512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS-compliant
Supports JEDEC clock jitter specification
Options
1
• Configuration
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 4 (DDR2-667)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
• Self refresh
– Standard
– Low-power
• Operating temperature
– Commercial (0°C
≤
T
C
≤
+85°C)
– Industrial (–40°C
≤
T
C
≤
+95°C;
–40°C
≤
T
A
≤
+85°C)
– Automotive (–40°C
≤
T
C
, T
A
≤
+105°C)
• Revision
Note:
Marking
128M4
64M8
32M16
HR
CF
HW
JN
-187E
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:F/:G
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-187E
-25E
-25
-3E
-3
-37E
CL = 3
400
400
400
400
400
400
CL = 4
533
533
533
667
533
533
CL = 5
800
800
667
667
667
n/a
CL = 6
800
800
800
n/a
n/a
n/a
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
t
RC
(ns)
54
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[11, 9:0] (2K)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number:
MT47H128M4HR-25E :G
-
MT47H
Configuration
Package
Speed
:
Revision
Configuration
128 Meg x 4
64 Meg x 8
32 Meg x 16
128M4
64M8
32M16
:F/:G
Revision
L Low power
IT Industrial temperature
AT Automotive temperature
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HW
JN
HR
CF
-37E
-3
-3E
-25
-25E
-187E
Speed Grade
tCK = 3.75ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3ns, CL = 4
tCK = 2.5ns, CL = 6
tCK = 2.5ns, CL = 5
tCK = 1.875ns, CL = 7
Note:
1. Not all speeds and configurations are available in all packages.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature ............................................................................................................................... 10
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Package Dimensions ................................................................................................................................... 18
FBGA Package Capacitance ......................................................................................................................... 20
Electrical Specifications – Absolute Ratings ..................................................................................................... 21
Temperature and Thermal Impedance ........................................................................................................ 21
Electrical Specifications – I
DD
Parameters ........................................................................................................ 24
I
DD
Specifications and Conditions ............................................................................................................... 24
I
DD7
Conditions .......................................................................................................................................... 24
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 43
ODT DC Electrical Characteristics ................................................................................................................... 44
Input Electrical Characteristics and Operating Conditions ............................................................................... 45
Output Electrical Characteristics and Operating Conditions ............................................................................. 48
Output Driver Characteristics ......................................................................................................................... 50
Power and Ground Clamp Characteristics ....................................................................................................... 54
AC Overshoot/Undershoot Specification ......................................................................................................... 55
Input Slew Rate Derating ................................................................................................................................ 57
Commands .................................................................................................................................................... 70
Truth Tables ............................................................................................................................................... 70
DESELECT ................................................................................................................................................. 74
NO OPERATION (NOP) ............................................................................................................................... 75
LOAD MODE (LM) ...................................................................................................................................... 75
ACTIVATE .................................................................................................................................................. 75
READ ......................................................................................................................................................... 75
WRITE ....................................................................................................................................................... 75
PRECHARGE .............................................................................................................................................. 76
REFRESH ................................................................................................................................................... 76
SELF REFRESH ........................................................................................................................................... 76
Mode Register (MR) ........................................................................................................................................ 76
Burst Length .............................................................................................................................................. 77
Burst Type .................................................................................................................................................. 78
Operating Mode ......................................................................................................................................... 78
DLL RESET ................................................................................................................................................. 78
Write Recovery ........................................................................................................................................... 79
Power-Down Mode ..................................................................................................................................... 79
CAS Latency (CL) ........................................................................................................................................ 80
Extended Mode Register (EMR) ....................................................................................................................... 81
DLL Enable/Disable ................................................................................................................................... 82
Output Drive Strength ................................................................................................................................ 82
DQS# Enable/Disable ................................................................................................................................. 82
RDQS Enable/Disable ................................................................................................................................. 82
Output Enable/Disable ............................................................................................................................... 82
On-Die Termination (ODT) ......................................................................................................................... 83
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 83
Posted CAS Additive Latency (AL) ................................................................................................................ 83
Extended Mode Register 2 (EMR2) ................................................................................................................... 85
Extended Mode Register 3 (EMR3) ................................................................................................................... 86
Initialization .................................................................................................................................................. 87
ACTIVATE ...................................................................................................................................................... 90
READ ............................................................................................................................................................. 92
READ with Precharge .................................................................................................................................. 96
READ with Auto Precharge .......................................................................................................................... 98
WRITE .......................................................................................................................................................... 103
PRECHARGE ................................................................................................................................................. 113
REFRESH ...................................................................................................................................................... 114
SELF REFRESH .............................................................................................................................................. 115
Power-Down Mode ........................................................................................................................................ 117
Precharge Power-Down Clock Frequency Change ........................................................................................... 124
Reset ............................................................................................................................................................. 125
CKE Low Anytime ...................................................................................................................................... 125
ODT Timing .................................................................................................................................................. 127
MRS Command to ODT Update Delay ........................................................................................................ 129
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
模拟与混合信号
