Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Short circuits from the output to V
CC
can cause excessive heating and potential destruction. The maximum short circuit current is independent
of the magnitude of V
CC
.
Table 2. THERMAL INFORMATION
(Note 2)
Thermal Metric
Junction to Ambient – SOIC8
Symbol
q
JA
Limit
238
Unit
°C/W
2. Short−circuits can cause excessive heating and destructive dissipation. These values are typical.
Table 3. OPERATING CONDITIONS
Parameter
Operating Supply Voltage
Specified Operating Range
Symbol
V
S
T
A
Limit
2 to 36
−40 to +125
Unit
V
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
TS391, NCV391
Table 4. ELECTRICAL CHARACTERISTICS
(Vs=+5.0 V,
At T
A
= +25°C)
Boldface
limits apply over the specified temperature range, T
A
= –40°C to +125°C.
Parameter
INPUT CHARACTERISTICS
Offset Voltage
V
OS
Vo = 1.4 V, R
S
=
0
W,
V
S
= 5 V to
30 V
V
CM
= 0 to V
CC
−1.5 V
V
CM
= 0 to V
CC
−2 V
25
1
5
9
250
400
Input Offset Current
I
OS
5
50
150
Input Common Mode
Range (Note 3)
Differential Input Voltage
(Note 4)
OUTPUT CHARACTERISTICS
Output Voltage Low
V
OL
V
ID
= 1 V, I
O
= 4 mA
250
400
700
Output Sink Current
Output Leakage Current
I
O
I
OH
V
ID
= −1, V
O
= 1.5 V
V
ID
= 1 V, V
CC
= V
O
= 5 V
V
ID
= 1 V, V
CC
= V
O
= 30 V
DYNAMIC PERFORMANCE
Open Loop Voltage Gain
Propagation Delay L−H
A
VOL
t
PLH
V
CC
= 15 V, R
PU
= 15 kW
5 mV overdrive, R
PU
= 5.1 kW
20 mV overdrive, R
PU
= 5.1 kW
100 mV overdrive, R
PU
= 5.1 kW
TTL Input, Vref = +1.4 V,
R
PU
= 5.1 kW
Propagation Delay H−L
t
PHL
5 mV overdrive, R
PU
= 5.1 kW
20 mV overdrive, R
PU
= 5.1 kW
100 mV overdrive, R
PU
= 5.1 kW
TTL Input, Vref = +1.4 V,
R
PU
= 5.1 kW
POWER SUPPLY
Quiescent Current
I
CC
V
CC
= 5 V
V
CC
= 30 V
0.5
0.5
−
1.25
mA
mA
94
106
850
490
300
220
620
400
250
350
dB
ns
ns
ns
ns
ns
ns
ns
ns
6
16
0.1
1
mV
mV
mA
nA
mA
V
ICR
0
0
V
ID
V
CC
– 1.5
V
CC
– 2
V
CC
mV
mV
nA
nA
nA
nA
V
V
V
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Bias Current
I
IB
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. The input common mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of the common
mode voltage range is VCC – 1.5 V, but either or both inputs can go to +30 V without damage.
4. Positive excursions of the input voltage may exceed the power supply level. As long as the other voltage remains within the common mode
range, the comparator will provide a proper output stage. The low input voltage state must not be less than 0.3 V below the negative supply
rail.
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3
TS391, NCV391
TYPICAL CHARACTERISTICS
1000
INPUT BIAS CURRENT (nA)
900
SUPPLY CURRENT (mA)
800
700
600
500
400
125°C
300
200
0
5
10
15
20
25
30
35
40
SUPPLY VOLTAGE (V)
−55°C
0°C
25°C
70°C
30
0°C
−55°C
20
25°C
70°C
125°C
10
0
0
5
10
15
20
V
CC
(V)
25
30
V
IN
= 0 V
35
40
Figure 1. Supply Current vs. Supply Voltage
10
LOW LEVEL OUTPUT VOLTAGE (V)
Figure 2. Input Bias Current vs. V
CC
1
125°C
0.1
25°C
−55°C
100 mV
20 mV
5 mV
0.01
Input
0.001
0.01
0.1
1
10
100
TIME (200 ns/div)
LOW LEVEL OUTPUT CURRENT (mA)
Figure 3. Low Level Output Voltage vs. Output
Current
Figure 4. Propagation Delay L−H vs. Overdrive
V
S
= 5 V
R
PU
= 5.1 kW
C
L
= 20 pF
T
A
= 25°C
100 mV
20 mV
5 mV
Input
TIME (100 ns/div)
Figure 5. Propagation Delay H−L vs. Overdrive
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4
OUTPUT VOLTAGE (500 mV/div)
INPUT VOLTAGE (100 mV/div)
OUTPUT VOLTAGE (500 mV/div)
INPUT VOLTAGE (100 mV/div)
V
S
= 5 V
R
PU
= 5.1 kW
C
L
= 20 pF
T
A
= 25°C
TS391, NCV391
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
NOTE 5
2X
D
5X
0.20 C A B
M
0.10 T
5
1
2
4
3
2X
0.20 T
B
B
S
K
DETAIL Z
G
A
A
TOP VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
A
B
C
D
G
H
J
K
M
S
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0
_
10
_
2.50
3.00
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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