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512Mb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H128M4 – 32 Meg x 4 x 4 banks

MT47H64M8 – 16 Meg x 8 x 4 banks

MT47H32M16 – 8 Meg x 16 x 4 banks

Features

•

= 1.8V ±0.1V, V

DDQ

= 1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

4 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Selectable burst lengths: 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

Automotive temperature (AT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

• Configuration

– 128 Meg x 4 (32 Meg x 4 x 4 banks)

– 64 Meg x 8 (16 Meg x 8 x 4 banks)

– 32 Meg x 16 (8 Meg x 16 x 4 banks)

• FBGA package (Pb-free) – x16

– 84-ball FBGA (8mm x 12.5mm) Rev. F, G

• FBGA package (Pb-free) – x4, x8

– 60-ball FBGA (8mm x 10mm) Rev. F, G

• FBGA package (lead solder) – x16

– 84-ball FBGA (8mm x 12.5mm) Rev. F, G

• FBGA package (lead solder) – x4, x8

– 60-ball FBGA (8mm x 10mm) Rev. F, G

• Timing – cycle time

– 1.875ns @ CL = 7 (DDR2-1066)

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 4 (DDR2-667)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

• Self refresh

– Standard

– Low-power

• Operating temperature

– Commercial (0°C

≤

+85°C)

– Industrial (–40°C

≤

+95°C;

–40°C

≤

+85°C)

– Automotive (–40°C

≤

, T

≤

+105°C)

• Revision

Note:

Marking

128M4

64M8

32M16

-187E

-25E

-25

-3E

-3

-37E

None

:F/:G

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

Features

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-187E

-25E

-25

-3E

-3

-37E

CL = 3

400

CL = 4

533

667

533

CL = 5

800

667

n/a

CL = 6

800

n/a

CL = 7

1066

n/a

(ns)

Table 2: Addressing

Parameter

Configuration

Refresh count

Row address

Bank address

Column address

128 Meg x 4

32 Meg x 4 x 4 banks

A[13:0] (16K)

BA[1:0] (4)

A[11, 9:0] (2K)

64 Meg x 8

16 Meg x 8 x 4 banks

A[13:0] (16K)

BA[1:0] (4)

A[9:0] (1K)

32 Meg x 16

8 Meg x 16 x 4 banks

A[12:0] (8K)

BA[1:0] (4)

A[9:0] (1K)

Figure 1: 512Mb DDR2 Part Numbers

Example Part Number:

MT47H128M4HR-25E :G

MT47H

Configuration

Package

Speed

Revision

Configuration

128 Meg x 4

64 Meg x 8

32 Meg x 16

128M4

64M8

32M16

:F/:G

Revision

L Low power

IT Industrial temperature

AT Automotive temperature

Package

Pb-free

84-ball 8mm x 12.5mm FBGA

60-ball 8mm x 10mm FBGA

Lead Solder

84-ball 8mm x 12.5mm FBGA

60-ball 8mm x 10mm FBGA

-37E

-3

-3E

-25

-25E

-187E

Speed Grade

tCK = 3.75ns, CL = 4

tCK = 3ns, CL = 5

tCK = 3ns, CL = 4

tCK = 2.5ns, CL = 6

tCK = 2.5ns, CL = 5

tCK = 1.875ns, CL = 7

Note:

1. Not all speeds and configurations are available in all packages.

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

Features

FBGA Part Number System

Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the

part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:

http://www.micron.com.

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

Features

Contents

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature ............................................................................................................................... 10

Automotive Temperature ............................................................................................................................ 11

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 14

Packaging ...................................................................................................................................................... 18

Package Dimensions ................................................................................................................................... 18

FBGA Package Capacitance ......................................................................................................................... 20

Electrical Specifications – Absolute Ratings ..................................................................................................... 21

Temperature and Thermal Impedance ........................................................................................................ 21

Electrical Specifications – I

Parameters ........................................................................................................ 24

Specifications and Conditions ............................................................................................................... 24

DD7

Conditions .......................................................................................................................................... 24

AC Timing Operating Specifications ................................................................................................................ 31

AC and DC Operating Conditions .................................................................................................................... 43

ODT DC Electrical Characteristics ................................................................................................................... 44

Input Electrical Characteristics and Operating Conditions ............................................................................... 45

Output Electrical Characteristics and Operating Conditions ............................................................................. 48

Output Driver Characteristics ......................................................................................................................... 50

Power and Ground Clamp Characteristics ....................................................................................................... 54

AC Overshoot/Undershoot Specification ......................................................................................................... 55

Input Slew Rate Derating ................................................................................................................................ 57

Commands .................................................................................................................................................... 70

Truth Tables ............................................................................................................................................... 70

DESELECT ................................................................................................................................................. 74

NO OPERATION (NOP) ............................................................................................................................... 75

LOAD MODE (LM) ...................................................................................................................................... 75

ACTIVATE .................................................................................................................................................. 75

READ ......................................................................................................................................................... 75

WRITE ....................................................................................................................................................... 75

PRECHARGE .............................................................................................................................................. 76

REFRESH ................................................................................................................................................... 76

SELF REFRESH ........................................................................................................................................... 76

Mode Register (MR) ........................................................................................................................................ 76

Burst Length .............................................................................................................................................. 77

Burst Type .................................................................................................................................................. 78

Operating Mode ......................................................................................................................................... 78

DLL RESET ................................................................................................................................................. 78

Write Recovery ........................................................................................................................................... 79

Power-Down Mode ..................................................................................................................................... 79

CAS Latency (CL) ........................................................................................................................................ 80

Extended Mode Register (EMR) ....................................................................................................................... 81

DLL Enable/Disable ................................................................................................................................... 82

Output Drive Strength ................................................................................................................................ 82

DQS# Enable/Disable ................................................................................................................................. 82

RDQS Enable/Disable ................................................................................................................................. 82

Output Enable/Disable ............................................................................................................................... 82

On-Die Termination (ODT) ......................................................................................................................... 83

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

Features

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 83

Posted CAS Additive Latency (AL) ................................................................................................................ 83

Extended Mode Register 2 (EMR2) ................................................................................................................... 85

Extended Mode Register 3 (EMR3) ................................................................................................................... 86

Initialization .................................................................................................................................................. 87

ACTIVATE ...................................................................................................................................................... 90

READ ............................................................................................................................................................. 92

READ with Precharge .................................................................................................................................. 96

READ with Auto Precharge .......................................................................................................................... 98

WRITE .......................................................................................................................................................... 103

PRECHARGE ................................................................................................................................................. 113

REFRESH ...................................................................................................................................................... 114

SELF REFRESH .............................................................................................................................................. 115

Power-Down Mode ........................................................................................................................................ 117

Precharge Power-Down Clock Frequency Change ........................................................................................... 124

Reset ............................................................................................................................................................. 125

CKE Low Anytime ...................................................................................................................................... 125

ODT Timing .................................................................................................................................................. 127

MRS Command to ODT Update Delay ........................................................................................................ 129

PDF: 09005aef82f1e6e2

512MbDDR2.pdf - Rev. T 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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