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MX7535KP-T

Digital to Analog Converters - DAC 14-Bit Precision DAC

器件类别:模拟混合信号IC    转换器   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Maxim(美信半导体)
零件包装代码
QLCC
包装说明
PLASTIC, LCC-28
针数
28
Reach Compliance Code
not_compliant
最大模拟输出电压
10 V
最小模拟输出电压
-10 V
转换器类型
D/A CONVERTER
输入位码
BINARY, OFFSET BINARY
输入格式
PARALLEL, WORD
JESD-30 代码
S-PQCC-J28
JESD-609代码
e0
长度
11.505 mm
最大线性误差 (EL)
0.0061%
位数
14
功能数量
1
端子数量
28
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
QCCJ
封装等效代码
LDCC28,.5SQ
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
245
电源
12/15,GND/-0.3 V
认证状态
Not Qualified
座面最大高度
4.57 mm
最大稳定时间
1.5 µs
标称安定时间 (tstl)
0.8 µs
最大压摆率
4 mA
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
11.505 mm
文档预览
19-1116; Rev 1; 11/96
Microprocessor-Compatible,
14-Bit DACs
_______________General Description
The MX7534/MX7535 are high-performance, CMOS,
monolithic, 14-bit digital-to-analog converters (DACs).
Wafer-level, laser-trimmed, thin-film resistors and tempera-
ture-compensated NMOS switches assure operation over
the full operating temperature range with exceptional lin-
ear and gain stability.
The MX7534 accepts right-justified data in two bytes from
an 8-bit bus, while the MX7535 operates with a 14-bit data
bus with separate MS-byte and LS-byte select controls. In
addition, all digital inputs are compatible with both TTL and
5V CMOS-logic levels. The MX7534/MX7535 are intended
for unipolar operation, but may be operated as bipolar
DACs with additional external components. Both devices
are protected against CMOS latchup, and neither requires
the use of external Schottky protection diodes.
The MX7534 is available in 20-pin narrow (0.3") DIP, wide
SO, or PLCC packages. The MX7535 is available in
28-pin, 600 mil wide DIP, wide SO, or PLCC packages.
____________________________Features
o
14-Bit Monotonic Over Full Temperature Range
o
Full 4-Quadrant Multiplication
o
µP-Compatible, Double-Buffered Inputs
o
Exceptionally Low Gain Tempco (2.5ppm/°C)
o
Low Output Leakage (<20nA) Over Temp.
o
Low Power Consumption
o
TTL and CMOS Compatible
MX7534/MX7535
______________Ordering Information
PART
MX7534KN
MX7534JN
MX7534KCWP
MX7534JCWP
MX7534KP
MX7534JP
MX7534J/D
MX7534BQ
MX7534AQ
MX7534BD
MX7534AD
MX7534KEWP
MX7534JEWP
MX7534TQ
MX7534SQ
MX7534TD
MX7534SD
TEMP. RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
-25°C to +85°C
-25°C to +85°C
-25°C to +85°C
-25°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
PIN-PACKAGE INL (LSBs)
20 Plastic DIP
20 Plastic DIP
20 SO
20 SO
20 PLCC
20 PLCC
Dice*
20 CERDIP
20 CERDIP
20 Ceramic SB
20 Ceramic SB
20 SO
20 SO
20 CERDIP
20 CERDIP
20 Ceramic SB
20 Ceramic SB
±1
±2
±1
±2
±1
±2
±2
±1
±2
±1
±2
±1
±2
±1
±2
±1
±2
________________________Applications
Machine and Motion Control Systems
Automatic Test Equipment
Digital Audio
µP-Controlled Calibration Circuitry
Programmable-Gain Amplifiers
Digitally Controlled Filters
Programmable Power Supplies
Ordering Information continued at end of data sheet.
*Dice
are tested at +25°C, DC parameters only.
_________________Pin Configurations
TOP VIEW
REF 1
RFB 2
IOUT 3
AGNDS 4
AGNDF 5
DGND 6
D7 7
D6
8
20 V
SS
19 V
DD
18 CS
17 WR
_______________Functional Diagrams
V
DD
19
REF
1
14-BIT DAC
14
DAC REGISTER
6
MS
INPUT
REGISTER
8
LS
INPUT
REGISTER
MX7534
2
RFB
3
IOUT
4 AGNDS
5 AGNOF
15
A1
16
A0
18 CS
17
WR
MX7534
16 A0
15 A1
14 D0
13 D1
12 D2
11 D3
CONTROL
LOGIC
D5 9
D4 10
DIP/SO/PLCC/Ceramic SB
MX7535 at end of data sheet.
7–14
D7–D0
6
DGND
20
V
SS
Functional diagrams continued at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
Microprocessor-Compatible,
14-Bit DACs
MX7534/MX7535
ABSOLUTE MAXIMUM RATINGS
V
DD
to DGND ............................................................-0.3V, +17V
V
SS
to AGND .............................................................-15V, +0.3V
REF to AGND (MX7534) ......................................................±25V
REFS to AGND (MX7535) ....................................................±25V
REFF to AGND (MX7535) ....................................................±25V
RFB to AGND.......................................................................±25V
Digital Input Voltage to DGND.........................-0.3V, V
DD
+ 0.3V
IOUT to DGND .................................................-0.3V, V
DD
+ 0.3V
AGND to DGND ...............................................-0.3V, V
DD
+ 0.3V
Continuous Power Dissipation (T
A
= +70°C)
20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW
28-Pin Plastic DIP (derate 14.29mW/°C above +70°C) ......1.14W
20-Pin SO (derate 10.00mW/°C above +70°C)..............800mW
28-Pin SO (derate 12.50mW/°C above +70°C).....................1W
20-Pin PLCC (derate 10.00mW/°C above +70°C) .........800mW
28-Pin PLCC (derate 10.53mW/°C above +70°C) .........842mW
20-Pin CERDIP (derate 11.11mW/°C above +70°C)......889mW
28-Pin CERDIP (derate 16.67mW/°C above +70°C)........1.33W
20-Pin Ceramic SB
(derate 11.76mW/°C above +70°C) .............................941mW
28-Pin Ceramic SB
(derate 20.00mW/°C above +70°C) ................................1.6W
Operating Temperature Ranges
MX753_J/K ............................................................0°C to +70°C
MX753_A/B ........................................................-25°C to +85°C
MX753_EW_.......................................................-40°C to +85°C
MX753_S/T.......................................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= +11.4V to +15.75V (Note 1), V
REF
= 10V, V
IOUT
= V
AGNDS
= V
SS
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted.)
PARAMETER
DC ACCURACY
Resolution
Relative Accuracy
Differential Nonlinearity
Full-Scale Error
Gain Temperature Coefficient
(Note 2)
INL
MX753_K/B/T
MX753_J/A/S
Guaranteed Monotonic
Measured with internal R
FB
, MX753_K/B/T
includes effects of leakage
MX753_J/A/S
current and gain TC
MX753_K/B/T
MX753_J/A/S
All digital
inputs at 0V
Output Leakage Current
I
OUT
All digital
inputs at 0V,
V
SS
= 0V
T
A
= +25°C
T
A
= T
MIN
to T
MAX
MX753_J/K/A/B
MX753_S/T
±0.5
±0.5
14
±1
±2
±1
±4
LSB
±8
±2.5
±5
±5
±25
±150
nA
ppm/°C
Bits
LSB
LSB
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
REFERENCE INPUT
Reference Voltage Input
Resistance (Note 3)
DIGITAL INPUTS
Input High Voltage
Input Low Voltage
Input Leakage Current
Input Capacitance (Note 2)
C
IN
V
INH
V
INL
Digital inputs
at 0V or V
DD
T
A
= +25°C
T
A
= T
MIN
to T
MAX
2.4
0.8
±1
±10
7
V
V
µA
pF
R
REF
3.5
6
10
kΩ
2
_______________________________________________________________________________________
Microprocessor-Compatible,
14-Bit DACs
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= +11.4V to +15.75V (Note 1), V
REF
= 10V, V
IOUT
= V
AGNDS
= V
SS
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted.)
PARAMETER
POWER REQUIREMENTS
Positive Supply-Voltage Range
Negative Supply-Voltage Range
Positive Supply Current
Negative Supply Current
V
DD
V
SS
I
DD
I
SS
For specific performance
For specific performance
Digital inputs at
V
INH
or V
INL
Digital inputs at 0V or V
DD
MX7534
MX7535
11.4
-200
15.75
-500
3
4
500
V
mV
mA
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MX7534/MX7535
Note 1:
Specifications are guaranteed for V
DD
of +11.4V to +15.75V. At V
DD
= +5V, device is still functional with degraded specifications.
Note 2:
Guaranteed by design, not tested.
Note 3:
Resistors have a typical -300ppm/°C tempco.
AC PERFORMANCE CHARACTERISTICS
(Note 4)
(V
DD
= +11.4V to +15.75V, V
REF
= 10V, V
IOUT
= V
AGND
(V
AGNDS
for MX7535) = V
SS
= 0V, output amplifier is AD544*,
T
A
= T
MIN
to T
MAX
, unless otherwise noted.)
PARAMETER
Output Current Setting Time
SYMBOL
CONDITIONS
T
A
= +25°C, to 0.003% of full-scale range,
IOUT load = 100Ω
II
13pF, DAC register
alternately loaded with all 1s and all 0s
Measured with V
REF
= 0V,
IOUT loads = 100Ω
II
13pF, DAC register
alternately loaded with all 1s and all 0s
V
REF
= ±10V, 10kHz
sine wave, DAC register
loaded with all 0s
∆V
DD
= ±5%
C
OUT
T
A
= +25°C
T
A
= T
MIN
to T
MAX
T
A
= +25°C
T
A
= T
MIN
to T
MAX
MIN
TYP
0.8
MAX
1.5
UNITS
µs
Digital-to-Analog Glitch Impulse
Multiplying Feedthrough Error
(Note 5)
Power-Supply Rejection
Output Capacitance (IOUT Pin)
Output Noise Voltage Density
(10Hz–100kHz)
50
3
nV-sec
mVp-p
5
±0.01
±0.02
260
130
15
%/%
pF
nV/Hz
DAC register loaded with all 1s
DAC register loaded with all 0s
Measured between R
FB
and I
OUT
Note 4:
These characteristics are included for design guidance only, and are not subject to test.
Note 5:
Feedthrough can be further reduced by connecting the metal lid on the ceramic package to DGND.
* AD544 is an Analog Devices part.
_______________________________________________________________________________________
3
Microprocessor-Compatible,
14-Bit DACs
MX7534/MX7535
TIMING CHARACTERISTICS (MX7534)
(V
DD
= +11.4V to +15.75V, V
REF
= 10V, V
IOUT
= V
AGND
= V
SS
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. See Figure 1a for
timing diagram.)
PARAMETER
Address Valid to Write Setup Time
Address Valid to Write Hold Time
Data Setup Time
SYMBOL
t
1
t
2
T
A
= +25°C
t
3
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
T
A
= +25°C
Data Hold Time
Chip-Select to Write-Setup Time
Chip-Select to Write-Hold Time
Write Pulse Width
t
4
t
5
t
6
T
A
= +25°C
t
7
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
CONDITIONS
MIN
0
0
60
70
80
20
20
30
0
0
170
200
240
ns
ns
ns
ns
ns
TYP
MAX
UNITS
ns
ns
TIMING CHARACTERISTICS (MX7535)
(V
DD
= +11.4V to +15.75V, V
REF
= 10V, V
IOUT
= V
AGNDS
= V
SS
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. See Figure 1b for
timing diagram.)
PARAMETER
CSMSB
or
CSLSB
to
WR
Setup Time
CSMSB
or
CSLSB
to
WR
Hold Time
LDAC
Pulse Width
SYMBOL
t
1
t
2
T
A
= +25°C
t
3
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
T
A
= +25°C
Write Pulse Width
t
4
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
T
A
= +25°C
Data-Setup Time
t
5
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
T
A
= +25°C
Data-Hold Time
t
6
T
A
= -25°C to +85°C
T
A
= -55°C to +125°C
CONDITIONS
MIN
0
0
170
200
240
170
200
240
140
160
180
20
20
30
ns
ns
ns
ns
TYP
MAX
UNITS
ns
ns
4
_______________________________________________________________________________________
Microprocessor-Compatible,
14-Bit DACs
__________Pin Description (MX7534)
PIN
NAME
REF
RFB
IOUT
AGNDS
FUNCTION
Reference Input to DAC
Feedback Resistor. Used to close the
loop around an external op amp.
Current Output
Analog Ground Sense. Reference
point for external circuitry. AGNDS
should carry minimum current.
Analog Ground Force. Carries current
from internal analog ground connec-
tions. AGNDS and AGNDF are tied
together internally.
Digital Ground
Data Bit 7
Data Bit 6
Data Bit 5 or Data Bit 13 (MSB)
Data Bit 4 or Data Bit 12
Data Bit 3 or Data Bit 11
Data Bit 2 or Data Bit 10
Data Bit 1 or Data Bit 9
Data Bit 0 (LSB) or Data Bit 8
Address Input 1
Address Input 0
Write Input. Active low.
Chip-Select Input. Active low.
+12V to +15V Supply-Voltage Input
Bias pin for high-temperature,
low-leakage configuration
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
DGND
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CSMSB
LDAC
CSLSB
WR
V
DD
V
SS
N.C.
__________Pin Description (MX7535)
PIN
NAME
REFS
REFF
RFB
IOUT
AGNDS
FUNCTION
Reference Voltage Sense
Reference Voltage Force
Feedback Resistor. Used to close the
loop around an external op amp.
Current Output
Analog Ground Sense. Reference
point for external circuitry. This pin
should carry minimum current.
Analog Ground Force. Carries current
from internal analog ground
connections. AGNDS and AGNDF
are tied together internally.
Digital Ground
Data Bit 13 (MSB)
Data Bit 12
Data Bit 11
Data Bit 10
Data Bit 9
Data Bit 8
Data Bit 7
Data Bit 6
Data Bit 5
Data Bit 4
Data Bit 3
Data Bit 2
Data Bit 1
Data Bit 0 (LSB)
Chip-Select Most Significant Byte.
Active low.
Asynchronous Load DAC Input.
Active low.
Chip-Select Least Significant Byte.
Active low.
Write Input. Active low.
+12V to +15V Supply-Voltage Input
Bias pin for high-temperature,
low-leakage configuration
No Connection. Not internally connected.
MX7534/MX7535
1
2
3
4
1
2
3
4
5
5
AGNDF
6
AGNDF
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
DGND
D7
D6
D5
D4
D3
D2
D1
D0
A1
A0
WR
CS
V
DD
V
SS
_______________________________________________________________________________________
5
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