NLAS3157, NLAS3257
Low Voltage SPDT Mux /
Demux Analog Switch
The NLAS3157 Mux / Demux Analog Switch is an advanced high−
speed single−pole double−throw (SPDT) CMOS switch. It can be used
as an analog switch or as a low−delay bus switch. Break−before−make
switching prevents both switches being enabled simultaneously. This
eliminates signal disruption during switching. The control input, S, is
independent of supply voltage line switch in an ultra−small footprint.
Features
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MARKING
DIAGRAMS
Y
A = B0
A = B1
ULLGA6
1.0 x 1.0
CASE 613AD
Y
M
= Specific Device Code
= Date Code
XLLGA6
1.0 x 1.0
CASE 713AD
L
M
= Specific Device Code
= Date Code
M
•
•
•
•
•
•
High Speed: t
PD
= 0.25 ns (Max) @ V
CC
= 4.5 V
R
ON
: 8.5
W
Typ @ V
CC
= 4.2 V
C
ON
: 7.5 pF Typ @ V
CC
= 3.3 V
V
CC
Range: 1.65 V to 4.5 V
Ultra−Small 1 x 1 mm Package
This Device is Pb−Free, Halogen Free/BFR Free and RoHS
Compliant
LM
Typical Applications
•
Mobile Phones, PDAs, Camera
V
CC
B1
A
1
6
S
B1
GND
B0
1
2
3
6
5
4
S
V
CC
A
FUNCTION TABLE
Input S
Function
2
3
5
4
GND
B0
L
H
Figure 1. ULLGA6
(NLAS3157)
(Top View)
Figure 2. XLLGA6
(NLAS3257)
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
A
B0
B1
S
Figure 3. Logic Diagram
©
Semiconductor Components Industries, LLC, 2016
1
May, 2018 − Rev. 3
Publication Order Number:
NLAS3157/D
NLAS3157, NLAS3257
Table 1. MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
IS
I
IK
I
OK
I
O
DC Supply Voltage
Control Input Voltage (S Pin)
Switch Input / Output Voltage (A, BO, B1 Pins)
Control DC Input Diode Current (S Pin)
Switch I/O Port DC Diode Current (A, BO, B1 Pins)
On−State Switch Current
Continuous Current Through V
CC
or GND
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 1)
Power Dissipation in Still Air at 85°C (Note 1)
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
Human Body Mode (Note 2)
Machine Mode (Note 3)
Charged Device Mode (Note 4)
V
IN
< GND
V
I/O
< GND or V
I/O
> V
CC
Parameter
Value
−0.5 to +5.5
−0.5 to +5.5
−0.5 to V
CC
+ 0.5
−50
±50
±128
±150
±150
±150
−65 to +150
260
150
407
1.5
Level 1
UL 94 V−0 @ 0.125 in
>8000
>300
>2000
±100
V
Unit
V
V
V
mA
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 85°C (Note 5)
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/ JESD22−A114−A
3. Tested to EIA/ JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA / JESD78
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
I
V
IS
T
A
Dt
/
DV
Positive DC Supply Voltage
Control Input Voltage (S Pin)
Switch Input / Output Voltage (A, BO, B1 Pins)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
Control Input
Switch I/O
Parameter
Min
1.65
0
0
−40
0
0
Max
4.5
4.5
V
CC
+85
5
DC
Unit
V
V
V
°C
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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NLAS3157, NLAS3257
Table 3. DC ELECTRICAL CHARACTERISTICS
(Typical: T = 25°C, V
CC
= 3.3 V)
−40°C to +85°C
Symbol
V
IH
Parameter
Control Input,
HIGH Voltage
Test Conditions
V
CC
(V)
1.65
2.7
3.3
4.2
1.65
2.7
3.3
4.2
0
≤
V
IS
≤
V
CC
V
IS
= V
CC
or GND; I
D
= 0 A
V
IS
= 1.65 V to 4.5 V
V
IS
= 1.65 V to 4.5 V
1.65 − 4.5
1.65 − 4.5
4.5
4.5
±10
±10
Min
0.75
1.25
1.52
1.94
0.25
0.4
0.4
0.5
±1.0
1.0
±100
±100
Typ
Max
Unit
V
V
IL
Control Input,
LOW Voltage
V
I
IN
I
CC
I
NC (OFF)
I
NO (OFF)
I
COM (ON)
Control Input,
Leakage Current
Quiescent Supply Current
NC or NO Leakage Current
COM ON Leakage Current
mA
mA
nA
nA
ON RESISTANCE (Typical: T = 255C)
R
ON
Peak On−Resistance
I
ON
= 8 mA
V
IS
= 0 V to V
CC
1.65
2.7
3.3
4.2
1.65
2.7
3.3
4.2
1.65
2.7
3.3
4.2
15.4
10.8
9.5
8.5
5.5
2.9
2.7
2.8
0.3
0.3
0.3
0.3
23.2
12.4
11.0
9.9
10.2
3.3
3.3
3.3
0.35
0.35
0.35
0.35
W
R
FLAT
On−Resistance Flatness
I
ON
= 8 mA
V
IS
= 0 V to V
CC
W
DR
ON
Delta On−Resistance
I
ON
= 8 mA
V
IS
= 0 V to V
CC
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. AC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
Parameter
Test Conditions
V
CC
(V)
Min
Typ
Max
Unit
TIMING/FREQUENCY (Typical: T = 255C, V
CC
= 3.3 V, R
L
= 50
W,
C
L
= 35 pF, f = 1 MHz)
t
PD
t
ON
t
OFF
T
BBM
BW
Propagation Delay, A to
Bn or Bn to A
Turn−ON Time
Turn−OFF Time
Break−Before−Make
Time
−3 dB Bandwidth
(See Figures 4 and 5)
(See Figures 7 and 8)
(See Figures 7 and 8)
(See Figure 6)
C
L
= 5 pF
1.65 − 4.5
1.65 − 4.5
1.65 − 4.5
1.65 − 4.5
1.65 − 4.5
3.1
3.4
2.0
1000
13.0
12.0
0.25
30.0
25.0
ns
ns
ns
ns
MHz
ISOLATION (Typical: T = 255C, V
CC
= 3.3 V, R
L
= 50
W,
C
L
= 5 pF)
O
IRR
X
TALK
OFF−Isolation
Non−Adjacent Channel
Crosstalk
f = 240 MHz (See Figure 9)
f = 240 MHz
1.65 − 4.5
1.65 − 4.5
-21
-21
dB
dB
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NLAS3157, NLAS3257
Table 4. AC ELECTRICAL CHARACTERISTICS
CAPACITANCE (Typical: T = 255C)
C
IN
Control Pin
Input Capacitance
ON Capacitance
V
CC
= 0 V, f = 1 MHz
V
CC
= 0 V, f = 10 MHz
V
CC
= 3.3 V; OE = 0 V, S = 0 V or 3.3 V, f = 1 MHz
V
CC
= 3.3 V; OE = 0 V, S = 0 V or 3.3 V, f = 10 MHz
C
OFF
OFF Capacitance
V
CC
= V
IS
= 3.3 V; OE = 0 V,
S = 3.3 V or 0 V, f = 1 MHz
V
CC
= V
IS
= 3.3 V; OE = 0 V,
S = 3.3 V or 0 V, f = 10 MHz
V
CC
Input A
50%
t
PLH
Output Y
50%
GND
t
PHL
V
OH
50% V
CC
V
OL
1.5
1.0
7.5
6.5
3.8
2.0
pF
C
ON
Figure 4. Propagation Delay Waveforms
V
CC
PULSE
GENERATOR
R
T
DUT
C
L
R
L
R
T
= Z
OUT
of pulse generator (typically 50
W)
Figure 5. Propagation Delay Test Circuit
Figure 6. t
BBM
(Time Break−Before−Make)
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NLAS3157, NLAS3257
Figure 7. t
ON
/ t
OFF
Figure 8. t
ON
/ t
OFF
Figure 9. Off Channel Isolation / On Channel Loss (BW)/Crosstalk (On Channel to Off Channel) / V
ONL
ORDERING INFORMATION
Device
NLAS3157MX3TCG
NLAS3257CMX2TCG
NLAS3257CMX3TCG
Package
ULLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
XLLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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