80960SB
EMBEDDED 32-BIT MICROPROCESSOR
WITH 16-BIT BURST DATA BUS
s
High-Performance Embedded Architecture
s
Built-in Interrupt Controller
— 16 MIPS* Burst Execution at 16 MHz
— 5 MIPS Sustained Execution at 16 MHz
s
512-Byte On-Chip Instruction Cache
— Direct Mapped
— Parallel Load/Decode for Uncached
Instructions
s
Multiple Register Sets
— Sixteen Global 32-Bit Registers
— Sixteen Local 32-Bit Registers
— Four Local Register Sets Stored
On-Chip
— Register Scoreboarding
s
Pin Compatible with 80960SA
— 4 Direct Interrupt Pins
— 31 Priority Levels, 256 Vectors
s
Built-In Floating Point Unit
— Fully IEEE 754 Compatible
s
Easy to Use, High Bandwidth 16-Bit Bus
— 25.6 Mbytes/s Burst
— Up to 16 Bytes Transferred per Burst
s
32-Bit Address Space, 4 Gigabytes
s
80-Lead Quad Flat Pack (EIAJ QFP)
— 84-Lead Plastic Leaded Chip Carrier
(PLCC)
s
Software Compatible with
80960KA/KB/CA/CF Processors
The 80960SB is a member of Intel’s i960
®
32-bit processor family, which is designed especially for low cost
embedded applications. It includes a 512-byte instruction cache, an integrated floating-point unit and a built-in
interrupt controller. The 80960SB has a large register set, multiple parallel execution units and a 16-bit burst
bus. Using advanced RISC technology, this high performance processor is capable of execution rates in excess
of 5 million instructions per second
*
. The 80960SB is well-suited for a wide range of cost sensitive embedded
applications including non-impact printers, network adapters and I/O controllers.
FOUR
80-BIT FP
REGISTERS
80-BIT
FPU
SIXTEEN
32-BIT GLOBAL
REGISTERS
64- BY 32-BIT
LOCAL
REGISTER
CACHE
32-BIT
INSTRUCTION
EXECUTION
UNIT
INSTRUCTION
FETCH UNIT
512-BYTE
INSTRUCTION
CACHE
INSTRUCTION
DECODER
MICRO-
INSTRUCTION
SEQUENCER
MICRO-
INSTRUCTION
ROM
32-BIT
BUS
CONTROL
LOGIC
32-BIT
ADDRESS
16-BIT
BURST
BUS
Figure 1. The 80960SB Processor’s Highly Parallel Architecture
* Relative to Digital Equipment Corporation’s VAX-11/780 at 1 MIPS (VAX-11™ is a trademark of Digital Equipment
Corporation)
Intel Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in an Intel product. No other circuit patent
licenses are implied. Information contained herein supersedes previously published specifications on these devices from Intel.
© INTEL CORPORATION, 1993
November 1993
Order Number: 272207-002
80960SB
EMBEDDED 32-BIT MICROPROCESSOR
WITH 16-BIT BURST DATA BUS
CONTENTS
PAGE
1.0 THE i960
®
PROCESSOR
...........................................................................................................................1
1.1 Key Performance Features .................................................................................................................2
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ...............................................................................................................................4
1.1.3 Large Register Set ...................................................................................................................4
1.1.4 Multiple Register Sets ..............................................................................................................5
1.1.5 Instruction Cache .....................................................................................................................5
1.1.6 Register Scoreboarding ........................................................................................................... 5
1.1.7 Floating-Point Arithmetic .......................................................................................................... 6
1.1.8 High Bandwidth Bus ................................................................................................................6
1.1.9 Interrupt Handling ....................................................................................................................7
1.1.10 Debug Features .....................................................................................................................7
1.1.11 Fault Detection .......................................................................................................................7
1.1.12 Built-in Testability ...................................................................................................................7
1.1.13 CHMOS .................................................................................................................................. 7
2.0 ELECTRICAL SPECIFICATIONS.............................................................................................................
11
2.1 Power and Grounding ....................................................................................................................... 11
2.2 Power Decoupling Recommendations .............................................................................................. 11
2.3 Connection Recommendations ......................................................................................................... 11
2.4 Characteristic Curves ....................................................................................................................... 11
2.5 Test Load Circuit ............................................................................................................................... 13
2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14
2.7 DC Characteristics ............................................................................................................................ 14
2.8 AC Specifications .............................................................................................................................. 15
3.0 MECHANICAL DATA
............................................................................................................................... 20
3.1 Packaging ......................................................................................................................................... 20
3.2 Pin Assignment ................................................................................................................................. 20
3.3 Pinout ................................................................................................................................................ 22
3.4 Package Thermal Specifications ...................................................................................................... 26
4.0 WAVEFORMS
........................................................................................................................................... 27
5.0 REVISION HISTORY
................................................................................................................................ 33
ii
LIST OF FIGURES
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
PAGE
The 80960SB Processor’s Highly Parallel Architecture ................................................................ 0
80960SB Programming Environment ........................................................................................... 1
Instruction Formats ...................................................................................................................... 4
Multiple Register Sets Are Stored On-Chip .................................................................................. 6
Connection Recommendation for LOCK .................................................................................... 11
Typical Supply Current vs. Case Temperature ........................................................................... 12
Typical Current vs. Frequency (Room Temp) ............................................................................. 12
Typical Current vs. Frequency (Hot Temp) ................................................................................. 13
Capacitive Derating Curve ......................................................................................................... 13
Test Load Circuit for Three-State Output Pins ............................................................................ 13
Drive Levels and Timing Relationships for 80960SB Signals ..................................................... 15
Processor Clock Pulse (CLK2) ................................................................................................... 18
RESET Signal Timing ................................................................................................................. 18
HOLD Timing .............................................................................................................................. 19
80-Lead EIAJ Quad Flat Pack (QFP) Package .......................................................................... 20
84-Lead Plastic Leaded Chip Carrier (PLCC) Package ............................................................. 21
Non-Burst Read and Write Transactions Without Wait States .................................................... 27
Quad Word Burst Read Transaction With 1, 0, 0, 0, 0, 0, 0, 0 Wait States ................................ 28
Burst Write Transaction With 2, 1, 1, 1 Wait States (6-8 Bytes Transferred) .............................. 29
Accesses Generated by Quad Word Read Bus Request,
Misaligned One Byte from Quad Word Boundary 1, 0, 0, 0, 0, 0, 0, 0 Wait States
30
Interrupt Acknowledge Cycle ...................................................................................................... 31
Cold Reset Waveform ................................................................................................................ 32
LIST OF TABLES
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
80960SB Instruction Set .............................................................................................................. 3
Memory Addressing Modes ......................................................................................................... 4
Sample Floating-Point Execution Times (µs) at 16 MHz .............................................................. 6
80960SB Pin Description: Bus Signals ........................................................................................ 8
80960SB Pin Description: Support Signals ................................................................................ 10
DC Characteristics ..................................................................................................................... 14
80960SB AC Characteristics (10 MHz) ...................................................................................... 16
80960SB AC Characteristics (16 MHz) ...................................................................................... 17
80960SB QFP Pinout — In Pin Order ........................................................................................ 22
80960SB QFP Pinout — In Signal Order ................................................................................... 23
80960SB PLCC Pinout — In Pin Order ...................................................................................... 24
80960SB PLCC Pinout — In Signal Order ................................................................................. 25
80960SB QFP Package Thermal Characteristics ...................................................................... 26
80960SB PLCC Package Thermal Characteristics .................................................................... 26
iii
80960SB
1.0
THE i960
®
PROCESSOR
The 80960SB is a member of the 32-bit architecture
from Intel known as the i960 processor family. These
microprocessors were especially designed to serve
the needs of embedded applications. The embedded
market includes applications as diverse as industrial
automation, avionics, image processing, graphics
and networking. These types of applications require
high integration, low power consumption, quick
interrupt response times and high performance.
Since time to market is critical, embedded micropro-
cessors need to be easy to use in both hardware and
software designs.
All members of the i960 processor family share a
common core architecture which utilizes RISC
technology so that, except for special functions, the
family members are object-code compatible. Each
new processor in the family adds its own special set
of functions to the core to satisfy the needs of a
specific application or range of applications in the
embedded market.
0000 0000H
FFFF FFFFH
ADDRESS SPACE
ARCHITECTURALLY
DEFINED
DATA STRUCTURES
FETCH
INSTRUCTION
CACHE
LOAD
STORE
INSTRUCTION
STREAM
INSTRUCTION
EXECUTION
PROCESSOR STATE
REGISTERS
INSTRUCTION
POINTER
ARITHMETIC
CONTROLS
PROCESS
CONTROLS
TRACE
CONTROLS
SIXTEEN 32-BIT
LOCAL REGISTERS
r0
r15
SIXTEEN 32-BIT
GLOBAL REGISTERS
g0
g15
FOUR 80-BIT
FLOATING POINT REGISTERS
CONTROL REGISTERS
Figure 2. 80960SB Programming Environment
1
