Flash, 512KX16, 90ns, PBGA48, 8 X 6 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, TFBGA-48
厂商名称:Macronix
厂商官网:http://www.macronix.com/en-us/Pages/default.aspx
下载文档型号 | MX29F800CBXEI-90G | MX29F800CBMI-90G | MX29F800CTMI-90G | MX29F800CBTI-90G | MX29F800CTXEI-90G | MX29F800CTTI-90G |
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描述 | Flash, 512KX16, 90ns, PBGA48, 8 X 6 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, TFBGA-48 | Flash, 512KX16, 90ns, PDSO44, 0.500 INCH, ROHS COMPLIANT, MO-175, SOP-44 | Flash, 512KX16, 90ns, PDSO44, 0.500 INCH, ROHS COMPLIANT, MO-175, SOP-44 | Flash, 512KX16, 90ns, PDSO48, 20 X 18 MM, ROHS COMPLIANT, MO-142, TSOP1-48 | Flash, 512KX16, 90ns, PBGA48, 8 X 6 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, TFBGA-48 | Flash, 512KX16, 90ns, PDSO48, 20 X 18 MM, ROHS COMPLIANT, MO-142, TSOP1-48 |
厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
零件包装代码 | BGA | SOIC | SOIC | TSOP1 | BGA | TSOP1 |
包装说明 | 8 X 6 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, TFBGA-48 | SOP, | SOP, | TSOP1, | LFBGA, | TSOP1, |
针数 | 48 | 44 | 44 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 |
长度 | 8 mm | 28.5 mm | 28.5 mm | 18.4 mm | 8 mm | 18.4 mm |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 44 | 44 | 48 | 48 | 48 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | SOP | SOP | TSOP1 | LFBGA | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.3 mm | 3 mm | 3 mm | 1.2 mm | 1.3 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING |
端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.8 mm | 0.5 mm |
端子位置 | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | DUAL |
宽度 | 6 mm | 12.6 mm | 12.6 mm | 12 mm | 6 mm | 12 mm |
启动块 | BOTTOM | BOTTOM | TOP | - | TOP | TOP |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE |