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MT55L256V32FT-12

ZBT SRAM, 256KX32, 9ns, CMOS, PQFP100, PLASTIC, TQFP-100

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
QFP
包装说明
LQFP,
针数
100
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
9 ns
其他特性
FLOW-THROUGH ARCHITECTURE
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
8388608 bit
内存集成电路类型
ZBT SRAM
内存宽度
32
湿度敏感等级
3
功能数量
1
端子数量
100
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
256KX32
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
225
认证状态
Not Qualified
座面最大高度
1.6 mm
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
TIN LEAD (800)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
14 mm
Base Number Matches
1
文档预览
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
8Mb
ZBT
®
SRAM
FEATURES
High frequency and 100 percent bus utilization
Fast cycle times: 10ns, 11ns and 12ns
Single +3.3V ±5% power supply (V
DD
)
Separate +3.3V or +2.5V isolated output buffer
supply (V
DD
Q)
Advanced control logic for minimum control
signal interface
Individual BYTE WRITE controls may be tied LOW
Single R/W# (read/write) control pin
CKE# pin to enable clock and suspend operations
Three chip enables for simple depth expansion
Clock-controlled and registered addresses, data
I/Os and control signals
Internally self-timed, fully coherent WRITE
Internally self-timed, registered outputs to
eliminate the need to control OE#
SNOOZE MODE for reduced-power standby
Common data inputs and data outputs
Linear or Interleaved Burst Modes
Burst feature (optional)
Pin/function compatibility with 2Mb, 4Mb, and
18Mb ZBT SRAM
100-pin TQFP
165-pin FBGA
Automatic power-down
MT55L512L18F, MT55L512V18F,
MT55L256L32F, MT55L256V32F,
MT55L256L36F, MT55L256V36F
3.3V V
DD
, 3.3V or 2.5V I/O
100-Pin TQFP
1
165-Pin FBGA
OPTIONS
• Timing (Access/Cycle/MHz)
7.5ns/10ns/100 MHz
8.5ns/11ns/90 MHz
9ns/12ns/83 MHz
• Configurations
3.3V I/O
512K x 18
256K x 32
256K x 36
2.5V I/O
512K x 18
256K x 32
256K x 36
• Package
100-pin TQFP
165-pin FBGA
• Operating Temperature Range
Commercial (0ºC to +70ºC)
Industrial (-40°C to +85°C)**
Part Number Example:
MARKING
-10
-11
-12
NOTE:
1. JEDEC-standard MS-026 BHA (LQFP).
* A Part Marking Guide for the FBGA devices can be found on Micron’s
Web site—http://www.micron.com/support/index.html.
** Industrial temperature range offered in specific speed grades and
configurations. Contact factory for more information.
MT55L512L18F
MT55L256L32F
MT55L256L36F
MT55L512V18F
MT55L256V32F
MT55L256V36F
T
F*
None
IT
GENERAL DESCRIPTION
The Micron
®
Zero Bus Turnaround
(ZBT
®
) SRAM
family employs high-speed, low-power CMOS designs
using an advanced CMOS process.
Micron’s 8Mb ZBT SRAMs integrate a 512K x 18,
256K x 32, or 256K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. These SRAMs are optimized for 100 percent
bus utilization, eliminating any turnaround cycles for
READ to WRITE, or WRITE to READ, transitions. All
synchronous inputs pass through registers controlled
by a positive-edge-triggered single clock input (CLK).
The synchronous inputs include all addresses, all data
inputs, chip enable (CE#), two additional chip enables
for easy depth expansion (CE2, CE2#), cycle start input
MT55L256L32FT-11
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
FUNCTIONAL BLOCK DIAGRAM
512K x 18
19
SA0, SA1, SA
MODE
CLK
CKE#
K
CE
ADV/LD#
K
WRITE ADDRESS
REGISTER
ADDRESS
REGISTER
19
SA1
D1
SA0
D0
17
Q1 SA1'
SA0'
Q0
19
19
O
U
T
P
U
T
B
U
F
F
E
R
S
E
19
BURST
LOGIC
ADV/LD#
BWa#
BWb#
R/W#
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
18
512K x 9 x 2
WRITE
DRIVERS
18
MEMORY
ARRAY
18
S
E
N
S
E
A
M
P
S
D
A
T
A
18
S
T
E
E
R
I
N
G
18
18
DQs
18
OE#
CE#
CE2
CE2#
READ LOGIC
INPUT
E
REGISTER
FUNCTIONAL BLOCK DIAGRAM
256K x 32/36
18
SA0, SA1, SA
MODE
CLK
CKE#
K
CE
ADV/LD#
K
WRITE ADDRESS
REGISTER
ADDRESS
REGISTER
18
SA1
D1
SA0
D0
16
Q1 SA1'
SA0'
Q0
18
18
O
U
T
P
U
T
B
U
F
F
E
R
S
E
18
BURST
LOGIC
ADV/LD#
BWa#
BWb#
BWc#
BWd#
R/W#
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
36
256K x 8 x 4
(x32)
WRITE
DRIVERS
36
256K x 9 x 4
36
(x36)
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
D
A
T
A
36
S
T
E
E
R
I
N
G
36
36
DQs
DQPa
DQPb
DQPc
DQPd
36
OE#
CE#
CE2
CE2#
INPUT
E
REGISTER
READ LOGIC
NOTE:
Functional block diagrams illustrate simplified device operation. See truth table, pin descriptions, and timing diagrams
for detailed information.
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
GENERAL DESCRIPTION (continued)
(ADV/LD#), synchronous clock enable (CKE#), byte
write enables (BWa#, BWb#, BWc#, and BWd#), and
read/write (R/W#).
Asynchronous inputs include the output enable
(OE#, which may be tied LOW for control signal mini-
mization), clock (CLK), and snooze enable (ZZ, which
may be tied LOW if unused). There is also a burst mode
pin (MODE) that selects between interleaved and linear
burst modes. MODE may be tied HIGH, LOW, or left
unconnected if burst is unused. The flow-through data-
out (Q) is enabled by OE#. WRITE cycles can be from
one to four bytes wide as controlled by the write control
inputs.
All READ, WRITE, and DESELECT cycles are initi-
ated by the ADV/LD# input. Subsequent burst ad-
dresses can be internally generated as controlled by the
burst advance pin (ADV/LD#). Use of burst mode is
optional. It is allowable to give an address for each
individual READ and WRITE cycle. BURST cycles wrap
around after the fourth access from a base address.
To allow for continuous, 100 percent use of the data
bus, the flow-through ZBT SRAM uses a LATE WRITE
cycle. For example, if a WRITE cycle begins in clock cycle
one, the address is present on rising edge one. BYTE
WRITEs need to be asserted on the same cycle as the
address. The write data associated with the address is
required one cycle later, or on the rising edge of clock
cycle two.
Address and write control are registered on-chip to
simplify WRITE cycles. This allows self-timed WRITE
cycles. Individual byte enables allow individual bytes to
be written. During a BYTE WRITE cycle, BWa# controls
DQa pins; BWb# controls DQb pins; BWc# controls
DQc pins; and BWd# controls DQd pins. Cycle types
can only be defined when an address is loaded, i.e.,
when ADV/LD# is LOW. Parity/ECC bits are available
only on the x18 and x36 versions.
Micron’s 8Mb ZBT SRAMs operate from a +3.3V V
DD
power supply, and all inputs and outputs are LVTTL-
compatible. Users can choose either a 3.3V or 2.5V I/O
version. The device is ideally suited for systems requir-
ing high bandwidth and zero bus turnaround delays.
Please refer to the Micron Web site
(www.micron.com/sramds) for the latest data sheet.
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
TQFP PIN ASSIGNMENT TABLE
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
x18
NC
NC
NC
x32
NF
DQc
DQc
V
DD
Q
V
SS
DQc
DQc
DQc
DQc
V
SS
V
DD
Q
DQc
DQc
V
SS
1
V
DD
V
DD
2
V
SS
DQd
DQd
V
DD
Q
V
SS
DQd
DQd
DQd
DQd
x36
DQPc
DQc
DQc
PIN #
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
x18
x32
x36
V
SS
V
DD
Q
NC
DQd DQd
NC
DQd DQd
NC
NF
DQPd
MODE (LBO#)
SA
SA
SA
SA
SA1
SA0
DNU
DNU
V
SS
V
DD
DNU
DNU
SA
SA
SA
SA
SA
SA
SA
PIN #
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
x18
NC
NC
NC
x32
x36
NF
DQPa
DQa
DQa
DQa
DQa
V
DD
Q
V
SS
DQa DQa
DQa DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
ZZ
V
DD
V
SS
V
SS
DQb DQb
DQb DQb
V
DD
Q
V
SS
DQb DQb
DQb DQb
DQb DQb
DQb DQb
PIN #
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
x18
x32
x36
V
SS
V
DD
Q
DQb DQb
DQb DQb
NF
DQPb
SA
SA
SA
NF
3
ADV/LD#
OE# (G#)
CKE#
R/W#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc# BWc#
BWd# BWd#
CE2
CE#
SA
SA
NC
NC
SA
NC
NC
DQb
DQb
DQc
DQc
DQc
DQc
NC
NC
DQb
DQb
DQc
DQc
DQb
DQb
DQd
DQd
DQa
DQa
NC
NC
DQb
DQb
DQb
NC
DQd
DQd
DQd
DQd
DQa
DQa
DQa
NC
NOTE:
1. Pins 14 and 66 do not have to be connected directly to V
SS
if the input voltage is
V
IL
.
2. Pins 16 does not have to be connected directly to V
DD
if the input voltage is
V
IH
.
3. Pin 84 is reserved for address expansion to 18Mb device.
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
PIN ASSIGNMENT (TOP VIEW)
100-PIN TQFP
SA
NC
NC
V
DD
Q
V
SS
NC
DQPa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
V
SS
V
SS
1
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
NC
NC
V
SS
V
DD
Q
NC
NC
NC
SA
SA
SA
NF
3
ADV/LD#
OE# (G#)
CKE#
R/W#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
NC
NC
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
x18
SA
SA
SA
SA
SA
SA
SA
DNU
DNU
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
(LBO#)
SA
SA
SA
NF
3
ADV/LD#
OE# (G#)
CKE#
R/W#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc#
BWd#
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
NF/DQPb
4
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
SS
V
SS
1
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
NF/DQPa
4
NC
NC
NC
V
DD
Q
V
SS
NC
NC
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
SS
1
V
DD
V
DD
2
V
SS
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQPb
NC
V
SS
V
DD
Q
NC
NC
NC
x32/x36
SA
SA
SA
SA
SA
SA
SA
DNU
DNU
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
(LBO#)
NOTE:
1.
2.
3.
4.
Pins 14 and 66 do not have to be connected directly to V
SS
if the input voltage is
V
IL
.
Pins 16 does not have to be connected directly to V
DD
if the input voltage is
V
IH
.
Pin 84 is reserved for address expansion to 18Mb device.
NF for x32 version, DQPx for x36 version.
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
NF/DQPc
4
DQc
DQc
V
DD
Q
V
SS
DQc
DQc
DQc
DQc
V
SS
V
DD
Q
DQc
DQc
V
SS
1
V
DD
V
DD
2
V
SS
DQd
DQd
V
DD
Q
V
SS
DQd
DQd
DQd
DQd
V
SS
V
DD
Q
DQd
DQd
NF/DQPd
4
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
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参数对比
与MT55L256V32FT-12相近的元器件有:MT55L512L18FT-12、MT55L256L32FF-12、MT55L256L32FF-10、MT55L256L32FF-11、MT55L256L36FT-11、MT55L256V32FT-10、MT55L256V32FF-12、MT55L256V36FT-12、MT55L256V36FF-10。描述及对比如下:
型号 MT55L256V32FT-12 MT55L512L18FT-12 MT55L256L32FF-12 MT55L256L32FF-10 MT55L256L32FF-11 MT55L256L36FT-11 MT55L256V32FT-10 MT55L256V32FF-12 MT55L256V36FT-12 MT55L256V36FF-10
描述 ZBT SRAM, 256KX32, 9ns, CMOS, PQFP100, PLASTIC, TQFP-100 ZBT SRAM, 512KX18, 9ns, CMOS, PQFP100, PLASTIC, TQFP-100 ZBT SRAM, 256KX32, 9ns, CMOS, PBGA165, FBGA-165 ZBT SRAM, 256KX32, 7.5ns, CMOS, PBGA165, FBGA-165 ZBT SRAM, 256KX32, 8.5ns, CMOS, PBGA165, FBGA-165 ZBT SRAM, 256KX36, 8.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 ZBT SRAM, 256KX32, 7.5ns, CMOS, PQFP100, PLASTIC, TQFP-100 ZBT SRAM, 256KX32, 9ns, CMOS, PBGA165, FBGA-165 ZBT SRAM, 256KX36, 9ns, CMOS, PQFP100, PLASTIC, TQFP-100 ZBT SRAM, 256KX36, 7.5ns, CMOS, PBGA165, FBGA-165
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFP QFP BGA BGA BGA QFP QFP BGA QFP BGA
包装说明 LQFP, LQFP, TBGA, TBGA, TBGA, LQFP, LQFP, TBGA, LQFP, TBGA,
针数 100 100 165 165 165 100 100 165 100 165
Reach Compliance Code compliant unknown unknown unknown unknown unknown unknown unknown unknown compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 9 ns 9 ns 9 ns 7.5 ns 8.5 ns 8.5 ns 7.5 ns 9 ns 9 ns 7.5 ns
其他特性 FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PQFP-G100 R-PQFP-G100 R-PBGA-B165 R-PQFP-G100 R-PBGA-B165
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 20 mm 20 mm 15 mm 15 mm 15 mm 20 mm 20 mm 15 mm 20 mm 15 mm
内存密度 8388608 bit 9437184 bit 8388608 bit 8388608 bit 8388608 bit 9437184 bit 8388608 bit 8388608 bit 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 32 18 32 32 32 36 32 32 36 36
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 100 100 165 165 165 100 100 165 100 165
字数 262144 words 524288 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 256000 512000 256000 256000 256000 256000 256000 256000 256000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 256KX32 512KX18 256KX32 256KX32 256KX32 256KX36 256KX32 256KX32 256KX36 256KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP TBGA TBGA TBGA LQFP LQFP TBGA LQFP TBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 220 220 NOT SPECIFIED 225 NOT SPECIFIED 220 NOT SPECIFIED 220
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.2 mm 1.2 mm 1.2 mm 1.6 mm 1.6 mm 1.2 mm 1.6 mm 1.2 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD (800) TIN LEAD (800) TIN LEAD TIN LEAD TIN LEAD TIN LEAD (800) TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING BALL BALL BALL GULL WING GULL WING BALL GULL WING BALL
端子节距 0.65 mm 0.65 mm 1 mm 1 mm 1 mm 0.65 mm 0.65 mm 1 mm 0.65 mm 1 mm
端子位置 QUAD QUAD BOTTOM BOTTOM BOTTOM QUAD QUAD BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 14 mm 14 mm 13 mm 13 mm 13 mm 14 mm 14 mm 13 mm 14 mm 13 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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