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MX27C1000APC-12

1M-BIT [128K x 8] CMOS EPROM

器件类别:存储    存储   

厂商名称:Macronix

厂商官网:http://www.macronix.com/en-us/Pages/default.aspx

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Macronix
零件包装代码
DIP
包装说明
DIP, DIP32,.6
针数
32
Reach Compliance Code
unknow
ECCN代码
EAR99
最长访问时间
120 ns
I/O 类型
COMMON
JESD-30 代码
R-PDIP-T32
长度
41.91 mm
内存密度
1048576 bi
内存集成电路类型
OTP ROM
内存宽度
8
功能数量
1
端子数量
32
字数
131072 words
字数代码
128000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128KX8
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP32,.6
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
座面最大高度
4.9022 mm
最大待机电流
0.0001 A
最大压摆率
0.03 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
15.24 mm
文档预览
PRELIMINARY
MX27C1000A
1M-BIT [128K x 8] CMOS EPROM
FEATURES
128K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 90/100/120/150 ns
Totally static operation
Completely TTL compatible
Operating current: 30mA
Standby current: 100uA
Package type:
-
-
-
-
32 pin plastic DIP
32 pin PLCC
32 pin SOP
32 pin TSOP
GENERAL DESCRIPTION
The MX27C1000A is a 5V only, 1M-bit, One Time
Programmable Read Only Memory. It is organized as
128K words by 8 bits per word, operates from a single +
5 volt supply, has a static standby mode, and features
fast single address location programming. All program-
ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27C1000A supports
an intelligent fast programming algorithm which can
result in programming time of less than thirty seconds.
This One Time Programmable Read Only is packaged in
industry standard 32 pin dual-in-line packages, 32 lead
PLCC, 32 lead SOP and 32 lead TSOP packages.
PGM
PIN CONFIGURATIONS
32 PDIP/SOP
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
32 PLCC
VCC
VPP
A12
A15
A16
A7
A6
A5
A4
A3
A2
A1
A0
Q0
5
4
1
32
30
29
NC
A14
A13
A8
A9
MX27C1000A
9
MX27C1000A
25
A11
OE
A10
CE
13
14
Q1
Q2
GND
17
Q3
Q4
Q5
21
20
Q6
Q7
32 TSOP
A11
A9
A8
A13
A14
NC
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
PIN DESCRIPTION
SYMBOL
A0~A16
Q0~Q7
CE
OE
PGM
VPP
NC
VCC
GND
PIN NAME
Address Input
Data Input/Output
Chip Enable Input
Output Enable Input
Programmable Enable Input
Program Supply Voltage
No Internal Connection
Power Supply Pin (+5V)
Ground Pin
REV. 1.1, JUL. 19, 2001
MX27C1000A
P/N: PM0733
1
MX27C1000A
BLOCK DIAGRAM
CE
PGM
OE
CONTROL
LOGIC
OUTPUT
BUFFERS
PROGRAM INHIBIT MODE
Programming of multiple MX27C1000As in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C1000A may be common.
A TTL low-level program pulse applied to an
MX27C1000A CE input with VPP = 12.5
±
0.5 V and
PGM LOW will program that MX27C1000A. A high-level
CE input inhibits the other MX27C1000As from being
programmed.
Q0~Q17
A0~A16
ADDRESS
INPUTS
.
.
.
.
.
.
.
.
Y-DECODER
.
.
.
.
.
.
.
.
Y-SELECT
X-DECODER
1M BIT
CELL
MAXTRIX
VCC
GND
VPP
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.
FUNCTIONAL
DESCRIPTION
THE PROGRAMMING OF THE MX27C1000A
When the MX27C1000A is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C1000 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp.
When
programming an MXIC OTP ROM, a 01.uF capacitor
is required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C
±
5° ambient temperature range
C
that is required when programming the MX27C1000A.
To activate this mode, the programming equipment must
force 12.0
±
0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27C1000A, these two identifier bytes are given
in the Mode Select Table. All identifiers for manufacturer
and device codes will possess odd parity, with the MSB
(DQ7) defined as the parity bit.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved
by applying a single TTL low level 10us pulse to the
PGM input after addresses and data line are stable. If
the data is not verified, an additional pulse is applied
for a maximum of 25 pulses. This process is repeated
while sequencing through each address of the device.
When the programming mode is completed, the data in
all address is verified at VCC = VPP = 5V
±
10%.
READ MODE
The MX27C1000A has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
REV. 1.1, JUL. 19, 2001
P/N: PM0733
2
MX27C1000A
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tQE.
It is recommended that CE be decoded and used as
the primary device-selecting function, while OE be made
a common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a particular
memory device.
STANDBY MODE
SYSTEM CONSIDERATIONS
The MX27C1000A has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC
±
0.3 V.
The MX27C1000A also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
MODE SELECT TABLE
PINS
MODE
Read
Output Disable
Standby (TTL)
Standby (CMOS)
Program
Program Verify
Program Inhibit
Manufacturer Code(3)
Device Code(27C1000)(3)
CE
VIL
VIL
VIH
VCC±0.3V
VIL
VIL
VIH
VIL
VIL
OE
VIL
VIH
X
X
VIH
VIL
X
VIL
VIL
PGM
X
X
X
X
VIL
VIH
X
X
X
A0
X
X
X
X
X
X
X
VIL
VIH
A9
X
X
X
X
X
X
X
VH
VH
VPP
VCC
VCC
VCC
VCC
VPP
VPP
VPP
VCC
VCC
OUTPUTS
DOUT
High Z
High Z
High Z
DIN
DOUT
High Z
C2H
CAH
NOTES:
1. VH = 12.0 V
±
0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A16 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
REV. 1.1, JUL. 19, 2001
P/N: PM0733
3
MX27C1000A
FIGURE 1. FAST PROGRAMMING FLOWCHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 10us PULSE
INTERACTIVE
SECTION
INCREMENT X
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
INCREMENT ADDRESS
LAST ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0733
REV. 1.1, JUL. 19, 2001
4
MX27C1000A
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
CL
6.2K ohm
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance
SWITCHING TEST WAVEFORMS
2.0V
AC driving levels
2.0V
TEST POINTS
0.8V
OUTPUT
0.8V
INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade.
Input pulse rise and fall times are equal to or less than 10ns.
P/N: PM0733
REV. 1.1, JUL. 19, 2001
5
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