
94
95
96
97
PDF: 09005aef84812cd1
t68m_auto_lpddr.pdf - Rev. D 10/13 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
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