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NG7-2512SB1500G

Fixed Resistor, Metal Glaze/thick Film, 120W, 150ohm, 2% +/-Tol, 2512,

器件类别:无源元件    电阻器   

厂商名称:International Manufacturing Services Inc

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
International Manufacturing Services Inc
Reach Compliance Code
compli
其他特性
THE MAXIMUM THICKNESS AVAILABLE FOR SUBSTRATE G IS 0.889
构造
Chi
JESD-609代码
e4
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
150 °C
最低工作温度
-55 °C
封装高度
0.635 mm
封装长度
6.35 mm
封装形式
SMT
封装宽度
3.048 mm
包装方法
BULK; TR
额定功率耗散 (P)
120 W
额定温度
100 °C
电阻
150 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
2512
表面贴装
YES
技术
METAL GLAZE/THICK FILM
端子面层
Gold (Au)
端子形状
ONE SURFACE
容差
2%
文档预览
0505
1005
0805
1206
N-
Series
2010
2525
2512
3725
Thick Film High Power Chip
Resistors and Terminations
on Aluminum Nitride
The
ims
N-Series thick film high power chip resistors and chip terminations on
aluminum nitride are ideal for most applications requiring high thermal conductivity in
a small size package. AlN is an ideal replacement for BeO with it’s high power
dissipation and no enviromental or health hazards. Thick film technology provides a
stable resistive element at a very affordable price. These chips feature the following:
• High stability thick film resistive element
• AlN substrate material
• Operating temperature: -55°C to +155°C
• Available in bulk or tape and reel*
*Consult factory
Terminal materials:
Terminal styles
epoxy or solder attachment
for bonding
solder attachment
Features
Very high power
dissipation
Thick film technology
AlN substrate material
Resistance values from
10 ohms to 2 Kohms†
Standard tolerance 5%
Tight TCRs
SG - Single wrap
with groundplane
WA-
Full wraparound
solder attachment
Rated Power
Thickness
Baseplate
Temp
0505
0805
CASE SIZE
1005
1206
2010
2512
2525
3725
N/A
N/A
0.015” “D”
50°C
30W
50W
60W
105W
150W
70°C
100°C
16W
50°C
70°C
16W
100°C
10W
16W
50°C
N/A
N/A
N/A
N/A
60W
70W
150W
0.040” “T”
70°C 100°C
N/A
N/A
N/A
N/A
48W
60W
N/A
N/A
N/A
N/A
30W
38W
75W
37W
48W
85W
150W
N/A
N/A
30W
55W
75W
100W
N/A
N/A
30W
40W
70W
90W
30W
55W
75W
100W
190W
380W
310W
35W
48W
60W
A Word About Thermal Management
temperature of the chip is maintained at or below the values identified in the above table
and the maximum film temperature did not exceed 150°C. The data also shows that the
ratio of temperature rise versus power applied increases with increasing chip size (for a
given thickness) so the above criteria should be carefully considered when operating
host of circuit dependent parameters.
International
Manufacturing
Services, Inc.
Tel (401) 683-9700
Fax (401) 683-5571
e-mail: ims@ims-resistors.com
http://www.ims-resistors.com
Dimensions
Case
Length
Width
Height
Height
Height
Option ‘D’ Option ‘G’ Option ‘T’
N/A
N/A
N/A
N/A
dissipation needs
Power chart on
reverse) and
N/A
N/A
Additional options available. Please contact factory.
For detailed dimensional information, outline drawing is available from factory.
SS Style (SB with backplane)
H
W
WA Style
W
Choose the
height option
H
L
L
Termination Style Availability
0505
0805
1005
1206
2010
2512
2525
3725
WA
SS
SB
SG
CS
N/A
N/A
EW
N/A
DE
N/A
N/A
ZG
N/A
N/A
N/A
N/A
H
W
L
EW Style
W
• Indicates Availablitiy
H
L
Ordering Information
PtAg terminations
W
DE Style
H
L
CS Style
esistance v
W
3 - PtAg
3
P - PtAg w/ Sn96 Solder
Case Size
first three digits are
significant va es. e f rth
is the
er of zeroes
following.
e indicates a
decimal point for resistance
val
less than
Style
WA
SS
H
L
ZG Style
W
SB
EW
CS
ZG
DE
SG
H
L
SG Style
International
Manufacturing
Services, Inc.
e-mail: ims@ims-resistors.com
http://www.ims-resistors.com
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