*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these same curves if applied V
R
is sufficiently
below rated V
R
.
15
0.03
0.02
10
5.0
0.01
0.3 0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
0
0
4.0
8.0
12
16
20
24
28
32
36
40
V
R
, REVERSE VOLTAGE (VOLTS)
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
Figure 6. Typical Forward Voltage
Figure 8. Typical Capacitance
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0
20
40
60
80
100
120
140
160
180
200
T
C
, CASE TEMPERATURE (°C)
SQUARE WAVE
DC
RATED VOLTAGE APPLIED
R
qJC
= 13°C/W
T
J
= 175°C
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
5.0
(CAPACITANCE LOAD)
I
PK
+
20
I
10
5.0
SQUARE WAVE
4.0
AV
3.0
T
J
= 175°C
2.0
DC
1.0
0
0
0.5
1.0
1.5
2.0
2.5
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Current Derating, Case
Figure 10. Power Dissipation
www.onsemi.com
4
MURS120T3G Series, SURS8120T3G Series, NRVUS120VT3G Series
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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