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MT4LDT232HG-7L

Fast Page DRAM Module, 2MX32, 70ns, CMOS, DIMM-72

器件类别:存储    存储   

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Micron Technology
零件包装代码
DIMM
包装说明
DIMM-72
针数
72
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
70 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
备用内存宽度
16
I/O 类型
COMMON
JESD-30 代码
R-XDMA-N72
内存密度
67108864 bit
内存集成电路类型
FAST PAGE DRAM MODULE
内存宽度
32
湿度敏感等级
1
功能数量
1
端口数量
1
端子数量
72
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
2MX32
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装代码
DIMM
封装等效代码
DIMM72
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度)
225
电源
3.3 V
认证状态
Not Qualified
刷新周期
1024
座面最大高度
25.654 mm
自我刷新
NO
最大待机电流
0.0006 A
最大压摆率
0.314 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
TECHNOLOGY, INC.
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
1 MEG, 2 MEG x 32 DRAM MODULES
SMALL-OUTLINE
DRAM MODULE
FEATURES
• JEDEC- and industry-standard pinout in a 72-pin,
small-outline, dual-in-line memory module (DIMM)
• High-performance CMOS silicon-gate process.
• Single +3.3V
±0.3V
power supply
• All device pins are TTL-compatible
• Low power, 12mW standby; 506mW active, typical
(8MB)
• Refresh modes:
?
R
?
A
/
S ONLY,
?
C
?
A
/
S-BEFORE-?R
?
A
/
S (CBR)
and HIDDEN; optional Extended CBR
• 1,024-cycle refresh distributed across 16ms or
1,024-cycle extended refresh distributed across 128ms
• FAST PAGE MODE (FPM) operating mode or
Extended Data-Out (EDO) PAGE MODE operating
mode
• 5V-tolerant inputs and I/Os (5.5V maximum V
IH
level)
1 MEG, 2 MEG x 32
4, 8 MEGABYTE, 3.3V, OPTIONAL
EXTENDED REFRESH, FAST PAGE OR EDO
PAGE MODE
PIN ASSIGNMENT (Front View)
72-Pin Small-Outline DIMM
(DE-1) 1 Meg x 32
(DE-2) 2 Meg x 32
1
PIN # FRONT
PIN #
1
V
SS
2
3
DQ1
4
5
DQ3
6
7
DQ5
8
9
DQ7
10
11
PRD1
12
13
A1
14
15
A3
16
17
A5
18
19
NC
20
21
DQ8
22
23
DQ10
24
25
DQ12
26
27
DQ14
28
29
NC
30
31
A8
32
33 NC/?R
?
A
?
S
/
3* 34
35
DQ15
36
*8MB version only
BACK
DQ0
DQ2
DQ4
DQ6
V
CC
A0
A2
A4
A6
NC
DQ9
DQ11
DQ13
A7
V
CC
A9
?
R
?
A
?
S
/
2
NC
PIN # FRONT
PIN #
37
DQ16
38
39
V
SS
40
41
?
C
?
A
?
S
/
2
42
43
?
C
?
A
?
S
/
1
44
45 NC/?R
?
A
?
S
/
1* 46
47
?
WE
/
48
49
DQ18
50
51
DQ20
52
53
DQ22
54
55
NC
56
57
DQ25
58
59
DQ28
60
61
V
CC
62
63
DQ30
64
65
NC
66
67
PRD3
68
69
PRD5
70
71
PRD7
72
BACK
DQ17
?
C
?
A
?
S
/
0
?
C
?
A
?
S
/
3
?
R
?
A
?
S
/
0
NC
NC
DQ19
DQ21
DQ23
DQ24
DQ26
DQ27
DQ29
DQ31
PRD2
PRD4
PRD6
V
SS
OPTIONS
• Timing
60ns access
70ns access
• Packages
72 -pin Small-Outline DIMM (gold)
• Operating Modes
FAST PAGE MODE
EDO PAGE MODE
• Refresh
Standard/16ms
Extended Refresh/128ms
MARKING
-6
-7
G
Blank
X
Blank
L
KEY TIMING PARAMETERS
EDO Operating Mode
SPEED
-6
-7
t
RC
t
RAC
t
PC
t
AA
t
CAC
t
CAS
105ns
125ns
60ns
70ns
25ns
30ns
30ns
35ns
15ns
20ns
12ns
12ns
FPM Operating Mode
SPEED
-6
-7
t
RC
t
RAC
t
PC
t
AA
t
CAC
t
RP
110ns
130ns
60ns
70ns
35ns
40ns
30ns
35ns
15ns
20ns
40ns
50ns
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
DM40.pm5 – Rev. 12/95
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1995,
Micron Technology, Inc.
TECHNOLOGY, INC.
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
1 MEG, 2 MEG x 32 DRAM MODULES
always initiated with a row-address strobed-in by
?
R
?
A
/
S
followed by a column-address strobed-in by
?
CA
/
S. C
?
A
/
S
?
?
may be toggled-in by holding
?
R
?
A
/
S LOW and strobing-in
different column-addresses, thus executing faster memory
cycles. Returning
?
R
?
A
/
S HIGH terminates the FAST PAGE
MODE operation.
PART NUMBERS
EDO Operating Mode
PART NUMBER
MT2LDT132HG-xx X
MT2LDT132HG-xx XL
MT4LDT232HG-xx X
MT4LDT232HG-xx XL
DESCRIPTION
1 Meg x 32, EDO
1 Meg x 32, EDO, Extended Refresh
2 Meg x 32, EDO
2 Meg x 32, EDO, Extended Refresh
EDO PAGE MODE
EDO PAGE MODE, designated by the “X” version, is an
accelerated FAST PAGE MODE cycle. The primary advan-
tage of EDO is the availability of data-out even after
?
C
?
A
/
S
goes back HIGH. EDO provides for
?
C
?
A
/
S precharge time
(
t
CP) to occur without the output data going invalid. This
elimination of
?
C
?
A
/
S output control provides for pipeline
READs.
FAST PAGE MODE modules have traditionally turned
the output buffers off (High-Z) with the rising edge of
?
C
?
A
/
S. EDO operates as any DRAM READ or FAST-PAGE-
MODE READ, except data will be held valid or become
valid after
?
C
?
A
/
S goes HIGH, as long as R
?
A
/
S and
?
O
?
E are held
?
LOW (reference MT4LC1M16E5 DRAM data sheet for
additional information on EDO functionality).
xx = speed
FPM Operating Mode
PART NUMBER
MT2LDT132HG-xx
MT2LDT132HG-xx L
MT4LDT232HG-xx
MT4LDT232HG-xx L
DESCRIPTION
1 Meg x 32
1 Meg x 32, Extended Refresh
2 Meg x 32
2 Meg x 32, Extended Refresh
xx = speed
GENERAL DESCRIPTION
The MT2LDT132H(X)(L) and MT4LDT232H(X)(L) are
randomly accessed 4MB and 8MB solid-state memories
organized in a small outline x32 configuration. They are
specially processed to operate from +3.0V to 3.6V for low
voltage memory systems.
During READ or WRITE cycles, each bit is uniquely
addressed through the 20 address bits which are entered 10
bits (A0 -A9) at a time.
?
R
?
A
/
S is used to latch the first 10 bits
and
?
C
?
A
/
S the latter 10 bits.
READ and WRITE cycles are selected with the
?
W
/
E input.
A logic HIGH on
?
W
/
E dictates READ mode while a logic
LOW on
?
W
/
E dictates WRITE mode. During a WRITE cycle,
data-in (D) is latched by the falling edge of
?
W
/
E or
?
C
?
A
/
S,
whichever occurs last. If
?
W
/
E goes LOW prior to
?
C
?
A
/
S going
LOW, the output pin(s) remain open (High-Z) until the next
?
C
?
A
/
S cycle.
REFRESH
Memory cell data is retained in its correct state by main-
taining power and executing any
?
R
?
A
/
S cycle (READ, WRITE)
or
?
R
?
A
/
S refresh cycle (?RA
/
S ONLY, CBR or HIDDEN) so that
?
all combinations of
?
R
?
A
/
S addresses (A0 -A9) are executed at
least every
t
REF, regardless of sequence. The CBR RE-
FRESH cycle will invoke the internal refresh counter for
automatic
?
R
?
A
/
S addressing.
An optional Extended Refresh mode is also available on
the MT2LDT132H(X) L and MT4LDT232H(X) L. The “L”
version allows the user the choice of a dynamic refresh
mode at the extended refresh period of 128ms.
STANDBY
Returning
?
R
?
A
/
S and
?
C
?
A
/
S HIGH terminates a memory
cycle and decreases chip current to a reduced standby level.
Also, the chip is preconditioned for the next cycle during
the
?
R
?
A
/
S HIGH time.
FAST PAGE MODE
FAST PAGE MODE operations allow faster data opera-
tions (READ or WRITE) within a row-address-defined
(A0 -A9) page boundary. The FAST PAGE MODE cycle is
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
DM40.pm5 – Rev. 12/95
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1995,
Micron Technology, Inc.
TECHNOLOGY, INC.
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
1 MEG, 2 MEG x 32 DRAM MODULES
FUNCTIONAL BLOCK DIAGRAM
MT2LDT132H (4MB)
10
A0-A9
U1
WE
CAS0
CAS1
RAS0
A0-A9
WE
CASL
CASH
RAS
OE
DQ0-
DQ15
16
10
32
DQ0-DQ31
10
A0-A9
U2
WE
CAS2
CAS3
RAS2
CASL
CASH
RAS
OE
DQ16-
DQ31
16
EDO PAGE MODE
U1-U2 = MT4LC1M16E5(L)
FAST PAGE MODE
U1-U2 = MT4LC1M16C3(L)
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
DM40.pm5 – Rev. 12/95
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1995,
Micron Technology, Inc.
TECHNOLOGY, INC.
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
1 MEG, 2 MEG x 32 DRAM MODULES
FUNCTIONAL BLOCK DIAGRAM
MT4LDT232H (8MB)
10
A0-A9
U1
WE
CAS0
CAS1
RAS0
CASL
CASH
RAS
OE
DQ0-
DQ15
16
32
DQ0-DQ31
10
WE
CAS2
CAS3
RAS2
A0-A9
A0-A9
U2
WE
CASL
CASH
RAS
OE
DQ16-
DQ31
16
10
10
A0-A9
U3
WE
CASL
CASH
RAS1
RAS
OE
DQ0-
DQ15
16
32
DQ0-DQ31
10
A0-A9
U4
WE
CASL
CASH
RAS3
RAS
OE
DQ16-
DQ31
16
EDO PAGE MODE
U1-U4 = MT4LC1M16E5(L)
FAST PAGE MODE
U1-U4 = MT4LC1M16C3(L)
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
DM40.pm5 – Rev. 12/95
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1995,
Micron Technology, Inc.
TECHNOLOGY, INC.
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
1 MEG, 2 MEG x 32 DRAM MODULES
TRUTH TABLE
ADDRESSES
FUNCTION
Standby
READ
EARLY WRITE
EDO/FAST-PAGE-
MODE READ
1st Cycle
2nd Cycle
Any Cycle
(X version)
EDO/FAST-PAGE-
MODE EARLY-WRITE
?
R
?
A
/
S-ONLY REFRESH
HIDDEN
REFRESH
CBR REFRESH
Extended CBR REFRESH (L version)
READ
WRITE
1st Cycle
2nd Cycle
?
R
?
A
/
S
H
L
L
L
L
L
L
L
L
L>H>L
L>H>L
H>L
H>L
?
C
?
A
/
S
H>X
L
L
H>L
H>L
L>H
H>L
H>L
H
L
L
L
L
?
W
/
E
X
H
L
H
H
H
L
L
X
H
L
H
H
t
R
t
C
DATA-IN/OUT
DQ0-DQ31
High-Z
Data-Out
Data-In
Data-Out
Data-Out
Data-Out
Data-In
Data-In
High-Z
Data-Out
Data-In
High-Z
High-Z
X
ROW
ROW
ROW
n/a
n/a
ROW
n/a
ROW
ROW
ROW
X
X
X
COL
COL
COL
COL
n/a
COL
COL
n/a
COL
COL
X
X
JEDEC DEFINED
PRESENCE-DETECT - MT2LDT132H (4MB)
SYMBOL
PRD1
PRD2
PRD3
PRD4
PRD5
PRD6
PRD7
PIN #
11
66
67
68
69
70
71
-6
NC
V
SS
V
SS
NC
NC
NC
NC
-7
NC
V
SS
V
SS
NC
V
SS
NC
NC
JEDEC DEFINED
PRESENCE-DETECT - MT4LDT232H (8MB)
SYMBOL
PRD1
PRD2
PRD3
PRD4
PRD5
PRD6
PRD7
PIN #
11
66
67
68
69
70
71
-6
NC
V
SS
V
SS
V
SS
NC
NC
NC
-7
NC
V
SS
V
SS
V
SS
V
SS
NC
NC
MT2LDT132H(X)(L), MT4LDT232H(X)(L)
DM40.pm5 – Rev. 12/95
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1995,
Micron Technology, Inc.
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