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NL17SZ02DFT2

Logic Gates 1.65-5.5V Single

器件类别:逻辑    逻辑   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
SOT-353
包装说明
TSSOP, TSSOP5/6,.08
针数
5
Reach Compliance Code
not_compliant
Factory Lead Time
1 week
系列
17SZ
JESD-30 代码
R-PDSO-G5
JESD-609代码
e0
长度
2 mm
负载电容(CL)
50 pF
逻辑集成电路类型
NOR GATE
最大I(ol)
0.024 A
湿度敏感等级
1
功能数量
1
输入次数
2
端子数量
5
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP5/6,.08
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法
TAPE AND REEL
峰值回流温度(摄氏度)
240
电源
3.3 V
Prop。Delay @ Nom-Sup
5.2 ns
传播延迟(tpd)
12 ns
认证状态
Not Qualified
施密特触发器
NO
座面最大高度
1.1 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
1.65 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
1.25 mm
Base Number Matches
1
文档预览
NL17SZ02
2-Input NOR Gate
The NL17SZ02 is a single 2−input NOR Gate in three tiny footprint
packages. The device performs much as LCX multi−gate products in
speed and drive.
Features
Tiny SOT−353, SOT−553 and SOT−953 Packages
2.4 ns T
PD
at 5 V (typ)
Source/Sink 24 mA at 3.0 V
Over−V
oltage Tolerant Inputs
Pin For Pin with NC7SZ02P5X, TC7SZ02FU and TC7SZ02AFE
Chip Complexity: FETs = 20
Designed for 1.65 V to 5.5 V V
CC
Operation
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
MARKING
DIAGRAMS
L3 MG
G
5
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
L3
M
G
= Specific Device Marking
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5
5
L3 M
1
A
1
B
2
GND
3
V
CC
5
IN A
1
GND
2
V
CC
5
1
SOT−553
XV5 SUFFIX
CASE 463B
L3
M
= Specific Device Marking
= Date Code
Y
4
IN B
3
SOT−953
OUT Y
4
5
M
SOT−953
CASE 527AE
5M
1
SOT−353/SC70−5/
SC−88A/SOT−553
= Specific Device Code
= Month Code
Figure 1. Pinout
(Top View)
A
B
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
w1
Y
Figure 2. Logic Symbol
©
Semiconductor Components Industries, LLC, 2013
June, 2013
Rev. 7
1
Publication Order Number:
NL17SZ02/D
NL17SZ02
PIN ASSIGNMENT
(SOT−353/SC70−5/SC−88A/SOT−553)
Pin
1
2
3
4
5
Function
A
B
GND
Y
V
CC
PIN ASSIGNMENT
(SOT−953)
Pin
1
2
3
4
5
Function
IN A
GND
IN B
OUT Y
V
CC
FUNCTION TABLE
Output
Input
A
L
L
H
H
B
L
H
L
H
Y=A+B
Y
H
L
L
L
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
V
OUT
I
IK
I
OK
I
OK
I
OUT
I
CC
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages)
DC Output Voltage
(SOT−953 Package)
DC Input Diode Current
DC Output Diode Current
(SOT−353/SC70−5/SC−88A/SOT−553 Packages)
DC Output Diode Current (SOT−953 Package)
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Classification
Oxygen Index: 28 to 34
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
SOT−353 (Note 1)
SOT−553
SOT−353
SOT−553
V
OUT
< GND, V
OUT
> V
CC
V
OUT
< GND
Output at High or Low State
Power−Down Mode (V
CC
= 0 V)
Parameter
Value
−0.5
to
)7.0
−0.5
to
)7.0
−0.5
to V
CC
+ 0.5
−0.5
to V
CC
+ 0.5
−0.5
to + 0.5
−50
±50
−50
±50
±100
−65
to
)150
260
+150
350
496
186
135
Level 1
UL 94 V−0 @ 0.125 in
Class Z
Class A
N/A
±100
mA
Unit
V
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
http://onsemi.com
2
NL17SZ02
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
V
OUT
T
A
t
r
, t
f
DC Supply Voltage
DC Input Voltage
DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages)
DC Output Voltage (SOT−953 Package)
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 3.0 V
$0.3
V
V
CC
= 5.0 V
$0.5
V
Parameter
Min
1.65
0
0
0
−55
0
0
Max
5.5
5.5
5.5
V
CC
+125
100
20
Unit
V
V
V
V
°C
ns/V
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH
Parameter
High−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
V
IN
= V
IL
or V
IH
I
OH
=
−100
mA
I
OH
=
−3
mA
I
OH
=
−8
mA
I
OH
=
−12
mA
I
OH
=
−16
mA
I
OH
=
−24
mA
I
OH
=
−32
mA
I
OL
= 100
mA
I
OL
= 3 mA
I
OL
= 8 mA
I
OL
= 12 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
V
IN
= 5.5 V or GND
V
IN
= 5.5 V or
V
OUT
= 5.5 V
Condition
V
CC
(V)
1.65 to 1.95
2.3 to 5.5
1.65 to 1.95
2.3 to 5.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
0 to 5.5
0
V
CC
0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
CC
1.52
2.1
2.4
2.7
2.5
4.0
0.08
0.20
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
$0.1
1
T
A
= 255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
V
CC
0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.1
0.24
0.3
0.4
0.4
0.55
0.55
$1.0
10
Typ
Max
−555C
v
T
A
v
1255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
Max
Unit
V
V
V
V
OL
Low−Level Output
Voltage
V
IN
= V
IH
or V
OH
V
I
IN
I
OFF
Input Leakage Current
Power Off Leakage
Current (SOT−353/
SC70−5/SC−88A/
SOT−553 Packages)
Quiescent Supply
Current
mA
mA
I
CC
V
IN
= 5.5 V or GND
5.5
1
10
mA
AC ELECTRICAL CHARACTERISTICS
t
R
= t
F
= 3.0 ns
V
CC
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay
(Figure 3 and 4)
Condition
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
5.0
$
0.5
(V)
1.65
1.8
2.5
$
0.2
3.3
$
0.3
Min
2.0
2.0
0.8
0.5
1.5
0.5
0.8
T
A
= 255C
Typ
5.3
4.4
2.9
2.3
2.9
1.9
2.4
Max
11.5
9.5
6.5
4.5
5.0
3.9
4.3
−555C
v
T
A
v
1255C
Min
2.0
2.0
0.8
0.5
1.5
0.5
0.8
Max
12.0
10.0
7.0
4.7
5.2
4.1
4.5
Unit
ns
http://onsemi.com
3
NL17SZ02
CAPACITIVE CHARACTERISTICS
Symbol
C
IN
C
PD
Input Capacitance
Power Dissipation Capacitance
(Note 6)
Parameter
Condition
V
CC
= 5.5 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
Typical
u4
25
30
Unit
pF
pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD

V
CC

f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD

V
CC2

f
in
+ I
CC

V
CC
.
t
f
= 3 ns
90%
50%
10%
90%
50%
t
f
= 3 ns
V
CC
INPUT
R
L
V
OH
C
L
INPUT
A and B
10%
GND
OUTPUT
t
PHL
t
PLH
OUTPUT Y
50%
50%
V
OL
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 3. Switching Waveform
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NL17SZ02DFT2G
NLV17SZ02DFT2G*
NL17SZ02XV5T2G
NL17SZ02P5T5G
Package
SC−88A/SOT−353/SC−70−5
(Pb−Free)
SC−88A/SOT−353/SC−70−5
(Pb−Free)
SOT−553
(Pb−Free)
SOT−953
(Pb−Free)
Shipping
3000 / Tape & Reel
3000 / Tape & Reel
4000 / Tape & Reel
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
http://onsemi.com
4
NL17SZ02
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
---
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
---
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
5
4
S
1
2
3
−B−
D
5 PL
0.2 (0.008)
M
B
M
N
J
C
DIM
A
B
C
D
G
H
J
K
N
S
H
K
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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