16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
DDR4 SDRAM RDIMM
MTA18ASF2G72PDZ – 16GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC4-3200, PC4-2933,
PC4-2666, or PC4-2400
• 16GB (2 Gig × 72)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V
REFDQ
generation and calibration
• Dual-rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
PC4-
3200
2933
24
3200,
2933
–
22
3200,
2933
2933
21
2933
2933
20 \
19
2666 \
2666
2666 \
2666
18 \
17
2400 \
2400
2400 \
2400
16 \
15
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
10 \
9
1333 \
–
t
RCD
t
RP
t
RC
Figure 1: 288-Pin RDIMM (MO-309, R/C-E1, R/C-
E2)
Module height: 31.25mm (1.23in)
Options
• Operating temperature
– Commercial (0°C
≤
T
OPER
≤
95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.682ns @ CL = 21 (DDR4-2933)
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
Marking
None
Z
-3G2
-2G9
-2G6
-2G3
Speed
Grade
(ns)
13.75
(ns)
13.75
(ns)
45.75
-3G2
-2G9
1333 \ 14.32
14.32
46.32
1
(13.75)
1
(45.75)
1
–
(13.75)
CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. G 11/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
Table 1: Key Timing Parameters (Continued)
Data Rate (MT/s)
CL =
PC4-
2666
2400
2133
24
–
–
–
22
–
–
–
21
–
–
–
20 \
19
2666 \
2666
–
–
18 \
17
2400 \
2400
2400 \
2400
–
16 \
15
2133 \
2133
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
1600 \
1600
10 \
9
t
RCD
t
RP
t
RC
Speed
Grade
(ns)
(ns)
(ns)
-2G6
-2G3
-2G1
1333 \ 14.25
14.25
46.25
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \ 14.16
14.16
46.16
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \
1333
14.06
(13.5)
1
14.06
(13.5)
1
47.06
(46.5)
1
Note:
1. Down-bin timing, refer to component data sheet Speed Bin Tables for details.
Table 2: Addressing
Parameter
Row address
Column address
Device bank group address
Device bank address per group
Device configuration
Module rank address
16GB
64K A[15:0]
1K A[9:0]
4 BG[1:0]
4 BA[1:0]
8Gb (1 Gig × 8), 16 banks
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 16GB Modules
Base device: MT40A1G8,
1
8Gb DDR4 SDRAM
Module
2
Part Number
Density
Configuration
MTA18ASF2G72PDZ-3G2__
MTA18ASF2G72PDZ-2G9__
MTA18ASF2G72PDZ-2G6__
MTA18ASF2G72PDZ-2G3__
Notes:
16GB
16GB
16GB
16GB
2 Gig × 72
2 Gig × 72
2 Gig × 72
2 Gig × 72
Module
Bandwidth
25.6 GB/s
23.47 GB/s
21.3 GB/s
19.2 GB/s
Memory Clock/
Data Rate
0.62ns/3200 MT/s
0.682ns/2933 MT/s
0.75ns/2666 MT/s
0.83ns/2400 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
22-22-22
21-21-21
19-19-19
17-17-17
1. The data sheet for the base device can be found on micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA18ASF2G72PDZ-3G2J1.
CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. G 11/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. G 11/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Important Notes and Warnings
Important Notes and Warnings
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including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
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cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
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costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-
demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
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Products are not authorized for use in applications in which failure of the Micron compo-
nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-
mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
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Customers are responsible for the design, manufacture, and operation of their systems,
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URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
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vironmental damages will result from failure of any semiconductor component.
Limited Warranty.
In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
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authorized representative.
CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. G 11/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Pin Assignments
Pin Assignments
The pin assignment table below is a comprehensive list of all possible pin assignments
for DDR4 RDIMM modules. See the Functional Block Diagram for pins specific to this
module.
Table 4: Pin Assignments
288-Pin DDR4 RDIMM Front
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Symbol
NC
V
SS
DQ4
V
SS
DQ0
V
SS
DQS9_t/
TDQS9_t
DQS09_c/
TDQS9_c
V
SS
DQ6
V
SS
DQ2
V
SS
DQ12
V
SS
DQ8
V
SS
DQS10_t/
TDQS10_t
DQS10_c/
TDQS10_c
V
SS
DQ14
V
SS
DQ10
V
SS
Pin
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbol
V
SS
DQ24
V
SS
DQS12_t/
TDQS12_t
DQS12_c/
TDQS12_c
V
SS
DQ30
V
SS
DQ26
V
SS
CB4
V
SS
CB0
V
SS
DQS17_t/
TDQS17_t
DQS17_c/
TDQS17_c
V
SS
CB6
V
SS
CB2
V
SS
RESET_n
V
DD
CKE0
Pin
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
Symbol
V
DD
CK0_t
CK0_c
V
DD
V
TT
EVENT_n
A0
V
DD
BA0
RAS_n/
A16
V
DD
CS0_n
V
DD
CAS_n/
A15
ODT0
V
DD
CS1_n/
NC
V
DD
ODT1/
NC
V
DD
CS2_n/
C0
V
SS
DQ36
V
SS
Pin
109
Symbol
V
SS
Pin
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Symbol
NC
V
REFCA
V
SS
DQ5
V
SS
DQ1
V
SS
DQS0_c
DQS0_t
V
SS
DQ7
V
SS
DQ3
V
SS
DQ13
V
SS
DQ9
V
SS
DQS1_c
DQS1_t
V
SS
DQ15
V
SS
DQ11
288-Pin DDR4 RDIMM Back
Pin
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
Symbol
DQ29
V
SS
DQ25
V
SS
DQS3_c
DQS3_t
V
SS
DQ31
V
SS
DQ27
V
SS
CB5
V
SS
CB1
V
SS
DQS8_c
DQS8_t
V
SS
CB7
V
SS
CB3
V
SS
CKE1/
NC
V
DD
Pin
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
Symbol
V
DD
CK1_t
CK1_c
V
DD
V
TT
PARITY
V
DD
BA1
A10/
AP
V
DD
NC
WE_n/
A14
V
DD
NC
V
DD
A13
V
DD
A17
NC/
C2
V
DD
CS3_n/
C1, NC
SA2
V
SS
DQ37
Pin
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275
276
Symbol
DQ41
V
SS
DQS5_c
DQS5_t
V
SS
DQ47
V
SS
DQ43
V
SS
DQ53
V
SS
DQ49
V
SS
DQS6_c
DQS6_t
V
SS
DQ55
V
SS
DQ51
V
SS
DQ61
V
SS
DQ57
V
SS
110 DQS14_t/
TDQS14_t
111 DQS14_c/
TDQS14_c
112
113
114
115
116
117
118
119
120
V
SS
DQ46
V
SS
DQ42
V
SS
DQ52
V
SS
DQ48
V
SS
121 DQS15_t/
TDQS15_t
122 DQS15_c/
TDQS15_c
123
124
125
126
127
128
129
130
131
V
SS
DQ54
V
SS
DQ50
V
SS
DQ60
V
SS
DQ56
V
SS
132 DQS16_t/
TDQS16_t
CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. G 11/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
