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MX1N4714CUR-1

Zener Diode, 33V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MELF-2

器件类别:分立半导体    二极管   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
零件包装代码
DO-213AA
包装说明
O-LELF-R2
针数
2
Reach Compliance Code
compli
ECCN代码
EAR99
外壳连接
ISOLATED
配置
SINGLE
二极管元件材料
SILICON
二极管类型
ZENER DIODE
JEDEC-95代码
DO-213AA
JESD-30 代码
O-LELF-R2
JESD-609代码
e0
元件数量
1
端子数量
2
封装主体材料
GLASS
封装形状
ROUND
封装形式
LONG FORM
极性
UNIDIRECTIONAL
最大功率耗散
0.5 W
认证状态
Not Qualified
参考标准
MIL-19500
标称参考电压
33 V
表面贴装
YES
技术
ZENER
端子面层
TIN LEAD
端子形式
WRAP AROUND
端子位置
END
最大电压容差
2%
工作测试电流
0.05 mA
Base Number Matches
1
文档预览
1N4678UR-1 thru 1N4717UR-1
Available on
commercial
versions
500 mW SURFACE MOUNT ZENER DIODES
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener
voltage regulators provides a selection from 1.8 to 43 volts in standard 5% tolerances as well
as tighter tolerances with a very low test current of 50 µA. These have an internal
metallurgical bond. This type of internally bonded Zener package construction is also
available with high-reliability up-screening as described in the Features section. Microsemi
also offers numerous other Zener products to meet higher and lower power applications.
DO-213AA Package
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
Surface mount equivalent of JEDEC registered 1N4678 thru 1N4717 series.
Internal metallurgical bond.
Hermetically sealed surface mount package.
Tighter voltage tolerances of 2% and 1% are available.
Up-screening available in reference to MIL-PRF-19500 (see
part nomenclature
for all available
options).
RoHS compliant devices available (commercial grade only).
Also available in:
DO-35 (DO-204AH)
(surface mount)
1N4678-1 – 1N4717-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Voltage selection from 1.8 to 43 V.
Standard voltage tolerance +/- 5 %.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Minimal capacitance (see
Figure 2).
Inherently radiation hard as described in Microsemi’s “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
(2)
Steady-State Power Dissipation
Forward Voltage @ 100 mA
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +175
100
250
0.5
1.5
260
Unit
C
o
C/W
o
C/W
W
V
o
C
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
2. At T
EC
< 125
o
C or at ambient T
A
< 50
º
C when mounted on FR4 PC board.
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 1 of 5
1N4678UR-1 thru 1N4717UR-1
MECHANICAL and PACKAGING
CASE: Hermetically sealed glass DO-213AA (SOD80 or MLL34) MELF style package.
TERMINALS: End caps tin-lead plated or RoHS compliant matte-tin plating available (on commercial only) solderable per MIL-
STD-750, method 2026.
POLARITY: Cathode indicated by band where diode is to be operated with the banded end positive with respect to the opposite
end for Zener regulation.
MARKING: Cathode band only.
TAPE & REEL option: Standard per EIA-481-1-B (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: 0.04 grams.
See
Package Dimensions
on last page.
PART NOMENCLATURE
MQ 1N4678 C UR -1 (e3)
Reliability Level
MQ (reference JAN)
MA reference JANTX
MX (reference JANTXV)
MXL (reference JANS)
Blank = Commercial
JEDEC type number
(see
Electrical Characteristics
table)
RoHS Compliance
e3 = RoHS Compliant (available
on commercial grade only)
Blank = non-RoHS Compliant
Metallurgically Bonded
Surface Mount package
Zener Voltage Tolerances
Blank = 5%
C = 2%
D = 1%
Symbol
I
ZT
or I
ZK
I
R
I
ZM
T
SP
V
R
V
Z
SYMBOLS & DEFINITIONS
Definition
Regulator Current: The dc regulator current (I
Z
), at a specified test point (I
ZT
), near breakdown knee (I
ZK
).
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
Temperature Solder Pad: The maximum solder temperature that can be safely applied to the terminal.
Reverse Voltage: The reverse voltage dc value, no alternating component.
Zener Voltage: The Zener voltage the device will exhibit at a specified current (I
Z
) in its breakdown region.
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 2 of 5
1N4678UR-1 thru 1N4717UR-1
ELECTRICAL CHARACTERISTICS
@ 25
o
C unless otherwise noted.
NOMINAL
ZENER
VOLTAGE
(Note 3)
V
Z
ZENER TEST
CURRENT
MAXIMUM
VOLTAGE
REGULATION
(Note 2 & 3)
∆V
Z
MAXIMUM REVERSE
LEAKAGE CURRENT
MAXIMUM dc
ZENER
CURRENT*
I
ZM
mA
240
220
200
190
180
170
160
150
140
130
120
110
100
90
70
63.6
58.0
54.8
52.4
49.6
43.2
40.8
38.0
35.0
32.6
30.8
29.0
26.4
25.0
23.8
21.6
19.8
19.0
17.6
17.0
15.8
14.4
13.2
12.2
11.0
JEDEC TYPE
NUMBER
(Note 1)
I
ZT
I
R
@
V
R
µA
Volts
Volts
1N4678UR-1
1.8
50
0.70
1N4679UR-1
2.0
50
0.70
1N4680UR-1
2.2
50
0.75
1N4681UR-1
2.4
50
0.80
1N4682UR-1
2.7
50
0.85
1N4683UR-1
3.0
50
0.90
1N4684UR-1
3.3
50
0.95
1N4685UR-1
3.6
50
0.95
1N4686UR-1
3.9
50
0.97
1N4687UR-1
4.3
50
0.99
1N4688UR-1
4.7
50
0.99
1N4689UR-1
5.1
50
0.97
1N4690UR-1
5.6
50
0.96
1N4691UR-1
6.2
50
0.95
1N4692UR-1
6.8
50
0.90
1N4693UR-1
7.5
50
0.75
1N4694UR-1
8.2
50
0.50
1N4695UR-1
8.7
50
0.10
1N4696UR-1
9.1
50
0.08
1N4697UR-1
10.0
50
0.10
1N4698UR-1
11.0
50
0.11
1N4699UR-1
12.0
50
0.12
1N4700UR-1
13.0
50
0.13
1N4701UR-1
14.0
50
0.14
1N4702UR-1
15.0
50
0.15
1N4703UR-1
16.0
50
0.16
1N4704UR-1
17.0
50
0.17
1N4705UR-1
18.0
50
0.18
1N4706UR-1
19.0
50
0.19
1N4707UR-1
20.0
50
0.20
1N4708UR-1
22.0
50
0.22
1N4709UR-1
24.0
50
0.24
1N4710UR-1
25.0
50
0.25
1N4711UR-1
27.0
50
0.27
1N4712UR-1
28.0
50
0.28
1N4713UR-1
30.0
50
0.30
1N4714UR-1
33.0
50
0.33
1N4715UR-1
36.0
50
0.36
1N4716UR-1
39.0
50
0.39
1N4717UR-1
43.0
50
0.43
*JEDEC registered data except I
ZM
has been increased (doubled) for 500 mW
NOTES:
1.
2.
3.
µA
Volts
7.5
1.0
5.0
1.0
4.0
1.0
2.0
1.0
1.0
1.0
0.8
1.0
7.5
1.5
7.5
2.0
5.0
2.0
4.0
2.0
10.0
3.0
10.0
3.0
10.0
4.0
10.0
5.0
10.0
5.1
10.0
5.7
1.0
6.2
1.0
6.6
1.0
6.9
1.0
7.6
0.05
8.4
0.05
9.1
0.05
9.8
0.05
10.6
0.05
11.4
0.05
12.1
0.05
12.9
0.05
13.6
0.05
14.4
0.01
15.2
0.01
16.7
0.01
18.2
0.01
19.0
0.01
20.4
0.01
21.2
0.01
22.8
0.01
25.0
0.01
27.3
0.01
29.6
0.01
32.6
power dissipation capabilities.
All types as shown are +/-5% tolerance. Also available in 2% and 1% tolerance.
V
Z
@ 100
µA
minus
V
Z
@ 10
µA.
The electrical characteristics are measured after allowing the device to stabilize for 20 seconds when mounted with 3/8”
minimum lead length from the base.
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 3 of 5
1N4678UR-1 thru 1N4717UR-1
GRAPHS
P
D
RATED POWER DISSIPATION - mW
T
EC
T
A
T
EC
– END CAP TEMPERATURE ( C) or
T
A
on FR4 PC BOARD
o
FIGURE 1
POWER DERATING CURVE
TYPICAL CAPACITANCE IN PICOFARADS (Pf)
At zero volts
At –2 volts (V
R
)
ZENER VOLTAGE V
Z
FIGURE 2
CAPACITANCE vs. ZENER VOLTAGE (TYPICAL)
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 4 of 5
1N4678UR-1 thru 1N4717UR-1
PACKAGE DIMENSIONS
DIM
A
B
C
INCH
MIN
MAX
0.063
0.067
0.130
0.146
0.016
0.022
MILLIMETERS
MIN
MAX
1.60
1.70
3.30
3.70
0.41
0.55
PAD LAYOUT
A
B
C
inch
.200
.055
.080
mm
5.08
1.40
2.03
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 5 of 5
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