NCV7513A
FLEXMOSt Hex Low-Side
MOSFET Pre-Driver
The NCV7513A programmable six channel low−side MOSFET
pre−driver is one of a family of FLEXMOS
TM
automotive grade
products for driving logic−level MOSFETs. The product is
controllable by a combination of serial SPI and parallel inputs. It
features programmable fault management modes and allows
power−limiting PWM operation with programmable refresh time.
The device offers 3.3 V/5.0 V compatible inputs and the serial output
driver can be powered from either 3.3 V or 5.0 V. Power−on reset
provides controlled powerup and two enable inputs allow all outputs
to be simultaneously disabled.
Each channel independently monitors its external MOSFET’s
drain voltage for fault conditions. Shorted load fault detection
thresholds are fully programmable using an externally programmed
reference voltage and a combination of four discrete internal ratio
values. The ratio values are SPI selectable and allow different
detection thresholds for each group of three output channels.
Fault information for each channel is 2−bit encoded by fault type
and is available through SPI communication. Fault recovery
operation for each channel is programmable and may be selected for
latch−off or automatic retry.
The FLEXMOS family of products offers application scalability
through choice of external MOSFETs.
Features
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MARKING
DIAGRAM
32 LEAD LQFP
FT SUFFIX
CASE 873A
NCV7513A
AWLYYWWG
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
NCV7513AFTG
Package
LQFP
(Pb−Free)
Shipping†
250 Units/Tray
•
•
•
•
•
•
•
•
•
•
•
16−Bit SPI with Frame Error Detection
3.3 V/5.0 V Compatible Parallel and Serial Control Inputs
3.3 V/5.0 V Compatible Serial Output Driver
Two Enable Inputs
Open−Drain Fault and Status Flags
Programmable
−
Shorted Load Fault Detection Thresholds
−
Fault Recovery Mode
−
Fault Retry Timer
−
Flag Masking
Load Diagnostics with Latched Unique Fault Type Data
−
Shorted Load
−
Open Load
−
Short to GND
AEC Qualified
PPAP Capable
NCV Prefix for Automotive and Other Applications Requiring Site
and Change Controls
These are Pb−Free Devices*
NCV7513AFTR2G
LQFP
2000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Benefits
•
Scalable to Load by Choice of External MOSFET
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2009
March, 2009
−
Rev. 1
1
Publication Order Number:
NCV7513A/D
NCV7513A
IN5 IN4 IN3 IN2 IN1 IN0
ENA2
VCC2
NCV7513A
Hex MOSFET Pre−Driver
VCC1
POWER ON RESET
&
POR
BIAS
CHANNEL 0
FAULT
DETECT
V
SS
VCC2
DRN0
ENA1
GATE SELECT
FLAG MASK
DISABLE MODE
REFRESH/REF
ENA ENA VCC2
DRN
1
2
REF
DISABLE
PARALLEL
SERIAL
IREF
ENA ENA VCC2
DRN
1
2
REF
DISABLE
PARALLEL
SERIAL
DRIVER
GAT0
V
SS
CHANNEL 1
DRN1
CSB
SCLK
SI
VDD
SO
VCC
POR
CSB
SCLK
SI
6
VSS
GAT1
DRN2
CHANNEL 2
16 BIT
SPI
IREF
ENA ENA VCC2
DRN
1
2
REF
DISABLE
PARALLEL
SERIAL
VSS
GAT2
DRN3
CHANNEL 3
DRIVER
SO
ENA ENA VCC2
1
2
REF
DISABLE
PARALLEL
SERIAL
DRN
12
IREF
VSS
GAT3
DRN4
V
SS
CHANNEL 4
FAULT BITS
FLTB
FAULT LOGIC
&
REFRESH TIMER
ENA1
ENA ENA VCC2
DRN
1
2
REF
DISABLE
PARALLEL
SERIAL
IREF
VSS
GAT4
DRN5
CHANNEL 5
2
GND
CLOCK
ENA
1
IREF
VSS
GAT5
VSS
4
FLTREF
+
FAULT
REFERENCE
GENERATOR
CH
0−2
CH
3−5
DRN 0:5
MASK 0:5
POR
DRAIN
FEEDBACK
MONITOR
STAB
−
OA
Figure 1. Block Diagram
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2
NCV7513A
28W
28W
14W
M
+5V
POWER−ON
RESET
RX1
R
FILT
+5V OR
+3.3V
CB1
VCC1
FLTREF
ENA1
VCC2
DRN0
GAT0
DRN1
GAT1
DRN2
R
D2
NID9N05CL
R
D1
NID9N05CL
R
D0
NID9N05CL
RST
RX2
ENA2
IN0
IN1
IN2
IN3
HOST CONTROLLER
PARALLEL
NCV7513A
GAT2
DRN3
GAT3
DRN4
GAT4
DRN5
GAT5
VDD
SO
VSS
R
D5
R
D4
R
D3
UNCLAMPED LOAD
CB2
NID9N05CL
NID9N05CL
NID9N05CL
V
LOAD
SPI
IN4
IN5
FLTB
CSB
SCLK
IRQ
I/O
R
FPU
SI
STAB
R
SPU
GND
Figure 2. Application Diagram
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3
14W
5W
NCV7513A
PIN FUNCTION DESCRIPTION
Symbol
FLTREF
DRN0 – DRN5
GAT0 – GAT5
ENA1, ENA2
IN0 – IN5
CSB
SCLK
SI
SO
STAB
FLTB
VCC1
GND
VCC2
VDD
VSS
Description
Analog Fault Detect Threshold: 5.0 V Compliant
Analog Drain Feedback: Internally Clamped
Analog Gate Drive: 5.0 V Compliant
Digital Master Enable Inputs: 3.3 V/5.0 V (TTL) Compatible
Digital Parallel Input: 3.3 V/5.0 V (TTL) Compatible
Digital Chip Select Input: 3.3 V/5.0 V (TTL) Compatible
Digital Shift Clock Input: 3.3 V/5.0 V (TTL) Compatible
Digital Serial Data Input: 3.3 V/5.0 V (TTL) Compatible
Digital Serial Data Output: 3.3 V/5.0 V Compliant
Digital Open−Drain Output: 3.3 V/5.0 V Compliant
Digital Open−Drain Output: 3.3 V/5.0 V Compliant
Power Supply
−
Low Power Path
Power Return
−
Low Power Path – Device Substrate
Power Supply
−
Gate Drivers
Power Supply
−
Serial Output Driver
Power Return – VCC2, VDD, Drain Clamps
DRN2
DRN3
DRN4
DRN5
GAT2
GAT3
GAT4
24 23 22 21 20 19 18 17
GAT1
DRN1
GAT0
DRN0
VCC2
VCC1
FLTREF
GND
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
16
15
14
VSS
STAB
VDD
SO
SI
SCLK
CSB
FLTB
GAT5
13
12
11
10
9
ENA1
NCV7513A
IN0
IN1
IN2
IN3
IN4
IN5
Figure 3. 32 Pin LQFP Pinout (Top View)
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4
ENA2
NCV7513A
MAXIMUM RATINGS
(Voltages are with respect to device substrate.)
Rating
DC Supply (V
CC1
, V
CC2
, V
DD
)
Difference Between V
CC1
and V
CC2
Difference Between GND (Substrate) and V
SS
Output Voltage (Any Output)
Drain Feedback Clamp Voltage (Note 1)
Drain Feedback Clamp Current (Note 1)
Input Voltage (Any Input)
Junction Temperature, T
J
Storage Temperature, T
STG
Peak Reflow Soldering Temperature: Lead−Free
60 to 150 seconds at 217°C (Note 2)
Value
−0.3
to 6.5
"0.3
"0.3
−0.3
to 6.5
−0.3
to 40
10
−0.3
to 6.5
−40
to 150
−65
to 150
260 peak
Unit
V
V
V
V
V
mA
V
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ATTRIBUTES
Characteristic
ESD Capability
Human Body Model
Machine Model
Moisture Sensitivity (Note 2)
Package Thermal Resistance (Note 3)
Junction–to–Ambient, R
qJA
Junction–to–Pin, R
YJL
Value
w "
2.0 kV
w "
200 V
MSL3
86.0
°C/W
58.5
°C/W
1. An external series resistor must be connected between the MOSFET drain and the feedback input in the application. Total clamp power
dissipation is limited by the maximum junction temperature, the application environment temperature, and the package thermal resistances.
2. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and
Application Note AND8003/D.
3. Values represent still air steady−state thermal performance on a 4 layer (42 x 42 x 1.5 mm) PCB with 1 oz. copper on an FR4 substrate, using
a minimum width signal trace pattern (384 mm
2
trace area).
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC1
V
CC2
V
DD
V
IN
High
V
IN
Low
T
A
Main Power Supply Voltage
Gate Drivers Power Supply Voltage
Serial Output Driver Power Supply Voltage
Logic High Input Voltage
Logic Low Input Voltage
Ambient Still−Air Operating Temperature
Parameter
Min
4.75
V
CC1
−
0.3
3.0
2.0
0
−40
Max
5.25
V
CC1
+ 0.3
V
CC1
V
CC1
0.8
125
Unit
V
V
V
V
V
°C
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