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MUN5130

100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
100 mA, 50 V, PNP, 硅, 小信号晶体管, TO-236AB

器件类别:半导体    分立半导体   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
最大集电极电流
0.1000 A
最大集电极发射极电压
50 V
端子数量
3
加工封装描述
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN
each_compli
Yes
欧盟RoHS规范
Yes
中国RoHS规范
Yes
状态
Active
结构
SINGLE WITH BUILT-IN RESISTOR
最小直流放大倍数
3
jedec_95_code
TO-236AB
jesd_30_code
R-PDSO-G3
jesd_609_code
e3
moisture_sensitivity_level
NOT SPECIFIED
元件数量
1
包装材料
PLASTIC/EPOXY
包装形状
RECTANGULAR
包装尺寸
SMALL OUTLINE
eak_reflow_temperature__cel_
260
larity_channel_type
PNP
wer_dissipation_max__abs_
0.4000 W
qualification_status
COMMERCIAL
sub_category
BIP General Purpose Small Signal
表面贴装
YES
端子涂层
MATTE TIN
端子形式
GULL WING
端子位置
DUAL
ime_peak_reflow_temperature_max__s_
40
晶体管应用
SWITCHING
晶体管元件材料
SILICON
dditional_feature
BUILT-IN BIAS RESISTOR RATIO 1
文档预览
MUN2130, MMUN2130L,
MUN5130, DTA113EE,
DTA113EM3, NSBA113EF3
Digital Transistors (BRT)
R1 = 1 kW, R2 = 1 kW
PNP Transistors with Monolithic Bias
Resistor Network
This series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a base−
emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space.
Features
PIN 1
BASE
(INPUT)
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PIN CONNECTIONS
PIN 3
COLLECTOR
(OUTPUT)
R1
R2
PIN 2
EMITTER
(GROUND)
MARKING DIAGRAMS
SC−59
CASE 318D
STYLE 1
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101 Qualified
and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Collector Current − Continuous
Input Forward Voltage
Input Reverse Voltage
Symbol
V
CBO
V
CEO
I
C
V
IN(fwd)
V
IN(rev)
Max
50
50
100
10
10
Unit
Vdc
Vdc
mAdc
Vdc
Vdc
XX MG
G
1
XXX MG
G
1
SOT−23
CASE 318
STYLE 6
XX MG
G
1
XX M
1
XX M
1
XM 1
XXX
M
G
SC−70/SOT−323
CASE 419
STYLE 3
SC−75
CASE 463
STYLE 1
SOT−723
CASE 631AA
STYLE 1
SOT−1123
CASE 524AA
STYLE 1
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking, and shipping information on
page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2015
1
January, 2015 − Rev. 5
Publication Order Number:
DTA113E/D
MUN2130, MMUN2130L, MUN5130, DTA113EE, DTA113EM3, NSBA113EF3
Table 1. ORDERING INFORMATION
Device
MUN2130T1G
MMUN2130LT1G
MUN5130T1G
DTA113EET1G
DTA113EM3T5G, NSVDTA113EM3T5G*
NSBA113EF3T5G
Part Marking
6G
A6G
6G
6G
7E
L (180°)**
Package
SC−59
(Pb−Free)
SOT−23
(Pb−Free)
SC−70/SOT−323
(Pb−Free)
SC−75
(Pb−Free)
SOT−723
(Pb−Free)
SOT−1123
(Pb−Free)
Shipping
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and
PPAP Capable.
** (xx°) = Degree rotation in the clockwise direction.
300
P
D
, POWER DISSIPATION (mW)
250
200
(1) (2) (3) (4) (5)
150
100
50
0
−50
(1) SC−75 and SC−70/SOT323; Minimum Pad
(2) SC−59; Minimum Pad
(3) SOT−23; Minimum Pad
(4) SOT−1123; 100 mm
2
, 1 oz. copper trace
(5) SOT−723; Minimum Pad
−25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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2
MUN2130, MMUN2130L, MUN5130, DTA113EE, DTA113EM3, NSBA113EF3
10
V
CE(sat)
, COLLECTOR−EMITTER
VOLTAGE (V)
I
C
/I
B
= 10
H
FE
, DC CURRENT GAIN
100
V
CE
= 10 V
T
A
= 150°C
10
T
A
= 25°C
T
A
= −55°C
1
T
A
= 25°C
T
A
= 150°C
0.1
T
A
= −55°C
1
0.01
0.1
0
10
20
30
40
50
0.1
1
10
100
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 2. V
CE(sat)
vs. I
C
Figure 3. DC Current Gain
100
I
C
, COLLECTOR CURRENT (mA)
T
A
= 150°C
10
T
A
= −55°C
100
V
o
= 0.2 V
V
in
, INPUT VOLTAGE (V)
10
T
A
= 150°C
T
A
= 25°C
1
T
A
= −55°C
1
T
A
= 25°C
0.1
0
0.5
1
1.5
V
o
= 5 V
2
2.5
0.1
0
10
20
30
40
50
V
in
, INPUT VOLTAGE (V)
I
C
, COLLECTOR CURRENT (mA)
Figure 4. Output Current vs. Input Voltage
12
C
ob
, OUTPUT CAPACITANCE (PF)
10
8
6
4
2
0
0
5
10
15
20
25
Figure 5. Input Voltage vs. Output Current
f = 10 kHz
I
E
= 0 V
T
A
= 25°C
30
35
40
V
R
, REVERSE VOLTAGE (V)
Figure 6. Output Capacitance
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3
MUN2130, MMUN2130L, MUN5130, DTA113EE, DTA113EM3, NSBA113EF3
Table 2. THERMAL CHARACTERISTICS
Characteristic
THERMAL CHARACTERISTICS (SC−59) (MUN2130)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SOT−23) (MMUN2130L)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SC−70/SOT−323) (MUN5130)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SC−75) (DTA113EE)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
THERMAL CHARACTERISTICS (SOT−723) (DTA113EM3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
1.
2.
3.
4.
FR−4 @ Minimum Pad.
FR−4 @ 1.0 x 1.0 Inch Pad.
FR−4 @ 100 mm
2
, 1 oz. copper traces, still air.
FR−4 @ 500 mm
2
, 1 oz. copper traces, still air.
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
T
J
, T
stg
260
600
2.0
4.8
480
205
−55 to +150
mW
mW/°C
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
T
J
, T
stg
200
300
1.6
2.4
600
400
−55 to +150
mW
mW/°C
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
202
310
1.6
2.5
618
403
280
332
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
246
400
2.0
3.2
508
311
174
208
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
R
qJL
T
J
, T
stg
230
338
1.8
2.7
540
370
264
287
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
Symbol
Max
Unit
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4
MUN2130, MMUN2130L, MUN5130, DTA113EE, DTA113EM3, NSBA113EF3
Table 2. THERMAL CHARACTERISTICS
Characteristic
THERMAL CHARACTERISTICS (SOT−1123) (NSBA113EF3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance, Junction to Lead
Junction and Storage Temperature Range
1.
2.
3.
4.
FR−4 @ Minimum Pad.
FR−4 @ 1.0 x 1.0 Inch Pad.
FR−4 @ 100 mm
2
, 1 oz. copper traces, still air.
FR−4 @ 500 mm
2
, 1 oz. copper traces, still air.
P
D
(Note 3)
(Note 4)
(Note 3)
(Note 4)
(Note 3)
(Note 4)
(Note 3)
R
qJA
R
qJL
T
J
, T
stg
254
297
2.0
2.4
493
421
193
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
Symbol
Max
Unit
Table 3. ELECTRICAL CHARACTERISTICS
(T
A
= 25°C, unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector−Base Cutoff Current
(V
CB
= 50 V, I
E
= 0)
Collector−Emitter Cutoff Current
(V
CE
= 50 V, I
B
= 0)
Emitter−Base Cutoff Current
(V
EB
= 6.0 V, I
C
= 0)
Collector−Base Breakdown Voltage
(I
C
= 10
mA,
I
E
= 0)
Collector−Emitter Breakdown Voltage (Note 5)
(I
C
= 2.0 mA, I
B
= 0)
ON CHARACTERISTICS
DC Current Gain (Note 5)
(I
C
= 5.0 mA, V
CE
= 10 V)
Collector−Emitter Saturation Voltage (Note 5)
(I
C
= 10 mA, I
B
= 5.0 mA)
Input Voltage (off)
(V
CE
= 5.0 V, I
C
= 100
mA)
Input Voltage (on)
(V
CE
= 0.3 V, I
C
= 20 mA)
Output Voltage (on)
(V
CC
= 5.0 V, V
B
= 2.5 V, R
L
= 1.0 kW)
Output Voltage (off)
(V
CC
= 5.0 V, V
B
= 0.05 V, R
L
= 1.0 kW)
Input Resistor
Resistor Ratio
h
FE
3.0
V
CE(sat)
V
i(off)
V
i(on)
2.0
V
OL
V
OH
4.9
R1
R
1
/R
2
0.7
0.8
1.0
1.0
1.3
1.2
kW
0.2
Vdc
1.6
Vdc
1.2
0.5
Vdc
0.25
Vdc
5.0
Vdc
I
CBO
I
CEO
I
EBO
V
(BR)CBO
50
V
(BR)CEO
50
Vdc
4.3
Vdc
500
mAdc
100
nAdc
nAdc
Symbol
Min
Typ
Max
Unit
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle
2%.
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参数对比
与MUN5130相近的元器件有:MMUN2130L、MUN2130、NSBA113EF3、DTA113EE、DTA113EM3、MUN2130_15、NSVDTA113EM3T5G。描述及对比如下:
型号 MUN5130 MMUN2130L MUN2130 NSBA113EF3 DTA113EE DTA113EM3 MUN2130_15 NSVDTA113EM3T5G
描述 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
最大集电极电流 0.1000 A 0.1000 A 0.1000 A 0.1000 A 0.1000 A 0.1000 A 0.1000 A -
最大集电极发射极电压 50 V 50 V 50 V 50 V 50 V 50 V 50 V -
端子数量 3 3 3 3 3 3 3 -
加工封装描述 HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN -
each_compli Yes Yes Yes Yes Yes Yes Yes -
欧盟RoHS规范 Yes Yes Yes Yes Yes Yes Yes -
中国RoHS规范 Yes Yes Yes Yes Yes Yes Yes -
状态 Active Active Active Active Active Active Active -
结构 SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR -
最小直流放大倍数 3 3 3 3 3 3 3 -
jedec_95_code TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB -
jesd_30_code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 -
jesd_609_code e3 e3 e3 e3 e3 e3 e3 -
moisture_sensitivity_level NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
元件数量 1 1 1 1 1 1 1 -
包装材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
包装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
包装尺寸 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
eak_reflow_temperature__cel_ 260 260 260 260 260 260 260 -
larity_channel_type PNP PNP PNP PNP PNP PNP PNP -
wer_dissipation_max__abs_ 0.4000 W 0.4000 W 0.4000 W 0.4000 W 0.4000 W 0.4000 W 0.4000 W -
qualification_status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
sub_category BIP General Purpose Small Signal BIP General Purpose Small Signal BIP General Purpose Small Signal BIP General Purpose Small Signal BIP General Purpose Small Signal BIP General Purpose Small Signal BIP General Purpose Small Signal -
表面贴装 YES YES YES YES YES YES YES -
端子涂层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN -
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING -
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
ime_peak_reflow_temperature_max__s_ 40 40 40 40 40 40 40 -
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING -
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON -
dditional_feature BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 BUILT-IN BIAS RESISTOR RATIO 1 -
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