型号
- 型号
- 关键词
DDR DRAM Module, 256MX64, CMOS, LEAD FREE, MO-268, SODIMM-204
厂商名称：Micron Technology
厂商官网：http://www.mdtic.com.tw/
器件标准：
| 型号 | MT8JSF25664HY-1G6XX | MT8JSF25664HY-1G4XX | MT8JSF12864HY-1G6XX | MT8JSF12864HY-1G4XX | MT8JSF25664HY-1G1XX |
|---|---|---|---|---|---|
| 描述 | DDR DRAM Module, 256MX64, CMOS, LEAD FREE, MO-268, SODIMM-204 | DDR DRAM Module, 256MX64, CMOS, LEAD FREE, MO-268, SODIMM-204 | DDR DRAM Module, 128MX64, CMOS, LEAD FREE, MO-268, SODIMM-204 | DDR DRAM Module, 128MX64, CMOS, LEAD FREE, MO-268, SODIMM-204 | DDR DRAM Module, 256MX64, CMOS, LEAD FREE, MO-268, SODIMM-204 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| 零件包装代码 | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM |
| 包装说明 | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
| 针数 | 204 | 204 | 204 | 204 | 204 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XZMA-N204 | R-XZMA-N204 | R-XZMA-N204 | R-XZMA-N204 | R-XZMA-N204 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 内存密度 | 17179869184 bit | 17179869184 bit | 8589934592 bit | 8589934592 bit | 17179869184 bi |
| 内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 204 | 204 | 204 | 204 | 204 |
| 字数 | 268435456 words | 268435456 words | 134217728 words | 134217728 words | 268435456 words |
| 字数代码 | 256000000 | 256000000 | 128000000 | 128000000 | 256000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256MX64 | 256MX64 | 128MX64 | 128MX64 | 256MX64 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 自我刷新 | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.575 V | 1.575 V | 1.575 V | 1.575 V | 1.575 V |
| 最小供电电压 (Vsup) | 1.425 V | 1.425 V | 1.425 V | 1.425 V | 1.425 V |
| 标称供电电压 (Vsup) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |