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NAND256W3M4AZBF

SPECIALTY MEMORY CIRCUIT, PBGA149, 10 X 13.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-149

器件类别:存储    存储   

厂商名称:ST(意法半导体)

厂商官网:http://www.st.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
ST(意法半导体)
零件包装代码
BGA
包装说明
10 X 13.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-149
针数
149
Reach Compliance Code
compliant
JESD-30 代码
R-PBGA-B149
长度
13.5 mm
内存密度
268435456 bit
内存集成电路类型
MEMORY CIRCUIT
内存宽度
16
功能数量
1
端子数量
149
字数
16777216 words
字数代码
16000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-30 °C
组织
16MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.5 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
宽度
10 mm
文档预览
NAND256-M
NAND512-M, NAND01G-M
256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND
Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
PRELIMINARY DATA
Feature summary
Multi-Chip Packages
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
Flash + 1 die of 256 Mb (x16) SDR
LPSDRAM
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
Flash + 2 dice of 256 Mb (x16) SDR
LPSDRAMs
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
Flash +1 die of 256 Mb (x16) DDR
LPSDRAM
– 1 die of 512 Mb (x16) NAND Flash + 1 die
of 256 Mb or 512 Mb (x16) DDR LPSDRAM
Supply voltages
– V
DDF
= 1.7V to 1.95V or 2.5V to 3.6V
– V
DDD
= V
DDQD
= 1.7V to 1.9V
Electronic Signature
ECOPACK
®
packages
Temperature range
– -30 to 85°C
FBGA
TFBGA107 10.5 x 13 x 1.2mm
TFBGA149 10 x 13.5 x 1.2mm
LFBGA137 10.5 x 13 x 1.4mm
Fast Block Erase
– Block erase time: 2ms (typ)
Status Register
Data integrity
– 100,000 Program/Erase cycles
– 10 years Data Retention
LPSDRAM
Interface: x16 bus width
Deep Power Down mode
1.8v LVCMOS interface
Quad internal Banks controlled by BA0 and
BA1
Automatic and controlled Precharge
Auto Refresh and Self Refresh
– 8,192 Refresh cycles/64ms
– Programmable Partial Array Self Refresh
– Auto Temperature Compensated Self
Refresh
Wrap sequence: sequential/interleave
Burst Termination by Burst Stop command and
Precharge command
Flash Memory
NAND Interface
– x8 or x16 bus width
– Multiplexed Address/ Data
Page size
– x8 device: (512 + 16 spare) Bytes
– x16 device: (256 + 8 spare) Words
Block size
– x8 device: (16K + 512 spare) Bytes
– x16 device: (8K + 256 spare) Words
Page Read/Program
– Random access: 12µs (max)
– Sequential access: 50ns (min)
– Page program time: 200µs (typ)
Copy Back Program mode
– Fast page copy without external buffering
May 2006
Rev 4
1/22
www.st.com
2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
NAND256-M, NAND512-M, NAND01G-M
Table 1.
Reference
Product List
Part Number
NAND256R3M0
NAND Product
256 Mbit (x8), 1.8V
256Mbit (x16) 1.8V
256Mbit (x16) 3V
LPSDRAM Product
256 Mbit SDR, (x16), 1.8V, 104MHz
256 Mbit DDR (x16) 1.8V, 133MHz
256 Mbit SDR (x16), 1.8V, 104MHz
256 Mbit SDR (x16), 1.8V, 104MHz
512 Mbit (x8), 1.8V
256 Mbit DDR (x16) 1.8V, 133MHz
512 Mbit DDR (x16) 1.8V, 133MHz
512Mbit (x8) 3V
512Mbit SDR (2x16) (2x256Mbit
SDR x16) 1.8V,104Mhz
512 Mbit SDR (2x16) (2 x 256Mbit
SDR x16) 1.8V, 104MHz
Package
TFBGA107
TFBGA149
TFBGA149
TFBGA107
TFBGA149
TFBGA149
LFBGA 137
LFBGA137
NAND256-M
NAND256R4M3
NAND256W3M4
NAND512R3M0
NAND512R4M3
NAND512-M
NAND512R4M5
NAND512W3M2
NAND01G-M
NAND01GW3M2 2 x 512Mbit NAND (x8) 3V
2/22
NAND256-M, NAND512-M, NAND01G-M
Contents
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
NAND Flash Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LPSDRAM Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
3
4
5
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3/22
List of tables
NAND256-M, NAND512-M, NAND01G-M
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Product List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Signal Names: NAND Flash & 1 x SDR LPSDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Signal Names: NAND Flash & 2 x SDR LPSDRAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Signal Names - NAND Flash & DDR LPSDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
TFBGA107 10.5x13mm - 10x14 active ball array, 0.80mm pitch, Mechanical Data. . . . . . 17
TFBGA149 10x13.5mm - 12x16 active ball array, 0.80mm pitch, Mechanical Data. . . . . . 18
LFBGA137 10.5x13mm - 10x13 active ball array, 0.8mm pitch- Mechanical Data. . . . . . . 19
Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4/22
NAND256-M, NAND512-M, NAND01G-M
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic Diagram: NAND Flash & 1 x SDR LPSDRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Diagram: NAND Flash & 2 x SDR LPSDRAMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Diagram: NAND Flash & DDR LPSDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
TFBGA107 Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TFBGA149 Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LFBGA137 Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
TFBGA107 10.5x13mm - 10x14 active ball array, 0.80mm pitch, Bottom Outline . . . . . . . 17
TFBGA149 10x13.5mm - 12x16 active ball array, 0.80mm pitch, Bottom Outline . . . . . . . 18
LFBGA137 10.5x13mm - 10x13 active ball array, 0.8mm pitch- Bottom Outline . . . . . . . . 19
5/22
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