Multi-Protocol PBGA Mil- Std- Data Bus Interface
Model #
NHi-156XXPBGA
The NHi PBGA family of Mil-Std-1553
terminals address the requirements for
small, cost effective, reliable terminals
suitable for critical military applications.
NHi has solved the critical problem of
solder shorts between balls by providing
oversized solder balls with a generous
pitch. The PBGA family is designed as
an autonomous interface between a
host processor and the terminal that
unburdens the CPU. The ET versions
function as a programmable BC/RT/MT
or simultaneous MT/RT. The RT devices
operate as Remote Terminal only.
FEATURES
•
Dimensions: 0.75 x 0.75 Inch
•
Footprint Less Than 0.6 Square Inch
•
81 Over-Sized Balls with Large Pitch
Eliminates Solder Shorting
•
Solder Alloy: 63/37 or ROHS 95/5
•
+3.3V or +5V NHi Monolithic Transceivers
•
+3.3V Logic
•
Low Power CMOS Technology
•
Multi-Protocol Interface
•
PCI Bus or Local Bus Subsystem Interface
•
20 Mhz Clock
•
Dual Port Double Buffered 64K x 16 SRAM
•
BC-RT-MT-MT/RT Terminals
•
RT Only Terminals
ISO 9001 : 2000 Certified
NHI - 15650ETPBGA COMMERCIAL
PLASTIC BALL GRID ARRAY PACKAGE
Notes:
1. Solder Ball Alloy: 63/37 Sn/Pb
•
2. Ball Coplanarity: 0.006
Local Bus Terminal Block Diagram
Page 2
Multi-Protocol PBGA
NHi-156XXPBGA
www.nationalhybrid.com
PCI Bus Terminal Block Diagram
Remote Terminal Message Map
Page 3
Multi-Protocol PBGA
NHi-156XXPBGA
www.nationalhybrid.com
Bus Controller Message Map
Bus Monitor Message Map
Page 4
Multi-Protocol PBGA
NHi-156XXPBGA
www.nationalhybrid.com
SPECIFICATIONS
PARAMETER
Power Supply Requirements
3.3V Logic
5V Transceiver
3.3V Transceiver
Current Requirements
5V Transceiver
3.3V Transceiver
3.3V Logic/RAM
Logic I/O
V
IL
V
IH
V
OL
V
OH
PCI
Clock
20
Thermal
Resistance, Junction to Case
Case Operating
Case Storage
Soldering
MHz
MIN
3.0
4.7
3.15
MAX
3.6
5.5
3.45
UNITS
V
V
V
Idle
100%
Idle
100%
27
465
23
700
8
38
625
33
900
20
mA
mA
mA
-0.3
2.0
2.4
0.8
3.6
0.4
3.3V signaling only
V
V
V
V
Industrial
/T
Sn/Pb
ROHS
-40
-55
-65
6
+85
+125
+150
225 +0/-5
250
°C/W
°C
°C
°C
°C
°C
Package
81-ball PBGA
0.75 x 0.75 x 0.120
19 x 19 x 3.0
0.0705
2.0
Ultralam PTFE/Woven
2000
Glass
63/37
Sn/Pb
96.5/3.0/0.5 Sn/Ag/Cu
3
inches
mm
oz
gm
SubstrateComposition
Solder Alloy
JEDEC Moisture Sensitivity Level
Leaded
ROHS
SAC305
Page 5
Multi-Protocol PBGA
NHi-156XXPBGA
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